Automotive Printed Circuit Board Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The Automotive Printed Circuit Board Market Report is Segmented by Vehicle Type (Passenger Cars and Commercial Vehicles), Propulsion Type (ICE Vehicles and More), PCB Type (Single-Layer and More), Substrate (Rigid (FR-4 and Metal-Core) and More), Application (ADAS and Safety and More), Level of Automation (SAE Level 0–2 and More), and Geography. The Market Forecasts are Provided in Terms of Value (USD) and Volume (Units).

Automotive Printed Circuit Board (PCB) Market Size and Share

Automotive Printed Circuit Board (PCB) Market (2025 - 2030)
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Compare market size and growth of Automotive Printed Circuit Board (PCB) Market with other markets in Automotive Industry

Automotive Printed Circuit Board (PCB) Market Analysis by Mordor Intelligence

The automotive printed circuit board market size is USD 12.22 billion in 2025 and is forecast to reach USD 16.08 billion by 2030, expanding at a 5.64% CAGR. Growth stems from the rapid shift toward software-defined vehicles that depend on increasingly sophisticated boards to connect high-performance compute, safety sensors, and electrified drivetrains. Mandatory advanced driver-assistance standards, the proliferation of battery-electric platforms, migration to 48 V power nets, and always-connected infotainment expand the addressable automotive printed circuit board market opportunity. Silicon-carbide traction inverters and domain controllers now operate beyond 175 °C, pushing designers toward high-density interconnect and rigid-flex architectures that enhance thermal spreading and signal integrity.

Key Report Takeaways

  • By vehicle type, passenger cars held 62.13% of the automotive printed circuit board market share in 2024, carrying the fastest CAGR from 6.89% to 2030.
  • By propulsion type, internal-combustion powertrains retained 55.78% of the automotive printed circuit board market size in 2024, while battery electric vehicles advance at an 18.57% CAGR through 2030.
  • By PCB type, single-layer boards led with 38.49% of the automotive printed circuit board market share in 2024, whereas high-density interconnect solutions are on track for an 11.24% CAGR through 2030.
  • By substrate, rigid materials dominated with 70.36% automotive printed board market share in 2024; rigid-flex options post the highest 13.41% CAGR.
  • By application, ADAS and safety systems accounted for 34.22% of the automotive printed circuit board market size in 2024; autonomous-driving compute is projected to grow at 14.07% CAGR.
  • By level of automation, SAE Level 0-2 systems controlled 82.94% of the automotive printed board market size in 2024, while Level 4-5 solutions log a 15.03% CAGR through 2030.
  • By geography, Asia-Pacific commanded 60.81% share of the automotive printed board market size in 2024 and is set for an 8.28% CAGR to 2030.

Segment Analysis

By Vehicle Type: Passenger Cars Drive Market Expansion

Passenger cars accounted for 62.13% of the automotive printed circuit board market size in 2024 and are expanding at a 6.89% CAGR to 2030. Feature-rich cabins, advanced parking assistance, and 48 V networks multiply the board area to more than 5 m² in premium trims. Commercial fleets emphasise durability, adopting metal-core or thick-copper FR-4 for brake and suspension controllers exposed to vibration. Passenger-car electrification and connectivity motives thus anchor volume growth that reinforces the scale economics of the automotive printed circuit board market.

Commercial vans remain a strategic subsector as e-commerce logistics pivot toward zero-emission zones. Predictive maintenance telematics sparks demand for ruggedised telematics PCBs. The bus and truck segments take longer to shift because of infrastructure gaps. However, when they adopt electric drivelines, board power densities climb sharply, underpinning fresh revenue streams for the automotive printed circuit board market.

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By Propulsion Type: Electric Powertrains Reshape PCB Requirements

ICE vehicles dominated the automotive printed circuit board market size with a 55.78% share in 2024, while battery electric vehicles recorded an 18.57% CAGR, becoming the high-growth engine of the automotive printed circuit board industry. Battery-management, inverter, and on-board-charger boards now require dielectric breakdown strengths above 40 kV/mm to satisfy 800 V systems. Hybrid modules overlay combustion and electric domains, doubling thermal zones and complicating ground isolation. Internal-combustion vehicles remain the majority volume but shift toward turbo-48V mild hybrids, ensuring baseline demand.

In BEVs, thermally conductive yet electrically insulating fillers in prepregs cool power MOSFETs, extending range. Hybrid designs embed isolated gate drivers on the same board as engine controllers, shrinking wiring harnesses. The propulsion mix divergence across regions shapes localised design centre specialisations, all fuelling diversification in the automotive printed circuit board market.

By PCB Type: HDI Technology Drives Innovation

Single-layer panels kept 38.49% of the automotive printed circuit board market share in 2024, servicing lighting and simple sensor tasks. High-density interconnect formats post an 11.24% CAGR through 2030, as radar front ends stipulate stacked vias and laser-drilled microvias under 75 µm. Automotive printed circuit board market suppliers with sequential lamination and resin plugging dominate premium ADAS bids.

Rigid-flex deployments marry inflexible compute sections to tail flexes that remove connectors, raising reliability. These architectures reduce assembly time by up to 30%, an attractive lever for OEM cost control. Entry-level cars stick with double-layer FR-4 where density needs lag, sustaining volume for cost-optimised board shops and balancing product mix across the automotive printed circuit board market.

By Substrate: Rigid Substrates Dominate Current Applications

Rigid FR-4 and metal-core formats capture 70.36% of the automotive printed circuit board market size in 2024. They withstand moisture ingress, vibration, and thermal cycles repeated millions of times. Rigid-flex combinations deliver the fastest 13.41% CAGR to 2030, slashing harness weight in steering-wheel controls and door modules. Metal-core boards migrate from LED headlights into DC-DC converters, their aluminium backplanes doubling as heat sinks.

Thermally conductive polymeric substrates pop up in 2027-plus BEV inverters, promising mass cuts critical for range. Flexible polyimide remains the go-to for bend zones and rotating parts. Material choice thus hinges on application thermal and mechanical stress rather than price alone, a trend lifting value capture per unit within the automotive printed circuit board market.

By Application: ADAS Systems Lead Electronic Content Growth

ADAS and safety boards accounted for a share of 34.22% in the automotive printed circuit board market size in 2024 as regulations tightened. Millimeter-wave radar arrays use eight-layer HDI with in-plane phase-matched nets that require ±2% impedance control. Autonomous compute, though small today, houses stacked high-bandwidth memory on interposers, chasing a 14.07% CAGR that will upscale volumes for high-layer-count shops in the automotive printed circuit board market.

Power-train electrification pushes thick-copper planes and buried busbars. Body comfort stays cost-sensitive yet still upgrades to CAN-FD or automotive Ethernet, adding layers incrementally. Infotainment drives the adoption of flexible OLED backing boards. These diverse applications create a balanced portfolio that shields the automotive printed circuit board market from swings in any single vehicle subsystem.

Automotive Printed Circuit Board (PCB) Market: Market Share by Application
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Note: Segment shares of all individual segments available upon report purchase

By Level of Automation: Higher Autonomy Drives PCB Complexity

SAE Level 0-2 vehicles dominate 82.94% of the automotive printed circuit board market share, but Level 4-5 prototypes deliver a 15.03% CAGR. Level 3 boards gracefully transfer control between driver and machine by juggling redundant CPUs, dual power regulators, and safety monitors. Full autonomy boards exceed 1 TB/h data throughput and embed liquid-cooling cold plates into multilayer stack-ups.

Lockstep micro-controllers, watchdogs, and instantaneous checksum comparators trigger more complexity than consumer electronics of similar compute power. Suppliers who co-design board and cooling hardware position themselves as strategic partners to autonomy program leaders, securing higher-margin contracts inside the automotive printed circuit board market.

Geography Analysis

Asia-Pacific captured 60.81% of the automotive printed circuit board market size in 2024 and is forecast to post an 8.28% CAGR to 2030, cementing its status as the volume bedrock of the automotive printed circuit board market. China leads with scaled factories and seasoned operators; yet rising wages and geopolitical tensions drive “China + 1” sourcing. Thailand, Malaysia, and Vietnam roll out incentives and modern fabs capable of HDI and rigid-flex builds, granting OEMs supply-chain resilience. 

North America holds a moderate share but owns high-value niches, such as silicon-carbide inverters, radar arrays, and cybersecurity-hardened telematics. Design-service boutiques around Detroit and Austin shorten prototype iterations, which is crucial for start-ups launching electric pickups. Policy incentives that foster domestic substrate and chip output may gradually close the cost gap versus Asia and lift on-shore board bookings, enriching the regional slice of the automotive printed circuit board market.

Europe, on the other hand, remains an engineering powerhouse. Premium German and Swedish marques enforce ISO 26262 traceability and zero-ppm contracts, favouring supply chains with automated optical inspection and X-ray via-fill validation. The continent pioneers 48 V and zonal architectures, keeping domestic design consultancies pivotal to advancing the automotive printed circuit board market. South America and the Middle East/Africa contribute modestly today, but local assembly plants in Brazil and Morocco seek regional board sources to dodge import tariffs. 

Automotive Printed Circuit Board (PCB) Market CAGR (%), Growth Rate by Region
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Competitive Landscape

The automotive printed circuit board market is moderately consolidated, with the top five companies controlling a substantial global revenue share. Consolidation accelerates as automakers prefer fewer partners able to deliver design, simulation, fabrication, and assembly under a single quality-management system. Thermally enhanced HDI capability forms a moat that deters commoditised rivals.

Suppliers differentiate through process technology. Via-fill and back-drill accuracy at sub-100 µm, resin-coated copper for flex stiffeners, and embedded-component techniques reduce board count and harness length. Plants that run AEC-Q200 screening on laminates and employ automotive statistical-process control secure multiyear awards. Vendors acquiring EDA toolchains, as seen when Renesas bought Altium, integrate schematic capture and manufacturing knowledge, enabling “shift-left” validation and tighter collaboration with OEM E/E architects.

Strategic moves include metal-core innovation for traction inverters, dielectric formulations for 48 V boards, and pre-certified reference layouts that cut six months of development time. Partnerships between board fabricators and semiconductor houses create turnkey modules encompassing substrate, driver ICs, and thermal interface. Such vertical integration boosts entry barriers and tilts bargaining power toward established players, strengthening their foothold in the automotive printed circuit board market.

Automotive Printed Circuit Board (PCB) Industry Leaders

  1. Samsung Electro-Mechanics

  2. Unimicron Technology Corp.

  3. Meiko Electronics Co. Ltd

  4. TTM Technologies Inc.

  5. Amitron Corporation

  6. *Disclaimer: Major Players sorted in no particular order
Automotive Printed Circuit Board-Market Concentration.jpg
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Recent Industry Developments

  • March 2025: Empyrean Technology acquired Xpeedic Technology, boosting domestic EDA ecosystems for automotive board simulation.
  • December 2024: Ventec International Group unveiled Thailand's USD 17 million automotive PCB materials manufacturing facility, which aims to produce 150,000 sheets monthly by Q1 2026.
  • August 2024: Bain Capital assumed control of Somacis, widening the latter’s reach in high-mix, mission-critical automotive boards.
  • June 2024: Amber Enterprises announced an INR 2,000 crore (USD ~235 million) investment to develop an Indian PCB plant serving the automotive and IT sectors.

Table of Contents for Automotive Printed Circuit Board (PCB) Industry Report

1. Introduction

  • 1.1 Study Assumptions & Market Definition
  • 1.2 Scope of the Study

2. Research Methodology

3. Executive Summary

4. Market Landscape

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Rising EV sales to fuel PCB demand
    • 4.2.2 Mandatory ADAS and safety regulations
    • 4.2.3 Connected-infotainment proliferation
    • 4.2.4 Transition to 48 V vehicle architectures
    • 4.2.5 Zonal E/E architectures need HDI and flex boards
    • 4.2.6 OEM pursuit of OTA-upgradable ECUs
  • 4.3 Market Restraints
    • 4.3.1 Complex design and integration challenges
    • 4.3.2 Copper-price volatility squeezing margins
    • 4.3.3 Thermal-reliability issues with SiC power modules
    • 4.3.4 Lengthy ISO 26262 safety-audit cycles for new suppliers
  • 4.4 Value / Supply-Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Porter's Five Forces Analysis
    • 4.7.1 Threat of New Entrants
    • 4.7.2 Bargaining Power of Buyers
    • 4.7.3 Bargaining Power of Suppliers
    • 4.7.4 Threat of Substitutes
    • 4.7.5 Intensity of Competitive Rivalry

5. Market Size & Growth Forecasts (Value (USD) and Volume (Units))

  • 5.1 By Vehicle Type
    • 5.1.1 Passenger Cars
    • 5.1.2 Commercial Vehicles
  • 5.2 By Propulsion Type
    • 5.2.1 ICE Vehicles
    • 5.2.2 Battery Electric Vehicles (BEV)
    • 5.2.3 Hybrid and Plug-in Hybrid Vehicles
  • 5.3 By PCB Type
    • 5.3.1 Single-Layer
    • 5.3.2 Double-Layer
    • 5.3.3 Multi-Layer
    • 5.3.4 High-Density Interconnect (HDI)
    • 5.3.5 Rigid-Flex / Flexible
  • 5.4 By Substrate
    • 5.4.1 Rigid (FR-4 and metal-core)
    • 5.4.2 Flexible Polyimide
    • 5.4.3 Rigid-Flex
  • 5.5 By Application
    • 5.5.1 ADAS and Safety
    • 5.5.2 Powertrain and Electrification
    • 5.5.3 Body and Comfort
    • 5.5.4 Infotainment and Connectivity
    • 5.5.5 Autonomous Driving Compute
  • 5.6 By Level of Automation
    • 5.6.1 SAE Level 0 - 2
    • 5.6.2 SAE Level 3
    • 5.6.3 SAE Level 4 - 5
  • 5.7 By Geography
    • 5.7.1 North America
    • 5.7.1.1 United States
    • 5.7.1.2 Canada
    • 5.7.1.3 Rest of North America
    • 5.7.2 South America
    • 5.7.2.1 Brazil
    • 5.7.2.2 Arzentina
    • 5.7.2.3 Rest of South America
    • 5.7.3 Europe
    • 5.7.3.1 Germany
    • 5.7.3.2 United Kingdom
    • 5.7.3.3 France
    • 5.7.3.4 Russia
    • 5.7.3.5 Rest of Europe
    • 5.7.4 Asia-Pacific
    • 5.7.4.1 China
    • 5.7.4.2 Japan
    • 5.7.4.3 India
    • 5.7.4.4 South Korea
    • 5.7.4.5 Rest of Asia-Pacific
    • 5.7.5 Middle East and Africa
    • 5.7.5.1 Saudi Arabia
    • 5.7.5.2 United Arab Emirates
    • 5.7.5.3 Turkey
    • 5.7.5.4 South Africa
    • 5.7.5.5 Rest of Middle East and Africa

6. Competitive Landscape

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as Available, Strategic Information, Market Rank/Share for Key Companies, Products and Services, SWOT Analysis, and Recent Developments)
    • 6.4.1 Unimicron Technology Corp.
    • 6.4.2 Chin Poon Industrial Co. Ltd
    • 6.4.3 Meiko Electronics Co. Ltd
    • 6.4.4 TTM Technologies Inc.
    • 6.4.5 Samsung Electro-Mechanics Co. Ltd
    • 6.4.6 CMK Corporation
    • 6.4.7 AT&S AG
    • 6.4.8 Nippon Mektron Ltd
    • 6.4.9 Zhen Ding Technology Holding
    • 6.4.10 Shennan Circuits Co. Ltd
    • 6.4.11 Ibiden Co. Ltd
    • 6.4.12 Kinwong Electronic Co. Ltd
    • 6.4.13 Amitron Corporation
    • 6.4.14 Tripod Technology Corp.
    • 6.4.15 Daeduck Electronics Co. Ltd
    • 6.4.16 KCE Electronics PCL
    • 6.4.17 STMicroelectronics N.V.
    • 6.4.18 Infineon Technologies AG
    • 6.4.19 Sanmina Corp.
    • 6.4.20 Flex Ltd.

7. Market Opportunities and Future Outlook

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Global Automotive Printed Circuit Board (PCB) Market Report Scope

An automotive PCB is a complex circuit used to control all the electronics present in a vehicle. Automotive PCBs are used for common functions like deploying airbags and controlling other safety aids like the Electronic Stability Program (ESP) and Hill Assist Descent. They also control ADAS features like adaptive cruise control and parking sensors in a vehicle. An automotive PCB consists of a board made up of non-conductive material on which all other electronic components like sensors and microcontrollers are mounted.

The automotive PCB market has been segmented by vehicle type, propulsion type, and geography. By vehicle type, the market is segmented into Passenger Vehicles and Commercial Vehicles. By propulsion type, the market is segmented into IC Engine and Electric. By geography, the market is segmented into North America, Europe, Asia-Pacific, and the Rest of the World. For each segment, market sizing and forecasting were done based on value (in USD).

By Vehicle Type Passenger Cars
Commercial Vehicles
By Propulsion Type ICE Vehicles
Battery Electric Vehicles (BEV)
Hybrid and Plug-in Hybrid Vehicles
By PCB Type Single-Layer
Double-Layer
Multi-Layer
High-Density Interconnect (HDI)
Rigid-Flex / Flexible
By Substrate Rigid (FR-4 and metal-core)
Flexible Polyimide
Rigid-Flex
By Application ADAS and Safety
Powertrain and Electrification
Body and Comfort
Infotainment and Connectivity
Autonomous Driving Compute
By Level of Automation SAE Level 0 - 2
SAE Level 3
SAE Level 4 - 5
By Geography North America United States
Canada
Rest of North America
South America Brazil
Arzentina
Rest of South America
Europe Germany
United Kingdom
France
Russia
Rest of Europe
Asia-Pacific China
Japan
India
South Korea
Rest of Asia-Pacific
Middle East and Africa Saudi Arabia
United Arab Emirates
Turkey
South Africa
Rest of Middle East and Africa
By Vehicle Type
Passenger Cars
Commercial Vehicles
By Propulsion Type
ICE Vehicles
Battery Electric Vehicles (BEV)
Hybrid and Plug-in Hybrid Vehicles
By PCB Type
Single-Layer
Double-Layer
Multi-Layer
High-Density Interconnect (HDI)
Rigid-Flex / Flexible
By Substrate
Rigid (FR-4 and metal-core)
Flexible Polyimide
Rigid-Flex
By Application
ADAS and Safety
Powertrain and Electrification
Body and Comfort
Infotainment and Connectivity
Autonomous Driving Compute
By Level of Automation
SAE Level 0 - 2
SAE Level 3
SAE Level 4 - 5
By Geography
North America United States
Canada
Rest of North America
South America Brazil
Arzentina
Rest of South America
Europe Germany
United Kingdom
France
Russia
Rest of Europe
Asia-Pacific China
Japan
India
South Korea
Rest of Asia-Pacific
Middle East and Africa Saudi Arabia
United Arab Emirates
Turkey
South Africa
Rest of Middle East and Africa
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Key Questions Answered in the Report

What is the projected size of the automotive printed circuit board market by 2030?

The automotive printed circuit board market size is projected to reach USD 16.08 billion by 2030 on a 5.64% CAGR trajectory.

Which vehicle category contributes the largest revenue share?

Passenger cars represent 62.13% of the automotive printed circuit board market due to high electronics content.

Why is high-density interconnect technology growing quickly?

HDI boards enable compact routing for radar, camera, and zonal controllers, driving an 11.24% CAGR within the automotive printed circuit board market.

How does copper-price volatility influence board suppliers?

Spikes increase material costs, pressuring margins; larger suppliers hedge, but smaller fabs face consolidation risks in the automotive printed circuit board market.

Which region shows the fastest growth outlook?

Asia-Pacific leads growth with an 8.28% CAGR, anchored by China’s capacity and Southeast Asia’s new fabs.

What capabilities do automakers value most in board partners?

Integrated design-to-manufacture services, ISO 26262 compliance, and advanced thermal-management know-how are paramount inside the automotive printed circuit board market.

Page last updated on: July 2, 2025

Automotive Printed Circuit Board (PCB) Market Report Snapshots