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The Panel Level Packaging Market is segmented by Industry Application (Consumer Electronics, Automotive, Aerospace & Defense, Telecommunication), and Geography.
Fastest Growing Market:
Panel level packaging (PLP) market is anticipated to witness a CAGR of 28.0% over the forecast period (2020 - 2025). Cost effective packaging solution and flexible circuit designs are some of the major influencing factors for the growth of panel level packaging technology. Especially, the recent Fan Out Wafer Level Package (FOWLP) technology is the promising area of market advancement in the global semiconductor packaging industry. Smaller form factor with enhanced thermal performance has generated huge demand for panel level packaging technology among several industrial applications such as consumer electronics, automotive, aerospace & defense, telecommunication, and others.
The scope for Panel level packaging (PLP) technology is primarily focused on recent packaging technologies like Fan Out Wafer Level Package (FOWLP), other than conventional technique of wafer based packaging. Panel level packaging technology is used for packaging of various semiconductor products such as field-programmable gate array (FPGA), CPU/GPU, power management IC module, baseband, WiFi devices, RF devices, transducers, and networking & servers.
|By Industry Application|
|Aerospace & Defence|
|Other Industry Application|
|Rest of the World|
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As very few players are dominating the market with their technological expertise in level packaging technology, the global market for panel level packaging is expected to be consolidated in nature. Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASE Group, Siliconware Precision Industries Co., Ltd., Fraunhofer Institute for Reliability and Microintegration IZM, Taiwan Semiconductor Manufacturing Company, Limited, and Shinko Electric Industries Co, Ltd. are some of the major players present in the current market. However, giant chip manufacturers such as Intel Corporation, Qualcomm Technologies, Inc., Powertech Technology Inc, and Unimicron Technology Corporation are involved in extensive R&D and market development activities to come up with competitive panel level packaging technology in the coming years.
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study
2. RESEARCH METHODOLOGY
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Reduced Cost of Packaging Process
4.3.2 Enhanced Design Flexibility and Physical Performance of Chips
4.3.3 Increased Investment on Research & Development Activities
4.4 Market Restraints
4.4.1 Complexity in Packaging Process
4.5 Industry Value Chain Analysis
4.6 Industry Attractiveness - Porter's Five Force Analysis
4.6.1 Threat of New Entrants
4.6.2 Bargaining Power of Buyers/Consumers
4.6.3 Bargaining Power of Suppliers
4.6.4 Threat of Substitute Products
4.6.5 Intensity of Competitive Rivalry
5. MARKET SEGMENTATION
5.1 By Industry Application
5.1.1 Consumer Electronics
5.1.3 Aerospace & Defence
5.1.5 Other Industry Application
5.2.1 North America
5.2.4 Rest of the World
6. COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 Amkor Technology, Inc.
6.1.2 Deca Technologies
6.1.3 Lam Research Corporation
6.1.4 ASE Group
6.1.5 Siliconware Precision Industries Co., Ltd.
6.1.6 Fraunhofer Institute for Reliability and Microintegration IZM
6.1.7 Taiwan Semiconductor Manufacturing Company, Limited
6.1.8 Shinko Electric Industries Co, Ltd.
7. INVESTMENT ANALYSIS
8. MARKET OPPORTUNITIES AND FUTURE TRENDS
* List Not Exhaustive