Die Attach Equipment Market - Growth, Trends, COVID-19 Impact, and Forecasts (2022 - 2027)

The Die Attach Equipment Market is segmented by Type (Die Bonder, Flip Chip Bonder), Bonding technique (Epoxy, Eutectic, Soft Solder, Hybrid Bonding), Application (Memory, RF & MEMS, LED, CMOS Image Sensor, Logic, Optoelectronics / Photonics), and Geography.

Market Snapshot

die bonder equipment market overview
Study Period: 2018 - 2026
Base Year: 2021
Fastest Growing Market: Asia Pacific
Largest Market: Asia Pacific
CAGR: 6.1 %
wire bonder equipment market

Need a report that reflects how COVID-19 has impacted this market and its growth?

Market Overview

The die attach equipment market is expected to register a CAGR of 6.1 % during the forecast period of 2021 - 2026. In recent trends, the demand of hybrid circuits has remained strong as emerging and existing applications in medical, military, photonics, wireless electronics, etc. The die-to-wafer hybrid bonding platform allows the semiconductor industry to extend beyond Moore's Law, providing unprecedented 2.5D and 3D integration flexibility required for next-generation electronics. C2W hybrid bonding is the promising emerging technology that can enable direct Cu- Cu bonding and has the potential to replace TCB for the 3D stacked memory and high-end logic application. However, C2W hybrid bonding is still in its early stages level and is expected to hit the market in 2021 for stacked memory and in 2022/23 for logic devices with 2.5D structures, which significantly assist the growth of the equipment market.

  • The demand for the AuSn Eutectic Die-Attach technique drives the market. Traditionally, various die-attach products, which include metal-filled conductive epoxies, high lead-containing solders, and gold-silicon solders were sufficient to mount the chip and have it perform reliably for the life of the device. However, the trend towards increasing heat generation, demand for compact devices, enactment of RoHS and REACH legislation, and the transition to GaAs chips limited the use of conventional materials. The demand for high reliability in devices has led engineers to evaluate various new materials for their die-attachment.
  • The suggested solder preforms are eutectic gold-tin and can be implemented for high volume or lab quantity adoption using a Palomar Technologies’ die bonder. This equipment is capable of handling the complete die-attach process, including high-accuracy pick-and-place of substrates, eutectic gold-tin preforms, and components; eutectic die-attach; and pulsed-heat reflow using a computer-controlled Pulse Heat Stage (PHS).
  • The demand for discrete power devices drives the market. The growing adoption of copper clips is growing as a substitute for more conventional wire and ribbon bonding. The packaging technologies for discrete power devices include die attach function. The adoption of wide-bandgap semiconductor die technologies (SiC and GaN) brings new innovative packaging solutions, including silver sintering die-attach (materials include epoxy molding compounds and interconnection materials). The progressive transition from discrete SiC towards SiC modules in EV/HEV applications, the embedded-die packaged systems, and the integration of GaN devices in multichip systems are just a few examples of such trend. This factor enhances the demand of the die attaches equipment for the discrete power devices.
  • Further, the impact of COVID-19 does not highly affect the demand for equipment. For instance, in April 2020, Palomar Technologies announced that they are getting demand for manufacturing critical semiconductor components to address COVID-19. They saw an acceleration of orders of their 3880 Die Bonder equipment to assist in wireless communications and networking bandwidth, remote medicine, IoT in robotics, and the use of video conferencing. Further, within the medical device market, their customers are rapidly ramping up the production of pressure sensors, which are crucial components used in respirators and ventilators, and this has resulted in a surge of orders for their 8000i Wire Bonder. Hence, overall the demand for equipment has not dropped drastically due to the pandemic.
  • However, mostly dimensional changes during processing and service life and mechanical unbalance of moving parts during processing through equipment challenges the equipment's functionality.

Scope of the Report

The die attach equipment offering includes multi-chip bonders for advanced packaging through market techniques such as epoxy, soft solder bonders, etc. to various applications such as Memory, RF & MEMS, LED, etc.

Die Bonder
Flip Chip Bonder
Bonding Technique
Soft Solder
Hybrid Bonding
Other Bonding Techniques
CMOS Image Sensor
Optoelectronics / Photonics
Other Applications
North America
United States
United Kingdom
Rest of Europe
Asia Pacific
Rest of Asia Pacific
Rest of the World
Latin America
Middle East and Africa

Report scope can be customized per your requirements. Click here.

Key Market Trends

LED to Witness Significant Growth

  • Die attach material represents a key role in the performance and reliability of mid, high, and super-high power LEDs. With an increasing LED penetration rate, the demand for die-attach equipment is increasing. The selection of suitable die-attach material for a particular chip structure and application depends on various considerations, which include packaging process (throughput and yield), performance (thermal dissipation output and light output), reliability (lumen maintenance), and cost. Eutectic gold-tin, silver-filled epoxies, solder, silicones, and the sintered materials have all been used for LED die attach.
  • For instance, SFE provides an Epoxy Adhesive bonding method where its LED Epoxy Die Bonder machine features an index time of 0.2 Sec /Cycle (90 Percent Rate of Operation) with a chip size of 250 * 250 standard providing lead frame recognition through 2 Camera. Its software function provides auto mount level & pick up level teaching function.
  • Further, conductive adhesives (mostly silver-filled epoxies) constitute the largest class of thermal die-attach materials (by unit number) for LEDs. They are compatible with existing back-end packaging equipment and provide an attractive cost/performance balance (typically up to 50 W/mK thermal with the secondary reflow compatibility). As they stick to bare silicon, they are the most preferred material for dies without back-end metallization like GaN on silicon.
  • Further, in the LED market, there are a lot of rivals or competitors, and ASM is one of the prominent players in this market, and its LED Epoxy High speed die bonder AD830 dominates in the LED market. It is fast, reliable, accurate with die placement accuracy of +/-1 mil and +/-3 degree, cycle time for a small chip like 10mil x 10mil is 180 ms, which is an equivalent UPH of 18,000. It is equipped with a Post bond inspection system that monitors the bonded unit at the pre-set placement range.
  • Furthermore, in June 2019, ASM AMICRA launched a new CoS (Chip-on-Submount) die-bonder, which won the 2019 Productronica Innovation Award. This new machine combines the company’s dynamic alignment system with the new handling technologies, and while comparing to the industry average, it has significantly shorter cycle times of 6 seconds. Further, it also provides a massive increase in productivity and an accuracy of ±3 µm @ three sigmas, which represents a new industry standard in accuracy and productivity in LED solutions.
die bonder equipment market trends

Asia-Pacific Accounts for Significant Market Growth

  • Asia-Pacific accounted for the significant growth of the die attach equipment industry. More than 60% of OSAT (Outsourced Semiconductor Assembly And Test) players present across the world have their headquarters in the APAC region. These OSAT companies use die-attach equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs (Integrated Device Manufacturer) in the region is expected to boost the market growth in the near future.
  • The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die-attach equipment in the assembly process of these components. Further, South Korea, China, and mostly Japan's old age population are anticipated to accelerate the need for healthcare services during the forecast period, thus providing scope for devices, such as ventilators, dialysis, and blood pressure monitoring devices constituting MEMS pressure sensors. The United Nations estimates that the geriatric population in the region, aged 60 years and older, could reach around 606.55 million, by 2020. The instance caters to the growth of the market due to the demand for die-attach equipment for MEMS pressure sensor.
  • Furthermore, India is also witnessing growth in a number of smart cities, due to government initiatives and are expected to incorporate electronic solutions for purposes, such as surveillance, maintenance, monitoring, etc. According to smartcities.gov.in, the central government has allotted USD 977 million into the development of 60 such smart cities. This leads to the demand for a higher number of CMOS image sensors, which further supports the market growth.
  • High Power lasers are finding extensive demand in industrial sectors for a wide range of applications, including cutting, welding, and fabrication. Companies are moving towards Laser technologies to take advantage of high performance and reliability. In December 2019, Mitsubishi Electric Corporation launched the ML562G86 pulse laser diode (LD) for projectors, featuring a vibrant 638-nanometer (nm) red light, the output power of 3.0W under pulse operation and mean time to failure1 (MTTF) of over 20,000 hours. The advancement in laser diode significantly increases the demand for equipment, which processes the technique of Epoxy and Eutectic bonding.
  • Further memory demand is expected to increase with the development of IoT, AI, and ADAS. As a result, productivity improvement in memory chip manufacturing and improvement of post-processing device reliability will be required more than in the past. To address this, in December 2019, DISCO Corporation has developed DDS2320, a fully automatic die separator capable of processing ∅300 mm wafers that contributes to improved throughput and reliability in memory production.
die bonder equipment market growth by region

Competitive Landscape

The die attach equipment market is fragmented in nature as the presence of local and global players penetrates the intense rivalry in the market. Further, players are focusing on improving their equipment performance in terms of throughput and yield by development, partnership making the market more competitive. Key players are Be Semiconductor Industries N.V., ASM Pacific Technology Limited, etc. Recent developments in the market are -

  • March 2020 - Electroninks announced that it is entering into a strategic alliance with Enjet Inc. to support advanced manufacturing of display, touchpanel, and packaging products. Electroninks and Enjet will collaborate together as a team to supply conductive ink printing at less than 10um in several markets, including micro-LED, mini-LED, EMI Shielding, and die-attach/interconnect applications.

Table of Contents


    1. 1.1 Study Deliverables

    2. 1.2 Study Assumptions

    3. 1.3 Scope of the Study




    1. 4.1 Market Overview

    2. 4.2 Market Drivers

      1. 4.2.1 Growing Demand of AuSn Eutectic Die-Attach Technology

      2. 4.2.2 Demand of Discrete Power Devices

    3. 4.3 Market Restraints

      1. 4.3.1 Dimensional Changes During Processing and Service Life and Mechanical Unbalance

    4. 4.4 Industry Value Chain Analysis​

    5. 4.5 Industry Attractiveness - Porter's Five Forces Analysis​

      1. 4.5.1 Threat of New Entrants

      2. 4.5.2 Bargaining Power of Buyers/Consumers

      3. 4.5.3 Bargaining Power of Suppliers

      4. 4.5.4 Threat of Substitute Products

      5. 4.5.5 Intensity of Competitive Rivalry


    1. 5.1 Type

      1. 5.1.1 Die Bonder

      2. 5.1.2 Flip Chip Bonder

    2. 5.2 Bonding Technique

      1. 5.2.1 Epoxy

      2. 5.2.2 Eutectic

      3. 5.2.3 Soft Solder

      4. 5.2.4 Hybrid Bonding

      5. 5.2.5 Other Bonding Techniques

    3. 5.3 Application

      1. 5.3.1 Memory

      2. 5.3.2 RF & MEMS

      3. 5.3.3 LED

      4. 5.3.4 CMOS Image Sensor

      5. 5.3.5 Logic

      6. 5.3.6 Optoelectronics / Photonics

      7. 5.3.7 Other Applications

    4. 5.4 Geography

      1. 5.4.1 North America

        1. United States

        2. Canada

      2. 5.4.2 Europe

        1. Germany

        2. United Kingdom

        3. France

        4. Rest of Europe

      3. 5.4.3 Asia Pacific

        1. Taiwan

        2. China

        3. Japan

        4. Rest of Asia Pacific

      4. 5.4.4 Rest of the World

        1. Latin America

        2. Middle East and Africa


    1. 6.1 Company Profiles

      1. 6.1.1 Palomar Technologies, Inc.

      2. 6.1.2 Shinkawa Ltd.

      3. 6.1.3 MicroAssembly Technologies, Ltd.

      4. 6.1.4 ASM Pacific Technology Limited

      5. 6.1.5 Be Semiconductor Industries N.V.

      6. 6.1.6 Kulicke and Soffa Industries, Inc.

      7. 6.1.7 Dr. Tresky AG

      8. 6.1.8 Fasford Technology Co Ltd.

      9. 6.1.9 Inseto UK Limited

      10. 6.1.10 Anza Technology Inc.

    2. *List Not Exhaustive


You can also purchase parts of this report. Do you want to check out a section wise price list?

Frequently Asked Questions

The Die Attach Equipment Market market is studied from 2018 - 2026.

The Die Attach Equipment Market is growing at a CAGR of 6.1% over the next 5 years.

Asia Pacific is growing at the highest CAGR over 2021- 2026.

Asia Pacific holds highest share in 2020.

Palomar Technologies, Inc., Shinkawa Ltd., MicroAssembly Technologies, Ltd. , ASM Pacific Technology Limited, Be Semiconductor Industries N.V. are the major companies operating in Die Attach Equipment Market.

80% of our clients seek made-to-order reports. How do you want us to tailor yours?

Please enter a valid email id!

Please enter a valid message!