Embedded Die Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The Embedded Die Packaging Market is segmented by Platform (Die in Rigid Board, Die in Flexible Board, IC Package Substrate), End-user (Consumer Electronics, IT & Telecommunications, Automotive, Healthcare), and Geography.

Embedded Die Packaging Market Size

Embedded Die Packaging Market Analysis

The Embedded Die Packaging Market is expected to register a CAGR of 22.4% during the forecast period.

  • Growing miniaturization of devices is driving the market as products are becoming increasingly smaller and embed more functionality. Micromachining and nanotechnology play an increasingly important role in the miniaturization of components ranging from biomedical applications to chemical microreactors and sensors. For instance, Bluetooth wifi modules requires minimal circuit board area on today's high-density mobile devices.
  • Improved electrical & thermal performance is driving the market. For power management and mobile-wireless application the embedded technology has been evaluated to replace assembles fabrication by not only thinner thickness but due to superior thermal performance. The thermal performance of embedded die is better than PQFN with copper clip about 17%. Also a new and expandable advanced package for power devices is developed using embedded dies and redistribution layer (RDL) technology for electric car to improve the electric and thermal performance.
  • Further, owing to its excellent electrical performance at high frequencies, the technology is also being perceived as a promising technology for emerging telecommunication applications. Various advantages that aid the deployment of the technology in telecommunication applications include increased functionality and efficiency of the electronic circuits, power and signal inductance, improved reliability, and higher signal density.
  • Difficulty to test, inspect and rework, the embedded die technology challenges the market to grow. As features (lines and spaces) shrink to 2µm and below, it becomes more difficult to see defects. In addition, finding debris in via holes becomes a concern in some applications.
  • Since the outbreak of COVID-19, the electronics industry has been hit severely, with a significant influence on its supply chain and production facilities. The production came to a stand still in China and Taiwan during February and March, which influenced various OEMs across the world.

Embedded Die Packaging Industry Overview

The embedded die packaging market is fragmented due to the growing number of end-users in automotive, industrial, and consumer electronics. The existing players in the market are striving to maintain a competitive edge by catering to newer technologies, such as 5G telecommunication, high-performance data centers, compact electronic devices, etc. Key players are Microsemi Corporation, Fujikura Ltd, etc. Recent developments in the market are -

  • October 2020 - The U.S. Department of Defence awarded Intel Federal LLC the second phase of its Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the US government to access Intel's state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel's tens of billions of dollars of annual R&D and manufacturing investment. The project is executed by the Naval Surface Warfare Centre, Crane Division, and administered by the National Security Technology Accelerator.
  • Sep 2019 - Achronix Semiconductor Corporation, a leading supplier in FPGA-based hardware accelerator devices and high-performance eFPGA IP, joined the TSMC IP Alliance Program, a key component of TSMC Open Innovation Platform (OIP). Achronix demonstrated how its Speedcore IP is uniquely sized and optimized for each customer's application in its booth at TSMC Open Innovation Platform Ecosystem Forum.

Embedded Die Packaging Market Leaders

  1. Microsemi Corporation

  2. Fujikura Ltd.

  3. Infineon Technologies AG

  4. ASE Group

  5. AT&S Company

  6. *Disclaimer: Major Players sorted in no particular order
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Embedded Die Packaging Market News

 

Embedded Die Packaging Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing Miniaturization of Devices
    • 4.2.2 Improved Electrical and Thermal Performance
  • 4.3 Market Restraints
    • 4.3.1 Difficulty to Inspect, Test and Rework
  • 4.4 Industry Value Chain Analysis
  • 4.5 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.5.1 Bargaining Power of Suppliers
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Threat of New Entrants
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Impact of COVID-19 on the Market

5. TECHNOLOGY SNAPSHOT

  • 5.1 PCB Miniaturization
  • 5.2 Advanced Embedded Active System Integration

6. MARKET SEGMENTATION

  • 6.1 Platform
    • 6.1.1 Die in Rigid Board
    • 6.1.2 Die in Flexible Board
    • 6.1.3 IC Package Substrate
  • 6.2 End User
    • 6.2.1 Consumer Electronics
    • 6.2.2 IT and Telecommunications
    • 6.2.3 Automotive
    • 6.2.4 Healthcare
    • 6.2.5 Other End Users
  • 6.3 Geography
    • 6.3.1 Americas
    • 6.3.2 Europe and MEA
    • 6.3.3 Asia-Pacific

7. COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Microsemi Corporation
    • 7.1.2 Fujikura Ltd
    • 7.1.3 Infineon Technologies AG
    • 7.1.4 ASE Group
    • 7.1.5 AT&S Company
    • 7.1.6 Schweizer Electronic AG
    • 7.1.7 Intel Corporation
    • 7.1.8 Taiwan Semiconductor Manufacturing Company
    • 7.1.9 Shinko Electric Industries Co. Ltd
    • 7.1.10 Amkor Technology
    • 7.1.11 TDK Corporation
  • *List Not Exhaustive

8. INVESTMENT ANALYSIS

9. MARKET OPPORTUNITIES AND FUTURE TRENDS

**Subject to Availability
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Embedded Die Packaging Industry Segmentation

Embedded die is described as a passive component or an IC (integrated circuit) that is placed or formed on an inner layer of an organic circuit board, module, or chip package. With increase in number of portable electronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies is driving the market growth.

Platform Die in Rigid Board
Die in Flexible Board
IC Package Substrate
End User Consumer Electronics
IT and Telecommunications
Automotive
Healthcare
Other End Users
Geography Americas
Europe and MEA
Asia-Pacific
Platform
Die in Rigid Board
Die in Flexible Board
IC Package Substrate
End User
Consumer Electronics
IT and Telecommunications
Automotive
Healthcare
Other End Users
Geography
Americas
Europe and MEA
Asia-Pacific
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Embedded Die Packaging Market Research FAQs

What is the current Embedded Die Packaging Market size?

The Embedded Die Packaging Market is projected to register a CAGR of 22.4% during the forecast period (2025-2030)

Who are the key players in Embedded Die Packaging Market?

Microsemi Corporation, Fujikura Ltd., Infineon Technologies AG, ASE Group and AT&S Company are the major companies operating in the Embedded Die Packaging Market.

Which is the fastest growing region in Embedded Die Packaging Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in Embedded Die Packaging Market?

In 2025, the North America accounts for the largest market share in Embedded Die Packaging Market.

What years does this Embedded Die Packaging Market cover?

The report covers the Embedded Die Packaging Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Embedded Die Packaging Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

Page last updated on: June 9, 2023

Embedded Die Packaging Industry Report

Statistics for the 2025 Embedded Die Packaging market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Embedded Die Packaging analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.

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