WIRELESS CHARGING IC MARKET SIZE & SHARE ANALYSIS - GROWTH TRENDS AND FORECAST (2025 - 2030)

Global Wireless Charging IC Market Trends and Insights

Expanding attach-rates of wireless charging in flagship and mid-tier smartphones

Mainstream handset makers are rapidly embedding 15 W – 30 W coils, ending wireless power’s era as only a flagship flourish. Renesas and Qualcomm demonstrated a 30 W mid-range reference design achieving 85% efficiency while shrinking board area by 40%, slashing bill-of-materials costs, and catalyzing volume economics that ripple across every IC in the stack. Higher attach-rates spread manufacturing overhead across tens of millions of units, enabling tighter cost targets without sacrificing thermal or EMI headroom. Semiconductor vendors now prioritize turnkey modules that bundle power control, FOD, and foreign-object detection firmware so OEMs can drop in fast. The result is an inflection where wireless charging becomes a default expectation, not a differentiation. That in turn spurs operators of cafés, airports, and ride-hailing fleets to proliferate transmitters, reinforcing transmitter IC demand.

Regulatory push for port-less devices

Europe’s Common Charger Directive mandates USB-C by December 2024 but simultaneously nudges brands toward ultimately ditching physical ports to sidestep future rules and improve ingress protection. ^{[1]European Commission, “Commission Welcomes Political Agreement on EU Common Charger,” ec.europa.eu} China’s IPX8 durability guidelines have already elevated sealed chassis designs that rely entirely on induction. These overlapping edicts converge on a single architectural response: drop exposed connectors. Wireless Charging IC suppliers, therefore, find themselves supplying the compliance “escape hatch” strategy. To satisfy both high water-resistance and electorate pressure for e-waste reduction, OEMs are re-architecting boards around Qi2 receiver controllers and simplified PMIC chains. Compliance deadlines are short, so design-in windows are even shorter, making ready-certified ICs with pre-tested reference stacks an immediate purchasing priority.

Automakers adopting in-cabin inductive pads as a standard comfort feature

Vehicle makers have crossed the 50% global installation threshold for factory-equipped inductive chargers, with U.S. penetration as high as 87% by 2024. Cadillac, Mercedes-Benz, and Hyundai now bundle pads across most trims, reframing wireless charging as a cabin hygiene and connectivity feature equal to USB ports a decade ago. The design envelope forces ICs to tolerate −40 °C to +85 °C junction temperatures and keep EMI beneath stringent UNECE R10 limits, birthing specialized automotive-grade transmitters such as NXP’s MWCT2xx3A that accept 5 V–48 V battery rails and drive dual coils with Qi and proprietary protocols. Success in the dashboard quickly seeds demand in consoles, rear seats, and even pickup truck beds, multiplying semiconductor content per vehicle.

Rapid adoption of 15 W–50 W wireless charging in industrial handhelds and AMRs

Factory and warehouse operators now prefer inductive docks that erase pogo-pin corrosion and allow round-the-clock robots. ResGreen’s LilBuddy AMR leverages WiBotic’s system to recharge autonomously, delivering 24/7 uptime without human intervention. ^{[2]WiBotic, “WiBotic Provides Wireless Charging Capabilities for ResGreen's LilBuddy Autonomous Mobile Robots,” wibotic.com} Powermat’s SmartInductive platform scales to 300 W across 150 mm gaps, a threshold that once belonged solely to wired adapters. These deployments demand ruggedized GaN-based drivers and extended −40 °C to 105 °C ambient ratings, pushing ASPs higher than consumer parts. Over the long term, every converted forklift, barcode scanner, and mobile cobot amplifies unit sales of medium-power controllers and companion gate drivers.

EMI compliance failures above 65 W limiting notebook design wins

European CE and Japan TELEC rules treat wireless power devices above 9 kHz as both intentional and unintentional radiators, forcing adherence to Parts 15 and 18 of FCC analogues and creating a dual hurdle. Murata’s testing shows inverter-generated common-mode noise that spills into LTE and Wi-Fi bands unless designers add bulky chokes and low-ESL capacitors. ^{[3]Murata Manufacturing, “Noise Suppression Methods in Qi Standard Wireless Chargers,” corporate.murata.com} This extra BOM stymies thin-and-light laptop roadmaps and persuades ODMs to stay wired for now. The opportunity cost is significant: notebooks represent a 120 million-unit annual addressable base that remains largely untapped for Wireless Charging IC market growth. Until silicon providers bake in spread-spectrum control or active filtering at die level, many OEMs will keep power levels beneath the 65 W threshold, capping revenue expansion.

Fragmented proprietary standards leading to OEM supply-chain lock-ins

More than 9,000 Qi-certified SKUs coexist with vendor-specific tweaks that raise power or add magnets, fracturing the ecosystem. Component makers must spin multiple die variants, fracturing economies of scale and elongating qualification cycles. Smaller wearables brands face all-or-nothing tooling decisions that can trap them into single-source chipsets, eroding bargaining power and tempering price competition. In markets like automotive rear-seat entertainment, stalemates over power handshake protocols delay rollouts entirely, depriving the Wireless Charging IC market of otherwise ready unit volume. Unless cross-certification improves or AirFuel’s resonance spec converges, procurement risk will remain a deterrent.

Segment Analysis

By IC Type: Transmitter momentum reshapes value capture

Transmitter controllers represented a minority of 2024 unit shipments, yet are scaling almost five times faster than receivers as every airport lounge, stadium seat, and electric SUV console adds surface real estate for multiple devices. The Wireless Charging IC market size for transmitters is projected to climb from USD 1.93 billion in 2025 to USD 6.79 billion in 2030, equivalent to a 24.52% CAGR, while the Wireless Charging IC market share of receivers declines fractionally despite still-rising absolute volumes.

Receiver dominance historically rested on smartphones but is thinning because each charger can service thousands of different phones over its lifetime, skewing lifetime TAM toward infrastructure. Adaptive modes such as Renesas’ WattShare let a handset flip roles and power another accessory, further blurring categorical lines and nudging OEMs to integrate combo Tx/Rx dies. On the transmitter side, NXP’s MWCT2xx3A can parallel-drive dual Qi coils from a 48 V rail, doubling pad area coverage inside EV dashboards without PCB sprawl. In the medium term, ASPs for automotive-qualified Tx dies command 20–30% premiums over consumer Rx chips despite similar node geometries, steering profitability toward infrastructure silicon vendors.

By Power Rating: High-power frontier unlocks premium ASPs

Sub-20 W solutions still occupy nearly half of 2024 shipments because mid-range phones, wearables, and hearables are content at 5 W to 15 W. However, the >100 W category is set to grow fastest as automakers pursue 11 kW onboard pads that charge vehicle traction packs and as factories demand 300 W robot docks. This slice of the Wireless Charging IC market size is forecast to post a 23.67% CAGR through 2030, nudging its Wireless Charging IC market share from single digits toward low-teens territory.

Technology maturity hinges on GaN FET cost curves. EPC’s 2024 analysis shows 400 V-class GaN die now rivals silicon price per amp, discrediting cost-barrier myths. Infineon’s CoolGaN reference achieves MHz resonant transfer at 300 W across air gaps suited to forklifts, demonstrating EMI-safe scaling paths. As BOMs consolidate around integrated gate drivers, designers can spend saved footprint on thicker shielding or active cooling, hedging thermal-runaway concerns. Once ASPs normalise, even motorcycle fast chargers could migrate to induction, broadening TAM beyond early automotive leads.

By Charging Standard: Qi2’s magnetic upgrade keeps incumbency while AirFuel resonates

Qi maintained a commanding 76.54% hold in 2024, yet AirFuel resonance is drawing design wins for multi-device mats where free-placement convenience outweighs slightly higher system costs. Apple’s MagSafe magnet array is now enshrined in Qi2, giving the consortium control over the user-alignment story and neutralising part of AirFuel’s ergonomic edge. The new Qi2.2 bump to 25 W addresses complaints about sluggish tablet charging while adding AI-optimised charge curves.

Even so, AirFuel’s 23.84% CAGR indicates there is room for coexistence where vertical space or orientation tolerance is vital, such as restaurant tables or industrial carts. Proprietary standards linger in medical implants or rugged laptops where regulatory or IP rationales override mass-market compatibility. Semiconductor vendors hedge bets with configurable firmware that supports multiple handshake layers, protecting die investments while the standards contest plays out.

Note: Segment shares of all individual segments available upon report purchase

By Application: Automotive surge eclipses smartphone maturity

Smartphones and tablets still consume 54.37% shipment share, yet growth moderates as penetration curves flatten. In contrast, automakers are integrating pads into front, rear, and even cargo areas, posting a 22.78% CAGR as cabin electronics architectures pivot to decluttered dashboards. Chevrolet’s Active Phone Cooling underscores how brands are layering thermal management on top of power delivery, driving demand for Tx controllers with NTC sensing and adaptive frequency dithering to keep coil temps below 60 °C.

Industrial handhelds are next in the queue, moving from pogo pins to sealed housings that survive caustic wash-downs. Medical devices such as Implantica’s wireless energizing platform open high-margin niches; although volumes are smaller, ASPs climb past USD 6 per Rx die due to traceability and ISO 13485 qualification overheads. Together, these segments diversify revenue away from the phone cycle and buffer suppliers against handset seasonality.

Geography Analysis

Asia-Pacific’s 39.48% revenue share stems from China’s contract-manufacturing gravity, Japan’s component depth, and South Korea’s Tier-1 automotive electronics pipelines. Government subsidies for 300 mm fabs and Shenzhen’s tight design-to-tape-out loops compress iteration cycles, keeping regional costs low and first-to-market perks high. Local OEM eagerness to flaunt Qi2 compliance has created a pull effect for transmitter reference designs sourced from Shanghai-based ODMs, further amplifying demand.

North America shows maturity rather than explosive growth; yet U.S. vehicle buyers’ 87% in-cabin pad adoption sets a per-unit silicon envelope triple that of Europe, because many models expose two or more simultaneous charge bays. Regulatory leniency toward GaN FET frequencies eases high-power rollouts, and venture capital clustering in California funds far-field beaming startups that may inject new categories of ICs late in the decade. Canada and Mexico ride contiguous supply chains, converting existing infotainment plants to wireless capable lines without the CapEx shock of greenfield factories.

Europe balances opportunity and constraint. Automaker commitments such as BMW’s rear-seat executive tablet docks raise transmitter volumes, yet CE certification adds layers of EMI paperwork that prolong time-to-market. Meanwhile, Brazil’s highway infrastructure blueprint-mandating induction pads at toll plazas-catapults South America into the fastest-growing status at 22.93% CAGR. Anatel’s relatively streamlined homologation offsets currency risk and gives local distributors an edge, luring Asian chipmakers to set up São Paulo field-application offices. The Middle East benefits from hospitality chains installing multi-coil furniture in airports and hotels, while Africa edges forward thanks to rugged kiosk rollouts where wireless avoids vandal-prone connectors.