China NOR Flash Memory Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

China NOR Flash Memory Market Report is Segmented by Type (Serial, Parallel), Density (2 Megabit and Less NOR, and More), Voltage (3V Class, 1. 8V Class, and More), End-User Application (Consumer Electronics, Communication Equipment, and More), Process Technology Node (90 Nm and Older, 65 Nm, and More), and Packaging Type (WLCSP/CSP, QFN/SOIC, and More). The Market Forecasts are Provided in Terms of Value (USD) and Volume (Units).

China NOR Flash Memory Market Size and Share

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China NOR Flash Memory Market Analysis by Mordor Intelligence

Key Report Takeaways

The China NOR Flash Memory market is worth USD 1.44 billion in 2025 and is on track to reach USD 2.02 billion by 2030, supported by a 6.98% CAGR during the forecast period. Growth stems from Beijing’s push for semiconductor self-sufficiency, the XinChuang procurement mandate, and mounting local demand in electric vehicles, industrial IoT, and premium consumer devices. Domestic suppliers are moving up the value curve by focusing on 55 nm and 65 nm process nodes that balance cost and performance, while hybrid serial-parallel products close the gap with higher-density alternatives. Regional manufacturing clusters in Guangdong, Jiangsu, and Anhui are accelerating time-to-market for automotive-grade parts that meet ISO 26262 safety targets. Meanwhile, smartphone, smart-EV, and industrial system OEMs continue to favour execute-in-place memories that boot quickly and maintain code integrity under harsh conditions, sustaining a resilient pipeline for the China NOR Flash Memory market even when broader memory cycles soften.

Key Report Takeaways

  • By product type, Serial NOR held 79.2% of the China NOR Flash Memory market share in 2024. The Serial NOR Flash segment is also anticipated to witness the highest CAGR of 7.5%, while the Parallel NOR is forecast to expand at a 3.2% CAGR through 2030.
  • By interface, SPI Single/Dual led with 45.1% revenue share in 2024; Quad SPI is projected to grow at a 7.1% CAGR to 2030.
  • By density, 128 Mbit devices accounted for 27.3% of the China NOR Flash Memory market size in 2024; densities above 256 Mbit are expected to rise at a 7.3% CAGR.
  • By voltage, 3 V class devices commanded a 53.2% share of the China NOR Flash Memory market size in 2024 and are advancing at a 7.1% CAGR through 2030.
  • By process node, 55 nm contributed 53.6% of 2024 revenue, whereas 65 nm nodes exhibit the fastest CAGR of 7.4% to 2030.
  • By packaging, QFN/SOIC held 41.6% revenue share in 2024 and is poised to grow 7.2% annually.
  • By end use, consumer electronics led with 47.9% revenue share in 2024; automotive applications are growing at 7.8% CAGR to 2030.
  • GigaDevice, Winbond, and Puya together fulfilled more than half of domestic consumption in 2024.

Segment Analysis

By Type: Serial Dominates While Parallel Gains Momentum

Serial NOR Flash devices held a commanding 79.2% of the China NOR Flash Memory market share in 2024, anchored by SPI and QSPI interfaces that need only four to eight pins. In 2025, the segment continues to grow as embedded microcontrollers standardise on serial buses for boot code storage in consumer electronics. Across 2025-2030, Parallel NOR expands at a 3.2% CAGR, driven by demand for deterministic access in centralised automotive computers. 

Developers increasingly blur the lines between serial and parallel by adopting Octal devices that reach 400 MB/s read speeds while preserving compact pinouts. GigaDevice’s GD25LX line shows how a serial package can rival legacy parallel bandwidth. [4]GigaDevice, “Annual Report 2024,” gigadevice.com

Automotive brands piloting domain controller designs in Anhui value such products for fast over-the-air update cycles without adding board space.

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By Interface: Quad SPI Adoption Accelerates Amid Performance Demands

SPI Single/Dual retained 45.1% revenue share in 2024 as the workhorse interface for cost-sensitive IoT nodes. The China NOR Flash Memory market now sees OEM roadmaps shifting toward Quad SPI to cut boot times in digital cockpits and industrial HMIs. Quad SPI grows at 7.1% CAGR and could overtake Single/Dual by 2029 if adoption curves in smart-EV dashboards stay on track.

At the premium end, Octal and xSPI devices are entering telematics and AI accelerator cards that need sustained bandwidth beyond 200 MB/s. Winbond reports that its Octal interface supports up to 416 MHz equivalent transfers, doubling frame-buffer load speeds for high-resolution cluster displays [5]Winbond Electronics, “1Q25 Investor Conference Materials,” winbond.com . Though volumes remain small, these interfaces establish a migration path should performance ceilings of Quad SPI emerge.

By Density: Higher Capacities Capture Premium Segments

The 128 Mbit tier held 27.3% of 2024 sales, balancing code size and cost across mobile, IoT, and industrial use cases. The China NOR Flash Memory market size above 256 Mbit is forecast to have a CAGR growth of 7.3% to 2030, driven by data-heavy ADAS and infotainment stacks in electric vehicles. Densities of 512 Mbit and 1 Gbit remain niche but accelerate fastest, benefiting from Alliance Memory and Infineon launches that marry high density with QSPI interfaces. [6]Alliance Memory, “Serial NOR Product Launch,” alliancememory.com

Mid-range 32 Mbit-64 Mbit parts stay relevant for communications and meter endpoints, though their share slips as firmware footprints expand. Sub-16 Mbit parts gradually retreat to legacy and ultra-low-cost gadgets. Security-enhanced NOR such as Winbond W77Q overlays AES-256 encryption and secure boot features on all densities, creating new premium sub-segments.

China NOR Flash Memory Market: Market Share by Density
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Note: Segment shares of all individual segments available upon report purchase.

By Voltage: 3 V Class Dominates While Maintaining Growth Leadership

Devices rated for 3 V accounted for 53.2% of 2024. Automotive and industrial boards prefer 3 V for robust noise margins and compatibility with 5 V-tolerant GPIO. The China NOR Flash Memory market share for 1.8 V parts covers wearables and mobile phones, where battery life trumps voltage headroom.

Suppliers introduce 1.2 V experimental lines to partner with new sub-threshold MCUs, yet such parts are still pilot-scale. Designers seeking one flash portfolio across multiple voltages gravitate toward wide-voltage options that span 1.65-3.6 V, simplifying qualification across product tiers. Winbond’s 3V automotive series illustrates why this voltage class remains the sweet spot for ISO 26262 systems.

By Process Technology Node: 55 nm Dominates While 65 nm Shows Surprising Growth

In 2024, 55 nm nodes supplied 53.6% of wafers because domestic fabs like SMIC achieved high yield and stable supply at that geometry. The China NOR Flash Memory market is now seeing renewed interest in 65 nm, which records a 7.4% CAGR due to its proven reliability in harsh environments. TSMC publicised multiple automotive qualifications for its 65 nm embedded flash, reassuring Chinese module makers of long-term support [7]TSMC, “Embedded Flash Technology Platforms,” tsmc.com .

Trade restrictions that curb access to advanced EUV tools make moving below 40 nm impractical. Consequently, domestic IDMs refine 55 nm and 65 nm cell architectures, adding stacked bit-line and charge-trapping designs to push density without shrinking lithography. These adaptations extend lifespan and write endurance, matching stringent vehicle lifetime requirements.

China NOR Flash Memory Market: Market Share by Process Technology Node
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Note: Segment shares of all individual segments available upon report purchase.

By Packaging Type: QFN/SOIC Packages Lead Through Versatility

QFN and SOIC combined controlled 41.6% of 2024 revenue and grew 7.2% annually, reflecting their balance of thermal handling, board real estate, and cost. The China NOR Flash Memory market size for these packages aligns with trends in smart-EV and industrial controllers that operate at elevated temperatures. Micron’s 16-pin SOIC N25Q128A11ESE40F highlights why SOIC remains a standard for automotive ECU designs where pin-to-pin drop-in matters [8]Micron Technology, “N25Q NOR Flash Data Sheet,” micron.com .

BGA and WLCSP packages are adopted in premium phones and wearables, offering thinner profiles, though at a higher assembly cost. Flip-chip options are emerging for centralised compute modules that demand robust signal integrity at high read frequencies. Domestic OSATs invest in QFN automation lines to meet XinChuang qualification queues, ensuring capacity headroom for 2026-2027 compliance peaks.

By End-user Application: Consumer Electronics Leads, Automotive Accelerates

Consumer devices led with 47.9% of revenue in 2024, anchored by smartphones, tablets, and smart-home appliances. Domestic OEMs replace imported memory to secure logistics and cost, helped by serial devices that follow mature SPI protocols. The China NOR Flash Memory market sees automotive grow 7.8% CAGR as EV makers integrate larger flashing footprints for firmware-over-the-air updates.

Network gear for 5G infrastructure remains another steady user, demanding high-reliability boot devices that resist bit-flip under continuous operation. Industrial IoT nodes in Shenzhen factories embed secure NOR to protect intellectual property and support remote update frameworks. Health-tech devices, security cameras, and emerging AIoT hubs in Xi’an add incremental volume, broadening the customer base for domestic suppliers.

Geography Analysis

Regional clustering defines demand patterns. Guangdong, Shanghai, and Jiangsu together account for the majority of shipments because they host consumer-electronics assembly lines and IC packaging houses. Local design centres in Shenzhen’s Bao’an district fast-track qualifications, allowing domestic fabs to win sockets inside OLED smartphones and smart-home gateways. Jiangsu’s Suzhou Park adds backend test capacity, reducing logistics cost for final module makers. 

Anhui and Jiangsu lead automotive memory uptake. Hefei’s EV corridor hosts smart-EV start-ups and Tier-1 suppliers who require 256 Mbit/s to 1 Gbit/s NOR for domain controllers. Close proximity to GigaDevice’s Suzhou fab shortens DVT loops, encouraging joint reliability studies that align with ISO 26262. The China NOR Flash Memory market size linked to these provinces is likely to grow significantly as EV builds multiply. 

Beijing and major provincial capitals represent policy-driven demand through XinChuang mandates. Ministries, public utilities, and state-owned banks migrate to local IT stacks that standardise on China-produced NOR to secure firmware roots-of-trust. This steady pull helps balance cyclicality from consumer gadgets and creates predictable order books for domestic suppliers. Cross-provincial research and development nodes focusing on secure memory co-locate with these customers, accelerating feature roadmaps.

Competitive Landscape

China’s NOR Flash Memory Market arena blends moderate concentration with intensifying domestic ascendancy. GigaDevice remains among the top NOR Flash memory suppliers in China, leveraging a broad portfolio that ranges from 1.2 V miniaturized parts to 400 MB/s octal solutions. Winning ISO 26262 ASIL D accreditation for its GD25/55 line unlocks premium automotive engagements and signals process maturity on China-based lines [9]Infineon Technologies AG, press release, May 8, 2025, infineon.com . Macronix continues to lead the density-innovation race via 3D NOR prototypes that stack multiple cell planes, a maneuver aimed at bending cost-per-bit curves downward [10]EE Times, Jan 1, 2025, eetimes.com . Winbond retains the shipment crown by volume but pivots R&D toward secure-flash variants to defend margins in commoditizing consumer niches [11]Winbond Investor Conference, May 7, 2025, winbond.com .

Domestic challengers such as Puya Semiconductor and Giantec sharpen focus on mid-density, cost-sensitive segments, courting IoT module makers constrained by bill-of-materials ceilings. Their fab-light models outsource wafer fabrication yet invest in controller-firmware co-design, differentiating on system-level performance rather than raw cell geometry. Foreign incumbents adopt dual tactics, e.g., Infineon, recently doubled down on automotive functional-safety credentials, while Alliance Memory expanded high-density offerings to serve embedded boards that outgrow 128 Mbit ceilings [12]Morningstar, Mar 3 2025, morningstar.com .

Strategic moves orbit around balancing density, performance, and compliance. Suppliers courting automotive demand allocate capital to extensive qualification labs and zero-defect initiatives, whereas those chasing IoT volumes emphasize power-down data-retention specifications and secure boot features. The resulting coexistence of premium and commodity tiers prevents single-player dominance, positioning the China NOR Flash memory market as a competitively vibrant but policy-shaped battleground.

China NOR Flash Memory Industry Leaders

  1. GigaDevice Semiconductor Inc.

  2. Macronix International Co. Ltd

  3. Winbond Electronics Corporation

  4. Puya Semiconductor (Shanghai) Co., Ltd.

  5. Giantec Semiconductor Corporation

  6. *Disclaimer: Major Players sorted in no particular order
China NOR Flash Memory Market Comptetive Landscape
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Recent Industry Developments

  • January 2025: Winbond noted 1Q25 NOR revenue down 10% QoQ yet up 5% YoY as bit shipments rose low-teens % YoY, flagging tighter SLC NAND supply that could swing demand back to NOR.
  • January 2025: Infineon’s SEMPER family achieved ISO 26262 ASIL-D certification for automotive NOR, targeting ADAS and cockpit modules.
  • April 2025: Alliance Memory unveiled 128 Mb-512 Mb serial NOR at Embedded World to serve industrial and medical embedded designs.
  • December 2024: GigaDevice’s GD25/55 SPI NOR family received formal ASIL-D certification, supporting throughputs up to 400 MB/s and 20-year data retention.

Table of Contents for China NOR Flash Memory Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions & Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing Digitalization and Emergence of Data-centric Applications
    • 4.2.2 Government “XinChuang” procurement program favouring China-made memory
    • 4.2.3 Expansion of smart-EV production hubs in Guangdong and Anhui using automotive-grade NOR
    • 4.2.4 Rapid adoption of OLED display drivers requiring enhanced NOR for code storage
    • 4.2.5 Surging demand from domestic smartphone OEMs integrating high-density serial NOR
    • 4.2.6 Increasing Evolution of Smart Vehicles
  • 4.3 Market Restraints
    • 4.3.1 High Cost of R&D and Fabrication
    • 4.3.2 Growing substitution by high-speed SPI NAND in displays and wearables
  • 4.4 Value / Supply-Chain Analysis
  • 4.5 Macro Trend Impact Analysis
  • 4.6 Regulatory and Technological Outlook
  • 4.7 Porter’s Five Forces
    • 4.7.1 Bargaining Power of Suppliers
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Threat of New Entrants
    • 4.7.4 Threat of Substitute Products
    • 4.7.5 Intensity of Competitive Rivalry
  • 4.8 Pricing Analysis
  • 4.9 Investment Analysis

5. MARKET SIZE AND GROWTH FORECASTS (VALUE, VOLUME)

  • 5.1 By Type (Value, Volume)
    • 5.1.1 Serial NOR Flash
    • 5.1.2 Parallel NOR Flash
  • 5.2 By Interface (Value)
    • 5.2.1 SPI Single / Dual
    • 5.2.2 Quad SPI
    • 5.2.3 Octal & xSPI
  • 5.3 By Density (Value)
    • 5.3.1 2 Megabit And Less NOR
    • 5.3.2 4 Megabit And Less-NOR (greater than 2mb) NOR
    • 5.3.3 8 Megabit And Less (greater than 4mb) NOR
    • 5.3.4 16 Megabit And Less (greater than 8mb) NOR
    • 5.3.5 32 Megabit And Less (greater than 16mb) NOR
    • 5.3.6 64 Megabit And Less (greater than 32mb) NOR
    • 5.3.7 128 Megabit and Less (greater than 64MB) NOR
    • 5.3.8 256 Megabit and Less (greater than 128MB) NOR
    • 5.3.9 Greater than 256 Megabit
  • 5.4 By Voltage (Value)
    • 5.4.1 3 V Class
    • 5.4.2 1.8 V Class
    • 5.4.3 Wide-Voltage (1.65 V – 3.6 V)
    • 5.4.4 Others - 1.2V Class (and similar sub-1.8V) (2.5V, 5V, etc.)
  • 5.5 By End-user Application (Value, Volume)
    • 5.5.1 Consumer Electronics
    • 5.5.2 Communication
    • 5.5.3 Automotive
    • 5.5.4 Industrial
    • 5.5.5 Other Applications
  • 5.6 By Process Technology Node (Value)
    • 5.6.1 90 nm & Older
    • 5.6.2 65 nm
    • 5.6.3 55 nm (including 58 nm)
    • 5.6.4 45 nm
    • 5.6.5 28 nm & Below
  • 5.7 By Packaging Type (Value)
    • 5.7.1 WLCSP / CSP
    • 5.7.2 QFN / SOIC
    • 5.7.3 BGA / FBGA
    • 5.7.4 Others

6. COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles {(includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)}
    • 6.4.1 Infineon Technologies AG
    • 6.4.2 GigaDevice Semiconductor Inc.
    • 6.4.3 Macronix International Co. Ltd
    • 6.4.4 Winbond Electronics Corporation
    • 6.4.5 Integrated Silicon Solution Inc.
    • 6.4.6 Microchip Technology Inc.
    • 6.4.7 Renesas Electronics Corporation
    • 6.4.8 Giantec Semiconductor Corporation
    • 6.4.9 Wuhan Xinxin Semiconductor Manufacturing Co. Ltd (XMC)
    • 6.4.10 Puya Semiconductor (Shanghai) Co., Ltd.
    • 6.4.11 Fudan Microelectronics Group Co. Ltd. 
    • 6.4.12 Zbit Semiconductor, Inc.

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

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Key Questions Answered in the Report

What is the current size of the China NOR Flash Memory market?

The market is valued at USD 1.44 billion in 2025 and is projected to reach USD 2.02 billion by 2030.

How will the XinChuang initiative influence demand?

XinChuang mandates domestic components in government and state-owned systems, securing a protected demand pool estimated at one-third of total market volume through 2027.

Which interface is growing fastest in the China NOR Flash Memory market?

Quad SPI is expanding at a 7.1% CAGR because it quadruples bandwidth over conventional SPI, essential for rapid boot in complex automotive and industrial systems.

What competitive strategies are local suppliers using against global incumbents?

Domestic companies focus on mature 55 nm/65 nm nodes for reliable supply, secure ISO 26262 certifications for automotive design wins, and release hybrid QSPI NAND products to counter cost pressure from Serial NAND substitutes.

Page last updated on: June 25, 2025