Electroplating Market Size and Share

Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

Compare market size and growth of Electroplating Market with other markets in Technology, Media and Telecom Industry

Electroplating Market Analysis by Mordor Intelligence

The electroplating market size is estimated at USD 22.1 billion in 2025 and is forecast to reach USD 30.1 billion by 2030, reflecting a 6.33% CAGR. Persistently high demand for wear-resistant, conductive, and corrosion-proof coatings across electronics, automotive, semiconductor packaging, and industrial equipment sustained growth even when nickel and palladium prices swung sharply and when regulators tightened chromium rules. Miniaturization in consumer devices, the rollout of 5G base-station clusters, and expanding electric-vehicle power-electronics needs all lifted orders for multilayer finishes that combine nickel, palladium, and gold. Investments tied to the CHIPS Act encouraged local suppliers in North America and Europe to install inline reel-to-reel lines fitted with real-time bath-chemistry controls, while Asia-Pacific maintained volume leadership through its dense supply chain and smelter capacity. Concurrently, California’s fast-approaching 2027 decorative chromium sunset date spurred accelerated trials of trivalent systems that pair compliance with hardness and brightness equal to legacy hexavalent baths. 

Key Report Takeaways

  • By plating type, barrel processes led with 34% revenue share of the electroplating market in 2024, whereas in-line reel-to-reel systems are projected to expand at an 8.8% CAGR through 2030.
  • By functional application, performance-driven coatings dominated with 64% of the electroplating market share in 2024, and this segment is set to advance at an 8.1% CAGR to 2030.
  • By metal, nickel accounted for 28% of the electroplating market share in 2024; palladium is expected to post the fastest 9.5% CAGR between 2025 and 2030.
  • By end-user industry, electrical and electronics captured 38% of the electroplating market in 2024, while semiconductor packaging is forecast to grow at a 10.9% CAGR to 2030.
  • By geography, Asia-Pacific held 48% of the electroplating market in 2024, and North America is projected to record the quickest 7.6% CAGR from 2025 to 2030.

Segment Analysis

By Plating Type: Inline Systems Revolutionize Throughput

Barrel units commanded a 34% revenue lead in 2024 as bulk fastener, spring, and clip orders relied on economical tumbling batches. Servo-hoists tied to Automotion 8000 PLCs used optical encoders that improved position accuracy to ±0.5 mm, reducing carry-over drag-out during changeovers. Inline reel-to-reel systems, by contrast, are projected to post an 8.8% CAGR through 2030 as semiconductor leadframes, flexible circuits, and ribbon connectors demand micro-ampere-second current control and 0–20 m/min variable web speed. 

Inline equipment increasingly integrates pH, metal-ion, and surfactant probes feeding closed-loop controllers that maintain thickness variation within ±3 %, sharpening yield on fine-pitch parts. Continuous strip lines address long-component sectors such as architectural trim, while rack units remain indispensable for turbine blades and chassis busbars requiring selective masking. Numerous mid-size job shops in Asia-Pacific added overhead-transport robots with vision alignment, shrinking labor footprints, and readying legacy barrel plants for automated second-shift operation.

Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

Note: Segment shares of all individual segments available upon report purchase

By Functional Application: Performance Drives Growth

Functional finishes covered 64% of the electroplating market in 2024 and are set to grow 8.1% annually, reflecting industry preference for coatings that raise corrosion resistance, wear life, or electrical performance rather than simple decorative appeal. Duplex nickel, electroless nickel phosphorus, and trivalent hard-chrome variants all moved from pilot to production scale, aided by Atotech cell designs that cut misting and slash fume scrubber loads. 

While the decorative segment remained smaller, it saw Research and Development in ionic-liquid bath chemistries that eliminated cyanide and delivered novel color ranges for wearables and automotive interiors. Research documented enhanced cobalt–nickel alloy brightness at lower current densities, raising interest among jewelry OEMs seeking gold-tone aesthetics with thin precious-metal strike layers. The convergence of functional and decorative demands emerged in premium consumer electronics, where bezel plating required both <0.2 µm roughness and distinctive tones.

By Metal: Palladium Surges on Semiconductor Demand

Nickel held a 28% electroplating market share in 2024, underpinned by its use in high-phosphorus electroless baths that formed diffusion-barrier layers on EV battery plates. Automotive core suppliers migrated from hard chrome toward electroless nickel-boron to meet REACH timelines without sacrificing wear resistance. Palladium is forecast to expand at a 9.5% CAGR through 2030 as through-silicon-via caps, copper pillars, and high-frequency connector pins prioritize low-contact-resistance, corrosion-proof finishes. 

Selective plating systems governed by Patent US20140102906A1 allowed shops to restrict palladium to bonding pads, trimming precious-metal spend by up to 55%. Gold continued to dominate high-reliability socket markets, silver catered to RF filters, copper remained the backbone for multilayer builds, zinc satisfied general hardware, chromium transitioned to trivalent formulas, and tin assured solderability in canning and electronics.

Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

Note: Segment shares of all individual segments available upon report purchase

By End-User Industry: Semiconductor Packaging Leads Growth

Electrical and electronics products represented 38% of the electroplating market in 2024, spanning smartphone connectors, industrial sensors, and power-supply heat sinks. Multilayer nickel–nickel-phosphorus–gold stacks sustained solder joint reliability in humid environments, while duplex nickel barrier layers preserved signal integrity during 5G frequency jumps. Semiconductor packaging is projected to grow at 10.9% per year as chip makers extend copper pillar, TSV, and micro-bump densities for 2.5-D integration, leveraging horizontal plating lines that improved hydrodynamics and suppressed voiding. 

Medical-device innovators plated platinum-iridium onto implantable electrodes to maintain electrochemical stability under prolonged stimulation cycles. Automotive tier suppliers relied on duplex nickel and high-phosphorus electroless coatings to extend drivetrain component life. Aerospace and defense contractors performed fatigue-critical chrome-free cadmium replacement trials, and industrial machinery builders applied heavy-duty nickel–cobalt for hydraulic rod protection.

Geography Analysis

Asia-Pacific accounted for 48% of the electroplating market in 2024, anchored by dense PCB, connector, and metal-forming ecosystems. China’s count of specialist electroplating parks rose from 150 in 2021 to 162 in 2023, mirroring provincial grants that subsidised wastewater-recycling upgrades. Copper cathode output climbed 14.27% year-on-year in April 2025 as new Guangxi smelters ramped up, securing feedstock for strip lines. Hangzhou’s 2024 directive mandated closed-loop rinsing and drag-out recovery to curb nickel emissions below 0.5 mg L-1.[4]Hangzhou Municipal Government, “Electroplating Pollution-Control Plan,” hangzhou.gov.cn

North America, projected to achieve a 7.6% CAGR, benefited from semiconductor reshoring grants and automotive electrification. New Hampshire’s advanced-manufacturing workforce expanded 16.5% between 2017 and 2022 as local shops installed robotic hoist lines for aerospace barrel applications.

Europe prioritised sustainability and innovation amid strict REACH oversight. The European Investment Bank’s 2024/2025 report stated that administrative compliance costs averaged 1.8% of turnover, pushing firms toward digital QA logs and galvanic bath analytics that shortened audit preparation times. South America and the Middle East and Africa, though smaller, added zinc-nickel and duplex nickel capacity for mining, oil-field, and rail hardware as construction investments in 2024 raised demand for corrosion-proof components.

Electroplating Market
Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

Competitive Landscape

The electroplating market showed fragmented global ownership in 2024, with five multinational chemistry suppliers holding roughly 45% share, while thousands of regional job shops and captive OEM lines handled customised orders. MacDermid Enthone’s June 2025 acquisition of RM Plating extended its nickel–palladium capability for EV connectors and underlined consolidation among process-chemical majors. 

Atotech’s DynaSmart line shipped with inline thickness sensors and AI-guided additive dosing, reducing scrap by up to 8 percentage points during 2024 pilot runs at European automotive suppliers. ACM Research’s horizontal ECP platform captured close to 30% of China’s advanced copper-fill tool demand by April 2025, helping local fabs broaden TSV and redistribution-layer capacity. 

White-space entrants pursued chromium-free hard coats, PFAS-free wetting agents, and ionic-liquid decorative systems. Patent filings for selective-area plating heads that meter precious-metal deposition only onto functional pads further signalled cost-downs that could democratise palladium usage. Surveys showed 86% of North American finishers expected revenue gains in 2025, although 56% cited skilled-operator shortages; collaborative robots are therefore being integrated for load/unload and masking tasks.

Electroplating Industry Leaders

  1. Autotech Deutschland GmbH

  2. MacDermid Enthone Industrial Solutions (Enthone Inc.)

  3. JCU Corporation

  4. Pioneer Metal Finishing LLC

  5. Uyemura and Co. Ltd.

  6. *Disclaimer: Major Players sorted in no particular order
Electroplating Market Concentration
Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.
Need More Details on Market Players and Competitors?
Download PDF

Recent Industry Developments

  • May 2025: DYCONEX committed CHF 7 million to upgrade copper and gold lines for 7-µm subtractive-process boards.
  • April 2025: ACM Research broadened its horizontal ECP tool suite, consolidating roughly 30% domestic share in China.
  • March 2025: California Air Resources Board finalized the 2027/2039 Cr-VI phase-out timetable, accelerating trivalent chromium adoption.
  • February 2025: Oerlikon Surface Solutions disclosed CHF 1.5 billion (USD 1.69 billion) 2024 organic sales, citing PVD growth in aerospace.
  • January 2025: US EPA published Preliminary Effluent Guidelines Plan 16, flagging PFAS monitoring for electroplating wastewater.

Table of Contents for Electroplating Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Strong demand from EV and ADAS-grade connectors
    • 4.2.2 Lightweighting push in automotive replacing machined parts
    • 4.2.3 Miniaturisation in wearables and hearing-aids
    • 4.2.4 5G infrastructure densification (small-cells, PCB finishes)
    • 4.2.5 On-shoring of semiconductor packaging lines in US/EU
  • 4.3 Market Restraints
    • 4.3.1 Nickel and palladium price volatility
    • 4.3.2 REACH and US EPA Cr-VI bans tightening from 2026
    • 4.3.3 Skill-gap in high-precision plating workforce
  • 4.4 Supply-Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Porter’s Five Forces Analysis
    • 4.7.1 Bargaining Power of Suppliers
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Threat of New Entrants
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Intensity of Competitive Rivalry
  • 4.8 Pricing Analysis
  • 4.9 Macroeconomic Impact Assessment
  • 4.10 Investment Analysis

5. MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Plating Type
    • 5.1.1 Barrel Plating
    • 5.1.2 Rack Plating
    • 5.1.3 Continuous Plating
    • 5.1.4 In-line (Reel-to-Reel) Plating
  • 5.2 By Functional Application
    • 5.2.1 Decorative
    • 5.2.2 Functional
  • 5.3 By Metal
    • 5.3.1 Gold
    • 5.3.2 Silver
    • 5.3.3 Copper
    • 5.3.4 Zinc
    • 5.3.5 Nickel
    • 5.3.6 Chromium
    • 5.3.7 Palladium
    • 5.3.8 Tin
  • 5.4 By End-user Industry
    • 5.4.1 Automotive
    • 5.4.2 Electrical and Electronics
    • 5.4.3 Semiconductor Packaging
    • 5.4.4 Aerospace and Defense
    • 5.4.5 Industrial Machinery
    • 5.4.6 Medical Devices
    • 5.4.7 Jewellery and Luxury Goods
  • 5.5 By Geography
    • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
    • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Russia
    • 5.5.3.6 Rest of Europe
    • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 South Korea
    • 5.5.4.4 India
    • 5.5.4.5 ASEAN
    • 5.5.4.6 Rest of Asia-Pacific
    • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
    • 5.5.5.1.1 GCC
    • 5.5.5.1.2 Rest of Middle East
    • 5.5.5.2 Africa
    • 5.5.5.2.1 South Africa
    • 5.5.5.2.2 Rest of Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Allied Finishing Inc.
    • 6.4.2 Autotech Deutschland GmbH
    • 6.4.3 Precision Plating Company Inc.
    • 6.4.4 Industrial Metal Finishing
    • 6.4.5 Peninsula Metal Finishing Inc.
    • 6.4.6 Sharretts Plating Company Inc.
    • 6.4.7 Pioneer Metal Finishing LLC
    • 6.4.8 JCU Corporation
    • 6.4.9 Karas Plating Ltd.
    • 6.4.10 MacDermid Enthone Industrial Solutions (Enthone Inc.)
    • 6.4.11 Atotech (MKS Inc.)
    • 6.4.12 Uyemura and Co. Ltd.
    • 6.4.13 SIFCO Applied Surface Concepts
    • 6.4.14 Advanced Surface Technologies Inc.
    • 6.4.15 Interplex Industries (Sat Plating) Ltd.
    • 6.4.16 ACM Research Inc.
    • 6.4.17 Valence Surface Technologies LLC
    • 6.4.18 Metalor Technologies SA
    • 6.4.19 Nornickel (Norilsk Nickel)
    • 6.4.20 DYCONEX AG
    • 6.4.21 Arlington Plating Company
    • 6.4.22 Technic Inc.
    • 6.4.23 Alpha Metal Finishing
    • 6.4.24 Metal Craft Plating

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-space and Unmet-need Assessment
You Can Purchase Parts Of This Report. Check Out Prices For Specific Sections
Get Price Break-up Now

Global Electroplating Market Report Scope

Electroplating, or electro deposition, uses electric current to deposit material onto a work-piece. This process coats a substrate with a thin metal layer. Primarily, electroplating alters an object's physical properties. As the electronics industry grows, so does the anticipated demand for electroplating.

The electroplating market is segmented by type (barrel plating, rack plating, continuous plating, line plating), metal (gold, silver, copper, zinc, nickel, chromium), end user (automotive, electrical & electronics, aerospace & defense, industrial machinery, healthcare, other end users), geography (North America, Europe, Asia Pacific, Latin America, Middle East and Africa). The market size and forecasts are provided in terms of value (USD) for all the above segments.

By Plating Type Barrel Plating
Rack Plating
Continuous Plating
In-line (Reel-to-Reel) Plating
By Functional Application Decorative
Functional
By Metal Gold
Silver
Copper
Zinc
Nickel
Chromium
Palladium
Tin
By End-user Industry Automotive
Electrical and Electronics
Semiconductor Packaging
Aerospace and Defense
Industrial Machinery
Medical Devices
Jewellery and Luxury Goods
By Geography North America United States
Canada
South America Brazil
Argentina
Rest of South America
Europe Germany
United Kingdom
France
Italy
Russia
Rest of Europe
Asia-Pacific China
Japan
South Korea
India
ASEAN
Rest of Asia-Pacific
Middle East and Africa Middle East GCC
Rest of Middle East
Africa South Africa
Rest of Africa
By Plating Type
Barrel Plating
Rack Plating
Continuous Plating
In-line (Reel-to-Reel) Plating
By Functional Application
Decorative
Functional
By Metal
Gold
Silver
Copper
Zinc
Nickel
Chromium
Palladium
Tin
By End-user Industry
Automotive
Electrical and Electronics
Semiconductor Packaging
Aerospace and Defense
Industrial Machinery
Medical Devices
Jewellery and Luxury Goods
By Geography
North America United States
Canada
South America Brazil
Argentina
Rest of South America
Europe Germany
United Kingdom
France
Italy
Russia
Rest of Europe
Asia-Pacific China
Japan
South Korea
India
ASEAN
Rest of Asia-Pacific
Middle East and Africa Middle East GCC
Rest of Middle East
Africa South Africa
Rest of Africa
Need A Different Region or Segment?
Customize Now

Key Questions Answered in the Report

How large will the electroplating market be by 2030?

The electroplating market size is projected to reach USD 30.1 billion by 2030, up from USD 22.1 billion in 2025.

Which application segment is expanding the fastest?

Semiconductor packaging is expected to record a 10.9% CAGR because chipmakers need dense copper pillars and TSV fills for 2.5-D and 3-D integration.

Why are reel-to-reel systems gaining share in the electroplating market?

They deliver continuous, tightly controlled deposition on strip materials, improving yield and speed for lead frames and flexible circuits while supporting inline bath monitoring.

How are regulations changing chromium plating practices?

California mandated a switch from hexavalent to trivalent chromium by 2027 for decorative and 2039 for functional lines, mirroring broader REACH and EPA actions.

What metals lead electroplating usage today?

Nickel held 28% of the electroplating market share in 2024 due to its versatile corrosion resistance, while palladium is seeing the quickest growth because of semiconductor and automotive-connector demand.

What challenges do finishers face with raw-material costs?

Volatile nickel and palladium pricing complicates long-term contracts, prompting selective-area plating and alternative alloy adoption to stabilize margins.

Page last updated on: