Semiconductor Packaging Market Size, Share, Growth Forecast & Industry Analysis (2025 - 2030)

The Report Covers Semiconductor Packaging Market Trends and is Segmented by Packaging Platform (Advanced Packaging (Flip Chip, SIP, 2. 5D/3D, Embedded Die, Fan-In Wafer Level Packaging, and Fan-Out Wafer Level Packaging) and Traditional Packaging), End-User Industry (Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive, and Energy and Lighting), and Geography (United States, China, Taiwan, Korea, Japan, Europe, and Rest of the World). The Market Size and Forecasts are Provided in Terms of Value (USD) for all These Segments.

Semiconductor Packaging Market Size, Share, Growth Forecast & Industry Analysis (2025 - 2030)

Semiconductor Packaging Market Size

Semiconductor Packaging Market Summary
Study Period 2019 - 2030
Base Year For Estimation 2024
Forecast Data Period 2025 - 2030
Market Size (2025) USD 104.16 Billion
Market Size (2030) USD 146.43 Billion
CAGR (2025 - 2030) 7.05 %
Market Concentration Medium

Major Players

Semiconductor Packaging Market Major Players

*Disclaimer: Major Players sorted in no particular order

Compare market size and growth of Semiconductor Packaging Market with other markets in Technology, Media and Telecom Industry

Automation

Digital Commerce

Electronics

Information Technology

Media and Entertainment

Security & Surveillance

Semiconductor Packaging Market Analysis

The Semiconductor Packaging Market size is estimated at USD 104.16 billion in 2025, and is expected to reach USD 146.43 billion by 2030, at a CAGR of 7.05% during the forecast period (2025-2030).

The semiconductor packaging industry is experiencing transformative changes driven by technological advancements and evolving market demands. The telecommunications sector's evolution from basic signal exchange to complex data transmission has created unprecedented demands for advanced semiconductor packaging solutions. In February 2024, the US government allocated USD 42 million toward fostering wireless innovation, establishing testing facilities in the Dallas Technology Corridor and Washington DC. This investment reflects the growing importance of semiconductor packaging technology in enabling next-generation communication technologies, particularly in supporting 5G and emerging 6G applications.


The industry is witnessing significant infrastructure developments, particularly in data center capabilities and cloud computing. As of March 2024, the United States hosts 5,381 data centers, leading global data center infrastructure deployment. This expansion is driving demand for advanced semiconductor packaging solutions that can support high-performance computing, artificial intelligence, and data processing requirements. The increasing complexity of semiconductor applications has led to innovations in packaging in the semiconductor industry technologies, including 2.5D/3D stacking, fan-out wafer-level packaging, and system-in-package solutions.


The defense and aerospace sectors are emerging as crucial drivers for semiconductor packaging market growth. In March 2023, the United States proposed a defense budget of USD 886 billion, with significant allocations for research and development in advanced technologies. This investment is spurring developments in specialized packaging solutions that can meet the stringent requirements of military and aerospace applications, including enhanced durability, reliability, and performance under extreme conditions.


The industry is experiencing significant pricing and capacity adjustments to meet evolving market demands. TSMC, a leading semiconductor manufacturer, announced in June 2024 a 5% increase in 3nm technology prices and a 10-20% rise in advanced packaging rates for the coming year. This pricing strategy reflects the growing sophistication of packaging technologies and the increasing demand for advanced solutions, particularly in AI accelerators, premium smartphones, and data centers. The medical device sector is also showing promising growth, with Taiwan's production reaching USD 8,928,333 in 2023, indicating expanding applications for semiconductor packaging in healthcare technologies.

Segment Analysis: By Advanced Packaging

Flip-chip Segment in Semiconductor Packaging Market

The flip-chip packaging segment continues to dominate the semiconductor packaging market, commanding approximately 50% of the total market share in 2024. This significant market position is driven by the segment's superior electrical performance, reduced signal inductance, and higher signal density capabilities. The technology's ability to provide shorter interconnect paths between the die and substrate has made it particularly attractive for high-performance computing applications and mobile devices. Major semiconductor manufacturers are increasingly adopting flip-chip packaging technology for their advanced processor designs, particularly in applications requiring high I/O density and improved thermal performance. The segment's dominance is further reinforced by its versatility in various package formats, including Ball Grid Array (BGA) and chip-scale packaging (CSP) configurations, making it suitable for a wide range of applications from mobile devices to high-end computing systems.

Market Analysis of Semiconductor Packaging Market: Chart for By Advanced Packaging

Embedded Die Segment in Semiconductor Packaging Market

The embedded die segment is emerging as the fastest-growing segment in the semiconductor packaging market, with a projected growth rate of approximately 30% during the forecast period 2024-2029. This remarkable growth is primarily driven by the increasing demand for miniaturization in electronic devices and the segment's ability to provide enhanced functionality in smaller form factors. The technology's capability to integrate multiple components within a single package while reducing overall system size makes it particularly attractive for emerging applications in 5G communications, automotive electronics, and Internet of Things (IoT) devices. The segment is witnessing significant technological advancements, particularly in areas such as thermal management and reliability enhancement, which are further accelerating its adoption across various end-user industries.

Remaining Segments in Advanced Packaging

The semiconductor packaging market encompasses several other significant segments including 2.5D/3D Stacked, system-in-package (SiP), Wafer Level CSP/Fan-in, and Fan-out technologies. The 2.5D/3D Stacked segment is particularly noteworthy for enabling high-performance computing applications and advanced memory integration. System-in-package technology continues to be crucial for integrating multiple dies and components in a single package, especially in mobile and IoT applications. The Wafer Level CSP/Fan-in segment serves the market's need for compact and cost-effective packaging solutions, while Fan-out technology addresses the requirements for higher integration density and improved thermal performance in advanced semiconductor devices. Each of these segments plays a vital role in meeting diverse packaging requirements across different applications and industries.

Segment Analysis: By End User

Mobile and Consumer Segment in Semiconductor Packaging Market

The Mobile and Consumer segment dominates the semiconductor packaging market, commanding approximately 67% market share in 2024, driven by the increasing adoption of smartphones, wearable devices, and other consumer electronics. The segment's growth is primarily fueled by the rising penetration of 5G smartphones, with 5G adoption expected to reach nearly 73% of all smartphone shipments in 2024. The integration of advanced features in consumer electronics, including IoT capabilities, AI functionalities, and enhanced computing power, continues to drive the demand for sophisticated semiconductor packaging solutions. The segment's robust performance is further supported by the growing demand for smart home devices, gaming consoles, and personal computing devices, which require increasingly complex packaging solutions to accommodate higher processing power and improved thermal management capabilities.

Automotive and Transportation Segment in Semiconductor Packaging Market

The Automotive and Transportation segment is emerging as the fastest-growing segment in the semiconductor packaging market, projected to grow at approximately 18% during 2024-2029. This remarkable growth is primarily driven by the increasing electrification of vehicles, the rising adoption of advanced driver assistance systems (ADAS), and the growing integration of sophisticated infotainment systems. The segment's growth is further accelerated by the automotive industry's shift towards electric vehicles, with EV sales expected to account for about 14% of total vehicle sales globally. The increasing implementation of autonomous driving features, connected car technologies, and advanced safety systems is creating substantial demand for sophisticated semiconductor packaging solutions that can withstand harsh automotive environments while delivering high performance and reliability.

Remaining Segments in End User Segmentation

The Telecom and Infrastructure segment, along with the Industrial, Aerospace & Defense and Others segment, continue to play vital roles in shaping the semiconductor packaging market landscape. The Telecom and Infrastructure segment is particularly significant due to the ongoing 5G network deployments, data center expansions, and the increasing demand for high-performance computing applications. The Industrial, Aerospace & Defense and Others segment, while smaller in market share, remains crucial for specialized applications requiring highly reliable and robust packaging solutions. These segments are characterized by their unique requirements for advanced packaging technologies that can support high-performance computing, enhanced connectivity, and mission-critical applications across various industrial and defense applications.

Semiconductor Packaging Market Geography Segment Analysis

Semiconductor Packaging Market in Taiwan

Taiwan continues to dominate the global semiconductor packaging market, commanding approximately 53% of the market in 2024. The country's prominence is largely attributed to the presence of key industry leaders like TSMC and ASE Technology, who have established Taiwan as a global hub for advanced packaging technologies. The region's expertise in packaging solutions spans from traditional methods to cutting-edge technologies like 2.5D/3D packaging and fan-out wafer-level packaging. Taiwan's semiconductor packaging industry benefits from a robust ecosystem that includes strong research and development capabilities, a skilled workforce, and advanced manufacturing facilities. The country's packaging vendors are actively expanding their capabilities in areas like heterogeneous integration and advanced system-in-package solutions. Taiwan's commitment to innovation is evident in its continuous investment in new packaging technologies and expansion of production capabilities, particularly in high-performance computing and artificial intelligence applications. The region's packaging industry is further strengthened by close collaboration between foundries, packaging houses, and substrate manufacturers, creating an integrated value chain that enhances operational efficiency and technological advancement.

Market Analysis of Semiconductor Packaging Market: Forecasted Growth Rate by Region

Semiconductor Packaging Market in China

China's semiconductor packaging sector is experiencing remarkable growth, projected to expand at approximately 12% annually from 2024 to 2029. The country's packaging industry is undergoing a significant transformation driven by substantial government support and increasing domestic demand. China's focus on developing indigenous packaging capabilities has led to the emergence of several key players like JCET Group and Tianshui Huatian Technology. The country's packaging sector is particularly strong in advanced packaging technologies, including flip-chip, wafer-level packaging, and system-in-package solutions. Chinese semiconductor packaging companies are making significant strides in developing capabilities for high-performance computing and 5G applications. The industry benefits from strong government initiatives, including the establishment of new semiconductor funds and supportive policies. Local packaging companies are increasingly investing in research and development to enhance their technological capabilities and reduce dependence on foreign technologies. The sector is also witnessing significant expansion in production capacity, with new facilities being established across different regions of the country.

Semiconductor Packaging Market in United States

The United States maintains a strong position in the semiconductor packaging market, driven by its leadership in advanced packaging technologies and innovation. The country's packaging industry is characterized by significant investments in research and development, particularly in areas like chiplets and heterogeneous integration. American chip packaging companies are at the forefront of developing next-generation packaging solutions, supported by initiatives like the CHIPS Act, which has catalyzed domestic manufacturing capabilities. The packaging sector in the US benefits from close collaboration between research institutions, semiconductor companies, and packaging houses. There is a growing focus on developing advanced packaging solutions for artificial intelligence, high-performance computing, and automotive applications. The country's packaging industry is also strengthening its position in areas like fan-out wafer-level packaging and 3D integration technologies. US-based companies are increasingly investing in expanding their packaging capabilities to reduce dependence on foreign suppliers and strengthen domestic supply chains. The industry is witnessing a shift towards more sophisticated packaging solutions that enable higher performance and greater functionality.

Semiconductor Packaging Market in Japan

Japan's semiconductor packaging industry maintains its position as a crucial player in the global market, leveraging its strong technological foundation and innovation capabilities. The country's packaging sector is characterized by its focus on high-quality, precision packaging solutions, particularly for automotive and industrial applications. Japanese companies are making significant investments in advanced packaging technologies, including the development of new materials and processes for next-generation semiconductors. The industry benefits from strong collaboration between manufacturers, research institutions, and government bodies. Japanese packaging companies are particularly strong in developing solutions for power semiconductors and specialized applications. The country's packaging sector is witnessing increased activity in areas like system-in-package and wafer-level packaging technologies. Japan's commitment to quality and reliability continues to make it a preferred choice for high-reliability applications. The industry is also focusing on developing environmentally sustainable packaging solutions, aligning with global trends towards green technology.

Semiconductor Packaging Market in Other Countries

The semiconductor packaging landscape extends beyond the major players to include several emerging and established markets across the globe. Countries in Southeast Asia, particularly Malaysia and Singapore, are developing their packaging capabilities, focusing on advanced technologies and specialized solutions. European nations are strengthening their position in the packaging industry, particularly in automotive and industrial applications. South Korea continues to be a significant player, leveraging its strong electronics manufacturing base. Countries like India are emerging as potential new hubs for semiconductor packaging companies in India, supported by government initiatives and increasing domestic demand. The global distribution of packaging capabilities ensures a diverse and resilient supply chain, with different regions specializing in various aspects of packaging technology. These markets are characterized by increasing investments in research and development, growing domestic capabilities, and efforts to establish specialized niches within the global semiconductor packaging ecosystem.

Semiconductor Packaging Market Overview

Top Companies in Semiconductor Packaging Market

The semiconductor packaging companies market is led by established players including Amkor Technology, ASE Technology, Intel Corporation, TSMC, JCET Group, Samsung Electronics, and Powertech Technology Inc. These top semiconductor packaging companies are driving innovation through advanced packaging technologies like 2.5D/3D stacking, fan-out wafer level packaging, and system-in-package solutions. The industry has seen significant investments in research and development of emerging technologies like co-packaged optics, chiplets, and hybrid bonding solutions. Companies are expanding their manufacturing footprint globally through strategic facility investments, particularly in Asia Pacific and North America. Operational excellence is being achieved through automation, advanced process control, and integrated supply chain management. Strategic collaborations between foundries, OSAT providers, and equipment manufacturers are becoming increasingly common to develop next-generation packaging solutions for applications in 5G, artificial intelligence, high-performance computing, and automotive electronics.

Market Consolidation Drives Industry Evolution Pattern

The semiconductor packaging market exhibits a relatively consolidated structure dominated by large integrated device manufacturers and specialized outsourced semiconductor assembly and test (OSAT) providers. Global conglomerates like Intel and Samsung maintain in-house packaging capabilities while also working with OSAT partners to meet diverse customer requirements. The market has witnessed significant consolidation through mergers and acquisitions, as companies seek to expand their technological capabilities, geographic presence, and customer base. Regional players, particularly in Asia, are strengthening their position through government support and strategic partnerships with global leaders.


The industry landscape is characterized by high barriers to entry due to substantial capital requirements, technical expertise needs, and established customer relationships. Major players are vertically integrating their operations to offer end-to-end solutions from wafer fabrication to advanced packaging and testing services. Cross-border collaborations and joint ventures are becoming increasingly common as companies look to share risks and resources while developing cutting-edge packaging technologies. The market also sees strategic investments from both semiconductor manufacturers and packaging specialists in emerging technologies and capacity expansion.

Innovation and Integration Key to Growth

Success in the semiconductor packaging market increasingly depends on technological leadership and the ability to offer comprehensive solutions. Incumbent players must continuously invest in research and development to maintain their competitive edge, focusing on advanced packaging technologies that enable higher performance, improved power efficiency, and reduced form factors. Companies need to strengthen their intellectual property portfolios while building strategic partnerships across the semiconductor value chain. Market leaders are also expanding their service offerings to include design support, testing, and turnkey solutions to increase customer engagement and loyalty.


New entrants and emerging players can gain semiconductor packaging market share by focusing on specialized packaging solutions for specific applications or regional markets. Success factors include developing innovative packaging technologies, establishing strong relationships with key customers, and maintaining operational excellence. Companies must also navigate regulatory requirements, particularly in areas like export controls and environmental compliance. The ability to adapt to changing market demands, such as the shift toward heterogeneous integration and advanced packaging for artificial intelligence applications, will be crucial for long-term success. Players must also consider vertical integration opportunities and strategic partnerships to enhance their competitive position.

Semiconductor Packaging Market Leaders

  1. ASE Technology Holding Co. Ltd

  2. Amkor Technology

  3. Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)

  4. Siliconware Precision Industries Co. Ltd

  5. Powertech Technology Inc.

  6. *Disclaimer: Major Players sorted in no particular order
Semiconductor Packaging Market Concentration
Need More Details on Market Players and Competiters?
Download PDF

Semiconductor Packaging Market News

  • March 2024 - Arizona State University and Deca Technologies, a provider of advanced wafer- and panel-level packaging technology, announced a partnership. The partnership establishes North America's inaugural research and development hub for FOWLP. Named the Center for Advanced Wafer-Level Packaging Applications and Development, this initiative is poised to fuel innovation in the United States. It not only bolsters the nation's semiconductor manufacturing prowess but also spearheads progress in pivotal sectors like AI, ML, automotive electronics, and high-performance computing.
  • November 2023 - Samsung Electronics prepared to launch a new advanced 3D chip packaging technology called SAINT (Samsung Advanced Interconnection Technology) to compete with Taiwan Semiconductor Manufacturing Company's (TSMC's) dominance in the market. The SAINT technology consists of three variants, namely SAINT D, SAINT L, and SAINT S, each aimed at improving the performance and integration of memory and processors for high-performance chips, particularly those utilized in AI applications.

Semiconductor Packaging Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Impact of COVID-19 Aftereffects and Other Macroeconomic Factors on the Market

5. MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Consumption of Semiconductor Devices Across Industries
    • 5.1.2 Favorable Government Policies and Regulations in Developing Countries
  • 5.2 Market Restraints
    • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6. MARKET SEGMENTATION

  • 6.1 By Packaging Platform
    • 6.1.1 Advanced Packaging
    • 6.1.1.1 Flip Chip
    • 6.1.1.2 SIP
    • 6.1.1.3 2.5D/3D
    • 6.1.1.4 Embedded Die
    • 6.1.1.5 Fan-in Wafer Level Packaging (FI-WLP)
    • 6.1.1.6 Fan-out Wafer Level Packaging (FO-WLP)
    • 6.1.2 Traditional Packaging
  • 6.2 By End-user Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Aerospace and Defense
    • 6.2.3 Medical Devices
    • 6.2.4 Communications and Telecom
    • 6.2.5 Automotive Industry
    • 6.2.6 Energy and Lighting
  • 6.3 By Geography***
    • 6.3.1 United States
    • 6.3.2 China
    • 6.3.3 Taiwan
    • 6.3.4 South Korea
    • 6.3.5 Japan
    • 6.3.6 Europe
    • 6.3.7 Latin America
    • 6.3.8 Middle East and Africa

7. COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles*
    • 7.1.1 ASE Technology Holding Co. Ltd
    • 7.1.2 Amkor Technology
    • 7.1.3 Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)
    • 7.1.4 Siliconware Precision Industries Co. Ltd
    • 7.1.5 Powertech Technology Inc.
    • 7.1.6 Tianshui Huatian Technology Co. Ltd
    • 7.1.7 Fujitsu Semiconductor Ltd
    • 7.1.8 UTAC Holdings Ltd
    • 7.1.9 Chipmos Technologies Inc.
    • 7.1.10 Chipbond Technology Corporation
    • 7.1.11 Intel Corporation
    • 7.1.12 Samsung Electronics Co. Ltd
    • 7.1.13 Unisem (M) Berhad
    • 7.1.14 Interconnect Systems Inc. (ISI)

8. INVESTMENT ANALYSIS

9. FUTURE OF THE MARKET

**Subject to Availability
***In the final report, Latin America and Middle East and Africa will be considered together as 'Rest of the World'
You Can Purchase Parts Of This Report. Check Out Prices For Specific Sections
Get Price Break-up Now

Semiconductor Packaging Market Industry Segmentation

Semiconductor packaging refers to a casing that contains one or more discrete semiconductor devices or integrated circuits made of plastic, ceramic, metal, or glass casing. Packaging protects an electronic system from radio frequency noise emission, electrostatic discharge, mechanical damage, and cooling. The rise in the semiconductor industry worldwide is one of the major factors driving the growth of the semiconductor packaging market. The continuous advancements in terms of integration, energy efficiency, and product characteristics because of the growing demand across various end-user verticals of the industry and the use of packaging for improving the performance, reliability, and cost-effectiveness of electronic systems accelerate the market’s growth.

The report tracks the sales of semiconductor packaging globally to evaluate the market revenue for the global advanced packaging and traditional packaging market. Different advanced packaging platforms are considered in the report, including flip-chip, fan-in, embedded die, 3D stacking, and fan-out packaging, which are used in multiple end-user applications like consumer electronics, medical devices, communication and telecom, and automotive. The competitive landscape has been taken to calculate packaging penetration and how players involve themselves in organic and inorganic growth strategies. These companies are innovating their products to increase their market share and profitability. Furthermore, the report focuses on analyzing macroeconomic factors in the market.

The semiconductor packaging market is segmented by packaging platform (advanced packaging [flip chip, SIP, 2.5D/3D, embedded die, fan-in wafer level packaging (FI-WLP), and fan-out wafer level packaging (FO-WLP)] and traditional packaging), end-user industry (consumer electronics, aerospace and defense, medical devices, communications and telecom, automotive, and energy and lighting), and geography (United States, China, Taiwan, Korea, Japan, and Europe). The report offers market sizes and forecasts in terms of value (USD) for all these segments.

By Packaging Platform Advanced Packaging Flip Chip
SIP
2.5D/3D
Embedded Die
Fan-in Wafer Level Packaging (FI-WLP)
Fan-out Wafer Level Packaging (FO-WLP)
Traditional Packaging
By End-user Industry Consumer Electronics
Aerospace and Defense
Medical Devices
Communications and Telecom
Automotive Industry
Energy and Lighting
By Geography*** United States
China
Taiwan
South Korea
Japan
Europe
Latin America
Middle East and Africa
Need A Different Region or Segment?
Customize Now

Semiconductor Packaging Market Research FAQs

How big is the Semiconductor Packaging Market?

The Semiconductor Packaging Market size is expected to reach USD 104.16 billion in 2025 and grow at a CAGR of 7.05% to reach USD 146.43 billion by 2030.

What is the current Semiconductor Packaging Market size?

In 2025, the Semiconductor Packaging Market size is expected to reach USD 104.16 billion.

Who are the key players in Semiconductor Packaging Market?

ASE Technology Holding Co. Ltd, Amkor Technology, Jiangsu Changjiang Electronics Technology Co. Ltd (JCET), Siliconware Precision Industries Co. Ltd and Powertech Technology Inc. are the major companies operating in the Semiconductor Packaging Market.

What years does this Semiconductor Packaging Market cover, and what was the market size in 2024?

In 2024, the Semiconductor Packaging Market size was estimated at USD 96.82 billion. The report covers the Semiconductor Packaging Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Semiconductor Packaging Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

Semiconductor Packaging Market Research

Mordor Intelligence provides comprehensive insights into the semiconductor packaging market through detailed industry analysis, market outlook, and growth forecasts. Our research extensively covers various segments including wafer level packaging, system in package, chip packaging, and advanced semiconductor packaging technologies. The report encompasses market size, industry statistics, and emerging trends, with a special focus on leading players like Amkor Technology and their market strategies. All these valuable insights are available in an easy-to-read report PDF format, enabling stakeholders to make informed decisions based on reliable market data and forecasts.
Our consulting expertise extends beyond traditional market research to provide strategic solutions in the semiconductor packaging industry. We assist clients with technology scouting to identify cutting-edge semiconductor packaging technology developments, conduct comprehensive patent analysis for innovation tracking, and perform detailed assessments of semiconductor packaging companies worldwide. Our services include project feasibility analysis for new packaging facilities, M&A target assessment in the electronic packaging industry, and evaluation of emerging opportunities in advanced ic packaging. Through B2B surveys and advanced data analytics, we help clients understand evolving market dynamics and optimize their competitive positioning in this rapidly evolving sector.