Die Bonder Equipment Market Size and Share
Market Overview
| Study Period | 2019 - 2030 |
|---|---|
| Market Size (2025) | USD 0.98 Billion |
| Market Size (2030) | USD 1.21 Billion |
| Growth Rate (2025 - 2030) | 4.20% CAGR |
| Fastest Growing Market | Asia Pacific |
| Largest Market | Asia Pacific |
| Market Concentration | Medium |
Major Players
*Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0. |
|
Die Bonder Equipment Market Analysis by Mordor Intelligence
The die bonder equipment market size stands at USD 0.98 billion in 2025 and is forecast to climb to USD 1.21 billion by 2030, reflecting a 4.2% CAGR over the period. Market expansion centers on heterogeneous-integration architectures, 2.5D/3D packaging roadmaps, and government subsidies that lower capital risk for back-end fabs. Wafer-to-wafer hybrid bonding moves from pilot to volume production as high-bandwidth memory (HBM) and chiplet-based processors demand sub-micron accuracy. Simultaneously, data-center optics move onto the package substrate, pulling photonic die attach into mainstream equipment specifications. Asia-Pacific keeps its cost leadership through OSAT clusters, while North America accelerates tool purchases on the back of the CHIPS Act funding. Equipment vendors that combine in-line metrology with machine-learning placement correction are gaining order share as users blend speed and precision requirements within one production line.
Key Report Takeaways
- By geography, Asia-Pacific held 67.8% of die bonder equipment market share in 2024 and is expanding at a 6.2% CAGR to 2030.
- By end-use industry, OSAT providers commanded 56.1% share of the die bonder equipment market size in 2024 and are advancing at a 5.5% CAGR through 2030.
- By throughput category, high-speed systems above 60,000 UPH captured 42.7% of die bonder equipment market share in 2024, whereas low-speed sub-30,000 UPH tools posted the strongest 5.9% CAGR to 2030.
- By equipment type, fully-automatic platforms held 53.2% of the die bonder equipment market size in 2024, yet wafer-to-wafer bonders record the highest 6.1% CAGR over the forecast horizon.
- By bonding technology, Epoxy Die Attach technology commanded 31.6% share of the die bonder equipment market size in 2024, and Hybrid and Direct Cu-Cu technology recorded the highest CAGR of 5.7% through 2030.
- By device type, logic and memory ICs accounted for 38.3% of the die bonder equipment market size in 2024, while photonics modules are projected to expand at a 6.3% CAGR between 2025 and 2030.
Global Die Bonder Equipment Market Trends and Insights
Drivers Impact Analysis
| Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Heterogeneous-integration chiplet boom | +1.2% | Global with APAC leadership | Medium term (2-4 years) |
| Advanced 2.5D/3D and hybrid bonding adoption | +0.9% | APAC core, spill-over to North America | Medium term (2-4 years) |
| Rapid uptake of compound-semiconductor power devices | +0.7% | Global, early gains in automotive hubs | Long term (≥ 4 years) |
| Data-center photonics and co-packaged optics | +0.8% | North America and EU data-center regions | Short term (≤ 2 years) |
| Government on-shoring subsidies for back-end fabs | +0.5% | United States, Japan, European Union | Long term (≥ 4 years) |
| Industry 4.0 push for fully-automatic high-UPH bonders | +0.4% | APAC manufacturing centers | Medium term (2-4 years) |
| Source: Mordor Intelligence | |||
Heterogeneous-integration and chiplet boom
Multi-tile processors move production away from single-die packages toward complex assemblies that require sub-micron placement repeatability. Intel’s 47-tile Ponte Vecchio GPU illustrates the jump in die count and material combinations that bonding platforms must manage in one cycle. Equipment suppliers therefore integrate adaptive vision, artificial-intelligence placement control, and tool-in-tool metrology to guarantee less than 1 µm overlay through temperature shifts. These enhancements tighten the link between bonder uptime and total package yield, creating a purchasing preference for systems that couple machine diagnostics with predictive maintenance dashboards.
Advanced 2.5D/3D and hybrid bonding adoption
Vertical interconnect density gains in HBM and logic-on-memory stacks require direct copper-to-copper joints that eliminate excess solder height. Alignment error budgets shrink below 50 nm, pushing suppliers such as EV Group to introduce wafer-to-wafer bonders that stage surface preparation, plasma activation, and fusion bonding in one vacuum module. APAC fabs pull most of the initial tool shipments, yet North American logic IDMs have begun qualifying the same hybrid bonding flows for AI accelerators.
Rapid uptake of compound-semiconductor power devices
Silicon-carbide traction inverters and gallium-nitride telecom power amplifiers must survive 200 °C junctions, driving demand for silver-sinter die attach. Such processes require high-force pressing and tight temperature uniformity, prompting dedicated bond head designs that lock die warpage during sintering. Automotive supply-chain quality audits push additional traceability features into the bonder software stack, further differentiating premium tool models.
Data-center photonics and co-packaged optics
As 800 G and 1.6 T switches migrate optics from the faceplate into the package substrate, photonic die attach becomes a rate limiter. Lasers and detectors must be bonded within a few micrometers horizontally and tens of nanometers vertically to preserve coupling efficiency. CommScope estimates that hyperscale transceiver volumes will double before 2030, putting pressure on bonder vendors to combine active-optical-power alignment with standard semiconductor placement cycles
Restraints Impact Analysis
| Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Ultra-high-precision CapEx burden for mid-tier OSATs | -0.8% | APAC mid-tier assembly providers | Short term (≤ 2 years) |
| Sub-micron alignment yield-loss risk | -0.6% | Global advanced packaging hubs | Medium term (2-4 years) |
| Precision component supply-chain bottlenecks | -0.4% | Global | Short term (≤ 2 years) |
| Fast technology obsolescence in bonding tools | -0.3% | Worldwide | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
Ultra-high-precision CapEx burden for mid-tier OSATs
Hybrid bonders cost three to five times more than conventional epoxy attach lines. Tier-1 houses absorb this surcharge via long-term memory and GPU contracts, yet mid-tier firms delay purchases, widening the capability gap. BE Semiconductor’s Q1 2025 order book shows almost all hybrid bonder revenue tied to the top six customers.[1]BE Semiconductor, “Q1 2025 Investor Presentation,” besi.com
Sub-micron alignment yield-loss risk
Journal work quantifies that heat haze alone can shift die recognition by ±1.2 µm even in cleanrooms. Cumulative stack-up errors across eight dies can therefore exceed pad-to-pad tolerances, forcing rework or scrap.[2]J-STAGE, “Thermal Fluctuation Behavior in Chip-on-Wafer Process,” jstage.jp Closed-loop vision serves as the primary mitigation, yet it slows cycle time and complicates preventive maintenance scheduling.
Segment Analysis
By Equipment Type: Automation drives volume production
Fully-automatic platforms retained a 53.2% share of the die bonder equipment market in 2024, owing to consumer-electronics volumes that still rely on epoxy die attach for wire-bond packages. Wafer-to-wafer bonders, however, are outpacing every other tool class with a 6.1% CAGR as HBM and logic-in-memory stacks require wafer-scale alignment rather than single-die placement. EV Group and SUSS MicroTec ship integrated lines that fuse plasma activation, cleaning, and bonding inside one vacuum transfer, giving producers a path to three-day cycle times from wafer prep to molded stack.
Growth in fully automated stations remains supported by Industry 4.0 retrofits. Tool controllers now exchange placement vectors and heating profiles with manufacturing execution systems, allowing factories to rebalance lines between epoxy attach in the morning and hybrid attach at night. Semi-automatic and manual stations continue to serve R&D and aerospace, where ultra-low volume lots require operator-assisted inspection.
Note: Segment shares of all individual segments available upon report purchase
By Bonding Technology: Hybrid methods gain momentum
Epoxy die attach accounted for a 31.6% share in 2024, yet direct copper-to-copper joints post a 5.7% CAGR as thermal budgets tighten in AI accelerators. Samsung and SK Hynix inserted hybrid bonding into HBM4 pilot runs, signaling the end of thermocompression for leading-edge memory. Thermosonic processes stay relevant for RF modules using gold studs, while eutectic attach retains a niche in high-reliability aerospace due to its proven 1,000-cycle thermal shock endurance.
Hybrid bonding’s rise redefines consumable demand. Adhesive tapes give way to plasma chambers, while copper planarization consumables see higher turnover. Equipment suppliers respond with field-upgrade kits that retrofit epoxy bonders with in-line barrier cleaning and nano-vacuum stations, extending legacy asset life for cost-sensitive users.
By Throughput Category: Precision versus speed trade-offs
High-speed bonders exceeding 60,000 UPH captured 42.7% of the die bonder equipment market share in 2024, serving smartphones and commodity memory. In contrast, sub-30,000 UPH bonders drive the highest 5.9% CAGR because photonics and MEMS need positional accuracy below 1 µm. Finetech’s femto 2 platform illustrates this positioning, offering 500 nm repeatability at one-tenth the cycle rate of mass-market tools.[3]Finetech, “FINEPLACER femto 2,” finetech.de
Mid-speed equipment between 30,000 and 60,000 UPH balances both camps and often ships to automotive suppliers that build radar and power modules on the same line. Mycronic’s HVM series integrates linear motors with air-bearing stages to preserve sub-1.5 µm overlay even at 45,000 UPH, a capability mix now specified by multiple Tier-1 automotive fabs.[4]Mycronic, “MRSI-HVM Die Bonder,” mycronic.com
By End-Use Industry: OSAT dominance continues
OSATs held 56.1% of the die bonder equipment market share in 2024, leveraging economies of scale and diversified customer portfolios. Amkor, ASE, and JCET collectively booked more than USD 2 billion in advanced-packaging CapEx during 2024, roughly 60% directed at hybrid bonding. IDM self-assembly remains focused on strategic processor or memory nodes, leaving legacy devices and overflow volumes to external partners.
Research labs and prototype foundries take up less than 5% of annual shipments numerically, but generate significant service revenue because they demand frequent reconfiguration and process consulting. Equipment makers package these accounts into long-term service agreements that guarantee software patching and spare-parts availability for at least ten years, reflecting longer amortization cycles.
Note: Segment shares of all individual segments available upon report purchase
By Device Type: Photonics leads growth
Logic and memory ICs still anchor 38.3% of the die bonder equipment market size, yet optical transceiver modules surpass every other category with a 6.3% CAGR through 2030. Silicon photonics co-packaged with 112G PAM4 SerDes requires ±2 µm fiber alignment in addition to standard electrical pad registration, lifting process complexity, and cycle time. Palomar’s 6532HP introduces real-time optical-power monitoring to tighten coupling metrics inside the bonder chamber.
MEMS and sensors maintain steady demand thanks to automotive pressure monitoring units and smartphone inertial sensors. Power and RF devices ride the compound-semiconductor expansion, necessitating bond heads that handle 50 N pressing forces and silver-sinter paste dispensing without contaminating neighboring copper tracks.
Geography Analysis
Asia-Pacific held 67.8% of the die bonder equipment market share in 2024 and is tracking a 6.2% CAGR to 2030. Taiwan funnels orders through its advanced packaging lines at TSMC and ASE, while South Korea’s memory giants allocate multi-year CapEx for hybrid bonding insertion. Malaysia’s Penang ecosystem absorbs overflow as local incentives under the National Semiconductor Strategy offset initial tooling costs.
North America benefits from USD 39 billion in CHIPS Act grants that underwrite new backend fabs in Texas, Arizona, and New York. These facilities prioritize wafer-to-wafer hybrid bonding for AI accelerators, pulling demand for high-precision stages sourced from European and Japanese vendors. Optical module assembly also returns to the United States as hyperscale data-center operators link bonder investments with domestic supply-chain security.
Europe focuses on automotive and industrial end-markets that reward reliability. German and French fabs concentrate on silver-sinter attach for SiC traction inverters, while Italian photonics start-ups invest in sub-micron die attach equipment for datacom. Incentive programs under the EU Chips Act create small but significant demand pockets, especially in 3D-integration pilot lines scheduled to ramp after 2026.
Competitive Landscape
The die bonder equipment market remains moderately concentrated. ASMPT, Kulicke & Soffa, and BE Semiconductor collectively control a significant share of revenue, yet niche innovators keep the field dynamic. Each leader pursues continuous R&D, earmarking roughly 10% of annual sales for process modules that stretch accuracy or throughput boundaries.
European suppliers such as EV Group and SUSS MicroTec differentiate through wafer bonding innovation, targeting memory stacks and chiplet bridges. Japanese incumbents, including Toray Engineering and Shinkawa, emphasize mechanical robustness, attracting automotive and aerospace clients that require a twenty-year tool life. Chinese entrants leverage cost advantages for conventional epoxy attach systems, nibbling at the low-margin segment once dominated by Western firms.
Strategic moves signal consolidation. Applied Materials purchased a 9% stake in BE Semiconductor to combine wafer-level deposition know-how with hybrid bonding expertise, while LG Electronics announced its first bonder prototype for HBM packaging, adding a fresh competitor with consumer-electronics scale. Alliances around control software interoperability also rise, easing factory-wide recipe transfers and shortening setup for multi-vendor lines.
Die Bonder Equipment Industry Leaders
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ASMPT Ltd.
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Kulicke and Soffa Industries Inc.
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BE Semiconductor Industries N.V.
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Hanmi Semiconductor Co., Ltd.
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Palomar Technologies Inc.
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- July 2025: LG Electronics initiates hybrid bonder development targeting HBM packaging equipment market.
- June 2025: Panasonic Connect launches YC-350NA1 full-digital TIG welding machine with waveform control.
- May 2025: Samsung and SK Hynix advance hybrid bonding for next-generation HBM.
- April 2025: Toray Engineering introduces UC5000 die bonder for panel-level packaging.
Global Die Bonder Equipment Market Report Scope
| Fully-Automatic Die Bonders |
| Semi-Automatic Die Bonders |
| Manual / Prototype Bonders |
| Wafer-to-Wafer Bonders |
| Epoxy / Adhesive Die Attach |
| Eutectic Die Attach |
| Flip-Chip (C4/Cu-pillar) |
| Thermocompression and Thermosonic |
| Hybrid and Direct Cu-Cu Bonding |
| Greater than 60 k UPH (High-speed) |
| 30-60 k UPH (Mid-speed) |
| Below 30 k UPH (Low-speed / High-precision) |
| Integrated Device Manufacturers (IDMs) |
| Outsourced Semiconductor Assembly and Test (OSATs) |
| Research and Prototyping Labs |
| Logic and Memory IC |
| Power and RF (SiC, GaN) |
| Photonics / Optical Transceivers |
| MEMS and Sensors |
| North America | United States |
| Canada | |
| Mexico | |
| South America | Brazil |
| Argentina | |
| Rest of South America | |
| Europe | Germany |
| United Kingdom | |
| France | |
| Italy | |
| Spain | |
| Rest of Europe | |
| Asia-Pacific | China |
| Japan | |
| South Korea | |
| India | |
| Rest of Asia-Pacific | |
| Middle East | Saudi Arabia |
| United Arab Emirates | |
| Rest of Middle East | |
| Africa | South Africa |
| Rest of Africa |
| By Equipment Type | Fully-Automatic Die Bonders | |
| Semi-Automatic Die Bonders | ||
| Manual / Prototype Bonders | ||
| Wafer-to-Wafer Bonders | ||
| By Bonding Technology | Epoxy / Adhesive Die Attach | |
| Eutectic Die Attach | ||
| Flip-Chip (C4/Cu-pillar) | ||
| Thermocompression and Thermosonic | ||
| Hybrid and Direct Cu-Cu Bonding | ||
| By Throughput Category (Units per Hour) | Greater than 60 k UPH (High-speed) | |
| 30-60 k UPH (Mid-speed) | ||
| Below 30 k UPH (Low-speed / High-precision) | ||
| By End-Use Industry | Integrated Device Manufacturers (IDMs) | |
| Outsourced Semiconductor Assembly and Test (OSATs) | ||
| Research and Prototyping Labs | ||
| By Device Type | Logic and Memory IC | |
| Power and RF (SiC, GaN) | ||
| Photonics / Optical Transceivers | ||
| MEMS and Sensors | ||
| By Geography | North America | United States |
| Canada | ||
| Mexico | ||
| South America | Brazil | |
| Argentina | ||
| Rest of South America | ||
| Europe | Germany | |
| United Kingdom | ||
| France | ||
| Italy | ||
| Spain | ||
| Rest of Europe | ||
| Asia-Pacific | China | |
| Japan | ||
| South Korea | ||
| India | ||
| Rest of Asia-Pacific | ||
| Middle East | Saudi Arabia | |
| United Arab Emirates | ||
| Rest of Middle East | ||
| Africa | South Africa | |
| Rest of Africa | ||
Key Questions Answered in the Report
How large will global die-attach tool demand be by 2030?
Shipment value is projected to reach USD 1.21 billion, implying a 4.2% compound growth trajectory.
Which bonding method is gaining traction for high-bandwidth memory?
Direct copper-to-copper hybrid bonding is replacing traditional thermocompression in HBM4 pilot lines, led by Korean memory manufacturers.
Why are OSATs important in next-generation packaging?
Outsourced houses hold 56.1% share and invest earlier in expensive sub-micron tools, letting fabless and IDM customers access advanced packages without full capital exposure.
What drives the surge in photonic die bonding?
800 G to 1.6 T switches demand co-packaged optics, pushing lasers and detectors onto substrates that require micrometer-level placement accuracy.
Which region leads equipment consumption today?
Asia-Pacific commands 67.8% of annual spending due to concentrated memory and OSAT fabs in Taiwan, South Korea, and Southeast Asia.
What risk do mid-tier assembly firms face?
The three-to-five-fold price premium of hybrid bonders strains cash flows, potentially accelerating consolidation as only the largest OSATs can justify the investment.
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