South East Asia NOR Flash Market Size and Share
South East Asia NOR Flash Market Analysis by Mordor Intelligence
The South East Asia NOR Flash Market size is estimated at USD 90.82 million in 2025, and is expected to reach USD 124.07 million by 2030, at a CAGR of 6.43% during the forecast period. Capacity expansions in Vietnam and the Philippines, rising automotive-electronics content, and widening 5G rollouts are lifting the annual shipments of NOR Flash devices in the region [1] SEMI, “SEMIExpo Vietnam—Elevating Vietnam to the Global Semiconductor Supply Chain,” semi.org . Regional governments are accelerating this growth by courting semiconductor investments, while local assemblers move up the value chain into test and packaging for higher-density parts. At the same time, Chinese vendors are pressuring prices, prompting Southeast Asian suppliers to pivot toward premium industrial and automotive applications. Supply-chain resilience, bolstered by new Thai and Malaysian back-end fabs, is gradually easing the region’s historic reliance on offshore foundries.
Key Report Takeaways
- By type, Serial NOR led with 78.4% revenue share in 2024, while Parallel NOR is set to expand at a 7.1% CAGR to 2030.
- By interface, Quad SPI held a 43.7% share in 2024; Octal/xSPI is forecast to grow at a 6.9% CAGR through 2030.
- By density, the 32 Megabit And Less (greater than 16mb) NOR class captured 36.6% of the Southeast Asia NOR flash market size in 2024; the greater than 256 Mb tier is projected to climb at 6.6% CAGR between 2025-2030.
- By voltage, the 1.8 V class commanded a 52.3% share in 2024, whereas Others (1.2V Class (and similar sub-1.8V)) devices are the fastest risers at 6.8% CAGR.
- By end-user, the Industrial segment accounted for 31.6% of Southeast Asia NOR flash market share in 2024; Automotive will be the quickest-growing vertical at 7.2% CAGR to 2030.
- By process technology node, 55 nm (incl. 58 nm) captured 39.5% share in 2024; 28 nm and below nodes are the fastest-growing at a 6.8% CAGR.
- By packaging type, QFN/SOIC controlled 50.3% share in 2024; WLCSP/CSP is the fastest-expanding category at 6.7% CAGR.
- Vietnam held 28.5% regional share in 2024; the Philippines is the fastest-growing geography with a 6.5% CAGR outlook.
South East Asia NOR Flash Market Trends and Insights
Drivers Impact Analysis
| Driver | % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Government-Led Incentives Driving Expansion in Electronics Manufacturing | +2.10% | Malaysia, Vietnam, Philippines, Thailand | Medium term (2-4 years) |
| Formation and Growth of Automotive Electronics Clusters in the Region | +2.50% | Thailand, Vietnam, Malaysia | Long term (≥ 4 years) |
| Rising Trend of Outsourcing in Wearable and Point-of-Care Device Manufacturing | +1.30% | Vietnam, Philippines, Indonesia | Medium term (2-4 years) |
| Accelerated Deployment of 5G and Fiber-to-the-Home (FTTH) Network Infrastructure | +1.10% | Philippines, Indonesia, Malaysia | Short term (≤ 2 years) |
| Source: Mordor Intelligence | |||
Government-Led Incentives Driving Expansion in Electronics Manufacturing
Malaysia’s National Semiconductor Strategy targets USD 100 billion in design-to-fab investment by 2030, offering tax holidays and import-duty exemptions that lower entry barriers for memory producers [2] Semiconductor Industry Association, “Emerging Resilience in the Semiconductor Supply Chain,” semiconductors.org . Vietnam is matching fiscal incentives with a commitment to train 50,000 chip engineers, creating a talent pipeline that shortens ramp-up time for new NOR Flash lines. Thailand’s Board of Investment package has already secured a new backend facility scheduled for early 2026 [3] Infineon Technologies AG, “Optimizes and Diversifies Its Manufacturing Footprint,” infineon.com . Together, these programs create a medium-term uplift by expanding cleanroom space, easing capital costs, and widening the skilled-labor pool.
Formation and Growth of Automotive Electronics Clusters in the Region
Thailand’s 30@30 policy, 30% zero-emission vehicle output by 2030, has spawned electronics hubs demanding high-reliability NOR Flash for battery management and ADAS units. Average NOR content per vehicle is rising from 44 MB in 2025 to a forecast 71 MB by 2030, supporting a positive long-term trajectory for the Southeast Asia NOR flash market. Malaysia and Vietnam are adopting similar incentives, and local tier-1 suppliers are qualifying AEC-Q100 parts from regional fabs, cementing NOR Flash’s role in drivetrain and infotainment subsystems.
Rising Trend of Outsourcing in Wearable and Point-of-Care Device Manufacturing
Healthcare OEMs are relocating production to Vietnam and the Philippines to tap labor cost advantages and favorable tax structures. Multi-sensor platforms such as HealthTracker use embedded NOR Flash to store biometric firmware and patient logs[4] NIST, “Internet of Things Advisory Board Report,” nist.gov . Contract manufacturers are therefore sourcing low-power 1.2 V devices to extend battery life, creating a mid-term stimulus for the Southeast Asia NOR flash market.
Accelerated Deployment of 5G and Fiber-to-the-Home (FTTH) Network Infrastructure
The Philippines’ National Broadband Plan and Indonesia’s Palapa Ring projects are driving steep orders for NOR Flash used in optical-line terminals, ONTs, and 5G base stations [5] Ookla, “Fiber in the Philippines Is Improving,” ookla.com . Fast-track rollouts translate into immediate demand as every radio unit requires secure-boot code storage. The short-term boost is reinforced by carrier-grade temperature requirements that favor industrial-grade parts.
Restraints Impact Analysis
| Restraint | % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Heavy Dependence on Foundries Located Outside South East Asia | -1.60% | Vietnam, Philippines, Malaysia | Long term (≥ 4 years) |
| Intensified Margin Pressures from Cost-Competitive Chinese Vendors | -1.30% | All Southeast Asian countries | Medium term (2-4 years) |
| Increased Adoption of Emerging Alternative Non-Volatile Memory (NVM) Technologies | -1.00% | Singapore, Malaysia, Thailand | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
Heavy Dependence on Foundries Located Outside South East Asia
Most regional suppliers still tape out wafers at Taiwanese and Korean foundries, exposing them to geopolitical risk and queue-time volatility [6] World Trade Organization, “Global Value Chain Development Report 2023,” wto.org . Long-haul logistics inflate cycle times, and export-control shifts can disrupt 28 nm and smaller nodes that advanced NOR Flash now requires. Governments are funding pilot lines, yet green-field fabs take several years, keeping this drag in place over the long term.
Intensified Margin Pressures from Cost-Competitive Chinese Vendors
China accounts for roughly 40% of planned mature-node capacity additions, creating an oversupply scenario that forces down average selling prices [7] Tim Rühlig, “China’s Legacy Chip Build-out,” ui.se . Heavily subsidized entrants bundle NOR Flash with turnkey modules, squeezing gross margins for local producers unless they pivot to automotive and industrial niches where qualification barriers are higher.
Segment Analysis
By Type: Serial NOR retains a commanding lead
Serial NOR generated 78.4% of 2024 revenue as its simple pin-count and low-power profile align with factory-automation controllers and edge IoT nodes. Parallel NOR benefits from execute-in-place capability valued in real-time automotive control units; as a result, it is growing at a 7.1% CAGR. The Southeast Asia NOR Flash market size for Serial NOR is projected to maintain a high single-digit growth pace, sustained by next-generation MCUs that embed Quad or Octal interfaces. Manufacturers are layering security-boot features onto Serial parts to support over-the-air firmware updates in industrial gateways.
Parallel NORs’ faster access times make it essential where microsecond latency matters. Electric-vehicle power-train modules in Thailand now specify up to 256 Mb Parallel NOR, reflecting the shift toward larger code bases. While capacity additions concentrate on Serial, selective investments in advanced Parallel nodes aim to safeguard niche demand in aerospace and defense gear.
By Interface: Octal and xSPI break performance barriers
Quad SPI owned 43.7% of the 2024 value thanks to its backward compatibility with legacy designs. Yet new ADAS controllers need higher throughput, propelling Octal and xSPI devices toward a stellar 6.9% CAGR. Engineers in Vietnam are already using Octal parts to cut boot times on digital instrument clusters, pointing to wider adoption in connected cars. SPI Single/Dual persists in cost-sensitive wearables where battery life takes priority over bandwidth.
The Southeast Asia NOR Flash market is also witnessing hybrid packages that combine Octal and Quad dies, letting OEMs migrate without full PCB redesigns. Future industrial gateways adopting TSN-Ethernet will likely standardize on xSPI, cementing this interface as a mainstream option before 2030.
By Density: Higher capacities unlock complex software stacks
The 32 Megabit And Less (greater than 16mb) NOR tier captured a 36.6% share in 2024, driven by low-end consumer devices. Mid-range 64–128 Mb densities serve human-machine interfaces and smart meters requiring richer GUIs. Developers are moving toward greater than 256 Mb parts, which will expand at 6.6% CAGR, as over-the-air update payloads and AI edge libraries increase. The Southeast Asia NOR Flash market share for high-density devices is therefore set to double by 2030.
3D NOR innovations from leading suppliers compress cell size without sacrificing endurance, enabling 512 Mb parts suited to centralized domain controllers in vehicles. Rising software complexity across industrial robots and energy-storage systems ensures durable demand for larger dies.
By Voltage: Sub-1.8 V drives power-sensitive innovation
1.8 V devices held a 52.3% share in 2024 because they match mainstream MCU core voltages. The others (1.2V Class (and similar sub-1.8V)), though smaller, will surge at a 6.8% CAGR as wearable and medical developers pursue battery-life gains. Adoption of 1.2 V NOR in smart patches and hearing aids exemplifies this shift. Conversely, 3 V and wide-voltage offerings stay relevant for legacy PLCs and utility meters deployed across harsh grids.
New process nodes lower standby current, positioning sub-1.8 V NOR as the go-to choice for energy-harvesting sensors that populate industrial IoT networks across the Southeast Asia NOR Flash market.
Note: Segment shares of all individual segments available upon report purchase
By End-user Application: Industrial remains the anchor vertical
Industrial automation consumed 31.6% of 2024 revenue, reflecting fast uptake of robotics, machine vision, and predictive-maintenance gateways that rely on high-endurance code storage. Automotive demand is the growth star, advancing at 7.2% CAGR as Thailand, Malaysia, and Vietnam scale EV output.
Consumer electronics still absorb large volumes, yet average densities trend lower than in vehicles or factories. Communications equipment demand is rising again thanks to 5G small-cell deployments, where each remote radio head uses multiple NOR devices for secure boot and configuration backup.
By Process Technology Node: Mature nodes retain scale, advanced nodes gain speed
55 nm (including 58 nm) processes generated the largest slice of revenue in 2024, accounting for 39.5% of South East Asia NOR Flash market share. These nodes balance cost, yield, and reliability, making them ideal for industrial controllers and telecom equipment that dominate regional demand. Availability of established photomask sets and proven design IP further anchors output at these geometries, supporting stable gross margins for local assemblers [8] Winbond Electronics Corporation, “2023 Sustainability Report,” Winbond Electronics Corporation, winbond.com .
Momentum is now shifting toward 28 nm and below, the fastest-growing tier with a projected 6.8% CAGR for 2025-2030. Rising code footprints in ADAS, digital clusters, and AI-enabled IoT gateways require higher densities that advanced nodes deliver within similar die sizes. Foundries in Taiwan and new pilot lines in Malaysia are qualifying automotive-grade flows at 28 nm, giving regional OEMs access to lower-power parts for battery-electric vehicles. The transition also aligns with broader moves to Octal/xSPI interfaces, which benefit from the higher bandwidth achievable on smaller geometry devices.
Note: Segment shares of all individual segments available upon report purchase
By Packaging Type: Lead-frame formats dominate, wafer-level options accelerate
QFN/SOIC packages held 50.3% share in 2024, reflecting their low cost, robust mechanical protection, and compatibility with automated surface-mount lines in Vietnamese and Thai EMS hubs. These lead-frame formats support wide operating temperature ranges and are therefore preferred in industrial automation drives, smart meters, and 5G base stations [9] Semiconductor Industry Association, “Emerging Resilience in the Semiconductor Supply Chain,” Semiconductor Industry Association, semiconductors.org .
WLCSP/CSP is the fastest-growing sub-segment, advancing at a 6.7% CAGR through 2030. Smartphone OEMs in Indonesia and wearable-health device makers in the Philippines value wafer-level packages for their minimal footprint and improved electrical performance. The push toward ≤1.2 V operation also favors WLCSP parts thanks to shorter interconnect paths that cut IR drop. As optical-module vendors migrate to co-packaged optics, CSP solutions offer the thermal efficiency and board-space savings needed to support higher data rates, further expanding their addressable market within the Southeast Asia NOR Flash market size.
Geography Analysis
Vietnam led with 28.5% revenue share in 2024, a result of persistent policy support and a growing engineering workforce. The government’s USD 1 billion chip-training program and favorable tax holidays have positioned domestic assemblers to win turnkey NOR Flash contracts from multinational IDM partners. New test-and-package lines are cutting cycle times, anchoring the Southeast Asia NOR Flash market in Hanoi and Ho Chi Minh City.
The Philippines is the fastest climber, forecast to grow at 6.5% CAGR through 2030. Semiconductor exports already rank ninth worldwide, and the CREATE Act sweetens incentives for back-end memory projects. The rollout of the National Fiber Backbone pushes demand for industrial-temperature NOR parts used in optical nodes, further enlarging the local revenue pool.
Malaysia, Thailand, and Indonesia collectively form the region’s second tier. Malaysia’s New Industrial Master Plan 2030 diversifies the semiconductor base, attracting tier-one fabs that incorporate NOR lines alongside analog and power chips. Thailand’s EV roadmap drives sustained pull for automotive-grade memory, while Indonesia’s expanding fiber footprint generates sizeable orders for telecom-grade parts. Singapore, though small in shipments, contributes advanced R&D that spills over into regional design wins, strengthening the overall competitiveness of the Southeast Asia NOR Flash market.
Competitive Landscape
The market shows moderate concentration, with global specialists such as Winbond, Macronix, and Micron anchoring the premium segment. Their focus on automotive and industrial grades shields margins against low-price tactics from Chinese entrants. Taiwanese and Japanese players leverage long-term AEC-Q100 track records to capture infotainment and ADAS sockets, while Chinese suppliers scale aggressively in commodity consumer devices.
Regional manufacturers are investing in turnkey packaging to reduce foundry dependence and win local content mandates. Strategic collaborations—such as GigaDevice’s joint venture in Vietnam—boost supply resilience and shorten lead times for high-density Octal parts. Simultaneously, alternative memories like MRAM entice OEMs in power-critical wearables, nudging NOR suppliers to fast-track 1.2 V and 3D architectures. Over the next five years, the Southeast Asia NOR Flash market will likely polarize into high-reliability and value-volume tiers, with interface innovation and operating-temperature range as key differentiators.
South East Asia NOR Flash Industry Leaders
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Winbond Electronics Corporation
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Macronix International Co. Ltd.
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GigaDevice Semiconductor Inc.
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Infineon Technologies AG
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Micron Technology Inc.
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- June 2025: GigaDevice Semiconductor, a Shanghai-listed fabless semiconductor firm from China, inaugurated its global headquarters in Singapore. This strategic decision seeks to enhance customer interactions, bolster its supply chain, and reinforce its position within the industry ecosystem.
- April 2025: Navitas Semiconductor teamed up with GigaDevice, a Chinese producer of microcontrollers and flash memory, to establish a joint lab. This collaboration aims to integrate and customize Navitas' GaNFast ICs with GigaDevice's microcontrollers, targeting applications in AI data centers, electric vehicles, solar energy, and energy-saving systems.
- January 2025: Infineon, with backing from the Thailand Board of Investment, officially broke ground on a state-of-the-art, automated backend semiconductor fabrication facility in Samut Prakan, close to Bangkok. Set to commence operations in early 2026, this facility aims to bolster regional production of power modules, enhance the resilience of the supply chain, and contribute to the growth of Thailand's semiconductor landscape, particularly through initiatives in AI and automation skills development.
- July 2024: Macronix unveiled the world's inaugural 3D NOR Flash, pushing densities past the 512 Mb mark. This innovation represents a significant advancement in memory technology, addressing the growing demand for higher-density storage solutions in various applications, including automotive, industrial, and consumer electronics.
Research Methodology Framework and Report Scope
Market Definitions and Key Coverage
Our study defines the South-East Asia NOR flash memory market as sales, in value terms, of serial and parallel NOR chips that are newly fabricated on 90 nm to sub-28 nm nodes and shipped to device makers across Indonesia, Malaysia, the Philippines, Thailand, and Vietnam for code-storage and fast-boot functions in consumer, automotive, industrial, and communication equipment.
Scope exclusion: Emerging alternatives such as MRAM, RRAM, and all forms of NAND flash fall outside this boundary.
Segmentation Overview
- By Type (Value, Volume)
- Serial NOR Flash
- Parallel NOR Flash
- By Interface (Value)
- SPI Single / Dual
- Quad SPI
- Octal and xSPI
- By Density (Value)
- 2 Megabit And Less NOR
- 4 Megabit And Less-NOR (greater than 2mb) NOR
- 8 Megabit And Less (greater than 4mb) NOR
- 16 Megabit And Less (greater than 8mb) NOR
- 32 Megabit And Less (greater than 16mb) NOR
- 64 Megabit And Less (greater than 32mb) NOR
- 128 Megabit and Less (greater than 64MB) NOR
- 256 Megabit and Less (greater than 128MB) NOR
- Greater than 256 Megabit
- By Voltage (Value)
- 3 V Class
- 1.8 V Class
- Wide-Voltage (1.65 V – 3.6 V)
- Others - 1.2V Class (and similar sub-1.8V) (2.5V, 5V, etc.)
- By End-user Application (Value and Volume)
- Consumer Electronics
- Communication
- Automotive
- Industrial
- Other Applications
- By Process Technology Node (Value)
- 90 nm and Older
- 65 nm
- 55 nm (including 58 nm)
- 45 nm
- 28 nm and Below
- By Packaging Type (Value)
- WLCSP / CSP
- QFN / SOIC
- BGA / FBGA
- Others
- By Geography (Value, Volume)
- Vietnam
- Indonesia
- Philippines
- Thailand
- Malaysia
Detailed Research Methodology and Data Validation
Primary Research
Mordor analysts interviewed wafer foundries, OSAT houses, module makers, and procurement managers across Singapore, Bangkok, and Ho Chi Minh City to validate die-size cost curves, SPI interface preferences, and channel inventory norms. Follow-up surveys with automotive Tier-1 electronics and IoT gateway firms filled critical gaps on future density migration and price-elastic demand.
Desk Research
We gathered baseline supply, trade, and consumption cues from open datasets released by WSTS, UN Comtrade, ASEANstats, and national customs portals, which together signal production shifts, import reliance, and average selling prices. Industry white papers and design-win notes from JEDEC, GSMA, and SEMI, alongside corporate 10-Ks and investor decks, added color on density road maps and end-market attach rates. Subscription sources, including D&B Hoovers for fabless revenue splits, Dow Jones Factiva for capacity announcements, and Questel for key NOR-related patent families, helped us map competitive intensity and innovation velocity. This list is illustrative; many additional publications were reviewed to verify and refine evidence.
Market-Sizing & Forecasting
A top-down model converts HS 854232 trade and in-region wafer output into dollar demand, adjusted for local value-add and re-exports. It then corroborates totals with selective bottom-up checks, sampled vendor shipments, and average selling price benchmarks to align reality. Key inputs feeding the model include smartphone assembly volumes, 5G base-station rollout counts, automotive ECU penetration, industrial robot shipments, and SPI NOR blended ASP trends. Multivariate regression projects these drivers through 2030, while scenario analysis buffers for capex swings and ASP compression. Any bottom-up gaps are bridged using channel check ratios agreed upon in expert calls.
Data Validation & Update Cycle
Outputs pass variance scans against independent indicators such as quarterly WSTS revenue and ASEAN import tallies; anomalies trigger analyst re-checks before sign-off. Reports refresh each year, with interim updates when material events, such as capacity fires, export controls, and major design wins, arise. A final analyst pass ensures clients receive the latest consensus view.
Why Our South East Asia NOR Flash Baseline Commands Reliability
Published numbers often diverge because firms pick dissimilar geographies, interface mixes, and refresh cadences.
Key gap drivers include broader APAC or global scopes, exclusion of low-density SPI devices, one-off currency conversions, and shorter forecast windows, which together inflate or deflate totals relative to Mordor's disciplined SEA-only lens and annual recalibration.
Benchmark comparison
| Market Size | Anonymized source | Primary gap driver |
|---|---|---|
| USD 90.82 Mn (2025) | Mordor Intelligence | - |
| USD 2.8 Bn (2023, APAC) | Regional Consultancy A | Uses full Asia-Pacific scope and older base year, no trade-flow adjustment |
| USD 1.2 Bn (2023, APAC) | Global Consultancy B | Bundles SEA with North Asia and omits sub-65 nm die splits |
| USD 3.22 Bn (2025, Global) | Industry Association C | Global roll-up, mixes NOR with niche industrial NV-RAM, different currency base |
Taken together, the comparison shows that when region, interface type, and density tiers are aligned, Mordor's SEA baseline offers a balanced, transparent figure that decision-makers can confidently trace back to clear variables and repeatable steps.
Key Questions Answered in the Report
What is the current size of the Southeast Asia NOR Flash market?
The market is valued at USD 90.82 million in 2025 and is forecast to reach USD 124.07 million by 2030.
Which segment is growing the fastest within the market?
The Octal/xSPI interface segment leads growth, registering a 6.9% CAGR owing to rising bandwidth requirements in automotive and industrial systems.
Why is Vietnam pivotal to regional NOR Flash production?
Vietnam combines a 28.5% market share with aggressive talent-development programs and new assembly-test lines, making it the primary manufacturing hub.
How are government incentives influencing market dynamics?
Tax holidays, accelerated depreciation, and workforce subsidies in Malaysia, Vietnam, and Thailand collectively lift the market CAGR by an estimated 2.1 percentage points.
What challenges do local suppliers face?
Heavy reliance on offshore foundries and price competition from Chinese vendors exert downward pressure on margins and threaten supply continuity.
Will alternative memories displace NOR Flash soon?
Technologies like MRAM and RRAM are gaining traction in power-critical wearables, yet their adoption is gradual; NOR Flash remains entrenched in automotive and industrial designs through at least 2030.
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