Market Share of High-end Semiconductor Packaging Industry
The market for high-end semiconductor packaging is consolidated. Companies employ product innovation, expansions, and partnerships to stay ahead of the competition and widen their market reach. Several recent market developments include:
In October 2022, TSMC announced the Open Innovation Platform (OIP) 3D Fabric Alliance. The latest TSMC 3DFabric Alliance is TSMC's sixth OIP Alliance and the first of its variety in the semiconductor firm that joins forces with partners to accelerate 3D IC ecosystem readiness and innovation, with an entire expanse of best-in-class solutions and services for semiconductor design, memory modules, testing, manufacturing, substrate technology, and packaging.
In August 2022, Intel showcased the most recent architectural and packaging breakthroughs that enabled 2.5D and 3D tile-based chip designs, ushering in a new era in chipmaking technologies and their significance. Intel's system foundry model features improved packaging, and the company intends to increase the number of transistors on a package from 100 billion to 1 trillion by 2030.
High-end Semiconductor Packaging Market Leaders
Intel Corporation
Taiwan Semiconductor Manufacturing Company
Advanced Semiconductor Engineering, Inc
Samsung Electronics Co. Ltd
Amkor Technology Inc.
*Disclaimer: Major Players sorted in no particular order
