Molded Interconnect Device Market Size and Share
Market Overview
| Study Period | 2019 - 2030 |
|---|---|
| Market Size (2025) | USD 2.17 Billion |
| Market Size (2030) | USD 3.89 Billion |
| Growth Rate (2025 - 2030) | 12.37% CAGR |
| Fastest Growing Market | Middle East and Africa |
| Largest Market | Asia Pacific |
| Market Concentration | Medium |
Major Players
*Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0. |
|
Molded Interconnect Device Market Analysis by Mordor Intelligence
The Molded Interconnect Device market size reached USD 2.17 billion in 2025 and will grow to USD 3.89 billion by 2030 at a 12.37% CAGR. The technology’s expansion stems from its ability to combine electronic and mechanical functions in one 3-D structure, supporting miniaturization needs in automotive zonal architectures, 5 G smartphones, and next-generation medical implantables. Laser direct structuring (LDS) innovations, paired with additive manufacturing, lessen component count and wiring, reduce assembly time, and cut weight in complex electronic products. Automotive demand remains robust as zonal electronics require compact 3-D antennas that fit tight geometries without signal loss. LDS antennas in 5 G smartphones enable up to 16 antenna elements within shrinking form factors while meeting millimeter-wave tolerance thresholds. Medical device makers adopt MID to embed sensors, microphones, and wiring directly in biocompatible housings, improving patient comfort and reliability. Vertically integrated suppliers with proprietary LDS polymers and metallization chemistries capture rising orders amid silver price volatility and tight compound capacity.
Key Report Takeaways
- By process, LDS held 62.46% share of the Molded Interconnect Device market size in 2024. Additive and other emerging processes are projected to grow at 12.79% CAGR to 2030.
- By product type, Antenna and Connectivityheld 43.87% share of the Molded Interconnect Device market size in 2024. Structural Electronics Panels are projected to grow at 12.94% CAGR to 2030.
- By end-use industry, automotive led with 38.89% of Molded Interconnect Device market share in 2024. Healthcare and medical devices are advancing at a 13.21% CAGR through 2030.
- By material, LCP led with 35.23% of Molded Interconnect Device market share in 2024. PEEK are advancing at a 13.17% CAGR through 2030.
- By geography, Asia-Pacific accounted for 48.73% revenue share in 2024. The Middle East and Africa region is forecast to expand at 12.58% CAGR through 2030.
Global Molded Interconnect Device Market Trends and Insights
Drivers Impact Analysis
| Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Automotive shift to zonal E/E architecture | +2.8% | Germany, China, United States, Global | Medium term (2-4 years) |
| Rapid adoption of LDS in 5 G smartphones | +2.1% | Asia-Pacific core; spill-over to North America, Europe | Short term (≤ 2 years) |
| Miniaturization in hearing aids and implantables | +1.7% | North America, Europe, expanding to Asia-Pacific | Long term (≥ 4 years) |
| EV battery-pack sensors for 150 °C plastics | +1.4% | China, Germany, United States, Global | Medium term (2-4 years) |
| Smart-surface HMIs in premium vehicles | +1.2% | North America, Europe | Medium term (2-4 years) |
| Antenna-in-package for LEO satellite terminals | +0.9% | North America early deployment; Global | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
Automotive shift to zonal E/E architecture driving 3-D antenna MID demand
Zonal platforms consolidate control modules, cutting wiring harness weight by up to 40% and requiring embedded 3-D antennas that maintain signal integrity in confined spaces. MID allows automakers to place antennas on molded pillars, roof linings, and sensor housings while preserving aerodynamics. HARTING’s 3-D circuit technology eliminates separate PCBs, placing copper traces directly on housings and raising design freedom. [1]HARTING, “3D-MID Systems In Medical Technology,” harting.com Automakers pursuing software-defined vehicles adopt LDS to embed multiple antennas near zonal controllers, improving data throughput between edge processors and the cloud. The transition accelerates sourcing agreements for LDS compounds and laser systems across Germany, China, and the United States.
Rapid adoption of LDS processing in 5 G smartphones
Millimeter-wave 5 G handsets need densely packed antennas that traditional PCB stacks cannot support. LDS engraves conductive paths on the inner walls of molded frames, freeing board space. KYOCERA AVX demonstrated sub-50 µm tolerance patterns that boost antenna efficiency while lowering assembly steps. [2]KYOCERA AVX, “Laser Direct Structuring (LDS) Technology,” kyocera-avx.com Flagship devices now integrate up to 16 antenna elements for beamforming and MIMO without enlarging the enclosure. Asia-Pacific ODMs scale LDS lines quickly, while North American and European brands follow to keep pace with thinner, lighter designs.
Miniaturization requirements in hearing aids and implantables
Hearing aid shells integrate microphones, DSP chips, and batteries directly in molded structures that withstand sweat and humidity. Studies confirm MID designs shrink overall volume while sustaining acoustic performance. For implantables, PEEK-based MID substrates combine biocompatibility with sterilization tolerance, enabling long-life glucose sensors and neuromodulation probes. Evonik’s VESTAKEEP delivers mechanical properties close to cortical bone and resists decade-long body exposure. The long-term driver adds incremental CAGR impact as FDA clearances progress.
EV battery-pack sensors needing 150 °C plastics
Thermal-runaway mitigation in large packs relies on cell-level temperature and voltage monitoring. Chip-on-cell solutions integrate sensors directly on each cylindrical or prismatic cell, where ambient heat reaches 150 °C. PEEK maintains dielectric strength at 260 °C, allowing LDS traces around sensor chips without delamination. Fiber Bragg grating studies record 0.1 °C accuracy under cycling conditions. China, Germany, and U.S. battery plants specify high-temperature MID carriers, pushing compound orders and specialized plating chemistries.
Restraints Impact Analysis
| Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| High tooling cost for multi-shot molds | -1.8% | Global, stronger effect on small manufacturers | Short term (≤ 2 years) |
| Limited global capacity for LDS polymers | -1.3% | Global shortages, acute in Asia-Pacific | Medium term (2-4 years) |
| Silver price volatility | -0.9% | Global | Short term (≤ 2 years) |
| Reliability gaps above 180 °C for aerospace sensors | -0.7% | North America, Europe aerospace hubs | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
High tooling cost for multi-shot molds
Complex molds with rotating platens and core-back mechanics cost USD 50,000-500,000 each. Automotive-grade antenna molds exceed USD 300,000 and need 16-20-week lead times, limiting adoption among firms with under USD 5 million annual MID revenue. [3]Momaking, “Injection Mold Cost 2025: Your Essential Guide to Saving Money,” momaking.com As a result, low-volume medical and aerospace programs gravitate toward LDS over-mold or additive methods that reduce up-front capex.
Limited global capacity for LDS polymer compounds
Annual LDS-ready compound output is just 15,000 t, with supply controlled by a handful of formulators. Resin shortages lifted material prices 15-30% in 2025 and stretched lead times to 10-12 weeks. Ensinger’s TECACOMP LCP LDS lines operate near nameplate, and any outage constrains Asia-Pacific handset orders. OEMs respond by locking multi-year contracts or co-investing in compounding.
Segment Analysis
By Process: LDS dominance faces additive disruption
LDS captured 62.46% of Molded Interconnect Device market share in 2024. The LDS route laser-activates metal seeds in molded polymers, then builds copper-nickel-gold tracks, producing consistent impedance for RF circuits. Automotive antennas, 5 G phone frames, and smart meters depend on this repeatable, mid- to high-volume method. Additive and other emerging processes will post 12.79% CAGR through 2030 as hybrid printing achieves impossible undercuts and void-free channels. Charge-programmed deposition prints ultralight satellite antennas, slicing weight 94% versus machined aluminum. Two-shot molding retains relevance in premium vehicle interiors that combine translucent light guides with black touch surfaces. Film-insert electronics enables white-goods makers to place capacitive keys under curved glass but still trails LDS on cycle time.
In the next five years, hybrid lines that alternate injection steps with direct-write tracks will blur process categories. LDS equipment vendors partner with printer OEMs to co-develop inline inspection, while universities test aerosol-jet metallization on polycarbonate shells. The Molded Interconnect Device market size for LDS routes should cross USD 2.1 billion by 2030, while additive variants capture USD 420 million as prototyping converts to low-volume series.
Note: Segment shares of all individual segments available upon report purchase
By Product Type: antennas hold the lead as structural electronics surge
Antenna and connectivity modules represented 43.87% revenue in 2024, anchored by 5 G smartphones, vehicle telematics, and Wi-Fi 7 routers. LDS antennas meet 28 GHz radiation efficiency targets inside 7 mm phone edges without shield cans. Structural electronics panels, embedding LEDs and capacitive sensors, will expand at 12.94% CAGR. TactoTek showed a center console trim replacing 15 mechanical buttons with one molded lighted surface, cutting part count 60%. Sensors and switches enjoy steady industrial growth as machine builders embed limit switches within IP67 housings. Lighting components occupy niche cabin and façade accents where thinness matters more than lumen output, constrained by higher per-lumen cost.
By 2030, the Molded Interconnect Device market size for structural electronics panels should exceed USD 800 million, while legacy antenna share gradually falls to 40% as more electronic functionality shifts onto single substrate surfaces.
By End-use Industry: healthcare accelerates beyond automotive dominance
Automotive retained 38.89% Molded Interconnect Device market share in 2024, supplied by tier-ones embedding 3-D antennas and smart surfaces into zonal modules. Healthcare will advance at 13.21% CAGR to 2030 on implantable and hearing-aid projects that demand hermetic, biocompatible carriers. Consumer electronics broadens MID use beyond smartphones into AR glasses and fitness wearables. Industrial automation integrates LDS pressure sensors and ultrasonic modules, benefiting Industry 4.0 retrofits. Telecom infrastructure cycles with small-cell rollouts for 5 G and, from 2027, early 6 G trials. Aerospace and defense remain niche yet high margin, requiring PEEK or LCP carriers surviving 200 °C reflow or cabin bleed-air cycles.
As remote patient monitoring grows, healthcare’s Molded Interconnect Device market share could approach 20% by 2030, edging into territory historically held by automotive.
Note: Segment shares of all individual segments available upon report purchase
By Material: PEEK emergence challenges LCP leadership
Liquid-crystal polymer accounted for 35.23% of 2024 demand thanks to low dielectric loss and stable molding shrinkage. Polyether ether ketone will post 13.17% CAGR as designers seek 260 °C service temperatures, flame retardancy, and implant compatibility. PBT and PA satisfy cost targets for daytime running lights and industrial sensor barrels. Polycarbonate blends see uptake in appliance touch panels that need optical clarity for backlit icons. Research on dendrite-proof lithium-ion separators proves PEEK’s safety edge in EV batteries, giving the resin a path to multi-hundred-million-dollar volumes. By 2030, PEEK could secure 12% revenue share, trimming LCP to below one-third.
Geography Analysis
Asia-Pacific controlled 48.73% Molded Interconnect Device market share in 2024 with deeper electronics supply chains, skilled labor, and proximity to handset brands. Infineon opened a EUR 2 billion SiC fab in Malaysia, amplifying local demand for high-temperature sensor substrates. Foxconn’s USD 383 million PCB site in Vietnam diversifies risk and spurs regional LDS polymer import needs. Japan’s ceramics expertise supports Kyocera’s JPY 68 billion Nagasaki package plant. South Korea and Taiwan add strength in foundry and OSAT services, embedding MID steps into advanced packaging lines.
North America and Europe focus on high-value, lower-volume niches. German automakers specify smart surface HMIs and 3-D antennas for premium vehicles assembled in Stuttgart and Wolfsburg. U.S. Tier-1s equip EV battery modules with PEEK sensor carriers. The United Kingdom gained a GBP 250 million expansion by Vishay in 2025, creating demand for LDS temperature sensors in power modules. Research collaborations with universities in Munich, Leuven, and Boston push multi-material printing that combines copper, silver, and conductive polymers.
The Middle East and Africa will grow 12.58% CAGR as governments fund semiconductor ecosystems. Saudi Arabia’s SAR 1 billion National Semiconductor Hub aims to host 50 local design firms by 2030, prioritizing advanced interconnect skills. Egypt targets 9 million smartphones annually by 2026, pressing ODMs to localize antenna-in-housing production. The UAE leverages free-zone incentives to attract printer OEMs serving satellite constellations. Challenges include skill shortages and LDS compound logistics, but sovereign investors offset risk through joint ventures with Asian materials firms.
Competitive Landscape
The market is moderately fragmented. Molex, TE Connectivity, and HARTING jointly held about 26% revenue in 2024, balancing vertically integrated molding, plating, and assembly with global sales teams. Molex completed the AirBorn acquisition in July 2025, adding rugged connectors for space and defense and more than 50,000 staff across 85 plants. TE Connectivity broadened its North American utility presence by buying Richards Manufacturing as part of its USD 4.1 billion Q2 2025 sales drive. HARTING invests in automated LDS cells that coat parts inline without human touch, raising throughput.
Emerging players reshape boundaries. TactoTek licenses in-mold electronics to Tier-1s and consumer brands, reducing part count in smart surfaces. 3D Glass Solutions attracts Intel Capital and Lockheed Martin Ventures for glass-based RF substrates suited to LEO terminals. Start-ups print copper on PA12 using photonic sintering for low-volume aerospace brackets. Patent filings climbed 11% in 2024, centering on high-temperature plating seed layers and multi-material melt streams. Supply constraints around silver and LDS polymers favor vertically integrated giants able to hedge metals and compound resins in-house.
Companies differentiate through material science. Ensinger, Evonik, and Victrex customize LCP, PPS, and PEEK blends with laser-active dopants, giving customers predictable metallization windows. Galvanic firms perfect Autocatalytic Ni-P baths that deposit on non-noble seeds, trimming silver use. As additive routes mature, incumbents partner rather than compete, offering joint design centers where printed conductors merge with molded connectors.
Molded Interconnect Device Industry Leaders
-
Molex LLC
-
TE Connectivity Ltd.
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HARTING Technology Group
-
LPKF Laser & Electronics SE
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TactoTek Oy
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- July 2025: Molex completed its AirBorn acquisition, expanding aerospace and defense offerings across 85 plants in 20 countries.
- June 2025: Molex completed its AirBorn acquisition, expanding aerospace and defense offerings across 85 plants in 20 countries.
- April 2025: TE Connectivity reported USD 4.1 billion net sales in fiscal Q2 2025 and acquired Richards Manufacturing to bolster utility segment reach.
- March 2025: Infineon opened the world’s largest 200 mm SiC fab in Kulim, Malaysia, with EUR 2 billion investment and 900 initial jobs.
Global Molded Interconnect Device Market Report Scope
| Laser Direct Structuring (LDS) |
| Two-shot Injection Moulding |
| Two-component (2k) Selective Metallisation |
| Film-Insert / In-Mould Electronics |
| Additive and Other Emerging Processes |
| Antenna and Connectivity Modules |
| Sensors and Switches |
| Lighting Components |
| Structural Electronics Panels |
| Other Product Type |
| Automotive |
| Consumer Electronics and Wearables |
| Healthcare and Medical Devices |
| Industrial Automation |
| Telecommunications Infrastructure |
| Aerospace and Defence |
| Other End-use Industry |
| Liquid-Crystal Polymer (LCP) |
| Polybutylene Terephthalate (PBT) |
| Polyamide (PA 6/6T) |
| Polycarbonate (PC) and Blends |
| Polyether Ether Ketone (PEEK) |
| Other Material |
| North America | United States | |
| Canada | ||
| Mexico | ||
| South America | Brazil | |
| Argentina | ||
| Rest of South America | ||
| Europe | Germany | |
| United Kingdom | ||
| France | ||
| Russia | ||
| Rest of Europe | ||
| Asia-Pacific | China | |
| Japan | ||
| India | ||
| South Korea | ||
| Australia | ||
| Rest of Asia-Pacific | ||
| Middle East and Africa | Middle East | Saudi Arabia |
| United Arab Emirates | ||
| Rest of Middle East | ||
| Africa | South Africa | |
| Egypt | ||
| Rest of Africa | ||
| By Process | Laser Direct Structuring (LDS) | ||
| Two-shot Injection Moulding | |||
| Two-component (2k) Selective Metallisation | |||
| Film-Insert / In-Mould Electronics | |||
| Additive and Other Emerging Processes | |||
| By Product Type | Antenna and Connectivity Modules | ||
| Sensors and Switches | |||
| Lighting Components | |||
| Structural Electronics Panels | |||
| Other Product Type | |||
| By End-use Industry | Automotive | ||
| Consumer Electronics and Wearables | |||
| Healthcare and Medical Devices | |||
| Industrial Automation | |||
| Telecommunications Infrastructure | |||
| Aerospace and Defence | |||
| Other End-use Industry | |||
| By Material | Liquid-Crystal Polymer (LCP) | ||
| Polybutylene Terephthalate (PBT) | |||
| Polyamide (PA 6/6T) | |||
| Polycarbonate (PC) and Blends | |||
| Polyether Ether Ketone (PEEK) | |||
| Other Material | |||
| By Geography | North America | United States | |
| Canada | |||
| Mexico | |||
| South America | Brazil | ||
| Argentina | |||
| Rest of South America | |||
| Europe | Germany | ||
| United Kingdom | |||
| France | |||
| Russia | |||
| Rest of Europe | |||
| Asia-Pacific | China | ||
| Japan | |||
| India | |||
| South Korea | |||
| Australia | |||
| Rest of Asia-Pacific | |||
| Middle East and Africa | Middle East | Saudi Arabia | |
| United Arab Emirates | |||
| Rest of Middle East | |||
| Africa | South Africa | ||
| Egypt | |||
| Rest of Africa | |||
Key Questions Answered in the Report
What is the projected value of the Molded Interconnect Device market in 2030?
The market is forecast to reach USD 3.89 billion by 2030.
Which segment is growing fastest within the Molded Interconnect Device space?
Healthcare and medical devices are advancing at a 13.21% CAGR as miniaturized implantables and hearing aids adopt MID.
Why do automakers favor MID in zonal architectures?
MID integrates 3-D antennas and smart-surface controls directly into housings, cutting wiring harness weight by up to 40% while improving electromagnetic compatibility.
How does LDS enable 5 G smartphone antenna integration?
LDS lasers activate conductive seeds in molded frames, allowing multiple millimeter-wave antennas to fit tight spaces with sub-50 µm accuracy.
Which material is gaining share for high-temperature MID applications?
PEEK is expanding rapidly because it maintains mechanical and dielectric properties up to 260 °C, making it suitable for EV batteries and aerospace sensors.
What restrains wider MID adoption among small manufacturers?
Multi-shot mold tooling can cost USD 50,000-500,000, creating capital barriers that smaller firms cannot easily absorb.
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