Thick Film Devices Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The Global Thick Film Devices Market is segmented by Type (Capacitor, Resistors, Photovoltaic Cells, Heaters), End-user Industry (Automotive, Consumer Electronics, Healthcare, Infrastructure), and Geography.

Thick Film Devices Market Size

Thick Film Devices Market Analysis

The Thick Film Devices Market is expected to register a CAGR of 14.04% during the forecast period.

  • For instance, in April 2020, Bourns, Inc. announced the availability of a new AEC-Q200 compliant series of thick film chip resistors -- Model CRxxxxA series. It is designed in five different versions to support specific application requirements -- CR standard, CR-PF ultra-low lead content, CR-AS sulfur resistant, CRxxxxA-AS AEC-Q200 compliant, and sulfur resistant and CRxxxxA AEC-Q200 compliant. In May 2019, ATE Electronics had released the next power level thick film resistor PR800. This new resistor has a 30% higher power capability than the latest PR600 with the same footprint of 57(65) x 60mm.
  • The growing technological advancements in the sector is also expanding thick film devices' industrial adoption. Growing demand for MEMS (microelectromechanical systems) and multi-layer ceramic capacitors are also expected to fuel the demand for thick film technology over the forecast period. However, in 2019, thick film chip resistor and MLCC manufacturers experienced price increases in feedstock metals, which is also a capable passive component industry. It is estimated that variable costs to produce MLCC and thick film chip resistors (which are the two-mass produced passive components) amount to about 70-80% of the cost of goods sold in various passive electronic component industries.
  • Increasingly demanding technical requirements have exposed the limits of the standard thick-film technologies used to produce circuit-board conductors. However, companies are also investing in developing a new generation of thick-film pastes, and their photolithographic structuring enables the manufacturing of extremely high-resolution thick-film structures necessary for advanced applications, like 5G technology.
  • For instance, researchers from the Fraunhofer Institute for Ceramic Technologies and Systems IKTS, in collaboration with MOZAIK, a UK-based company, have developed conductors based on screen-printing technology with a resolution of 20 micrometers or less. They claim that the process is suitable for industrial applications (especially 5G) and mass production, and the investment costs are low.
  • The spread of the novel Corona Virus has severely affected the market studied. This is because of the sudden shutdown of factories along with a ban on international flights. In modern manufacturing history, demand, supply, and workforce availability for the first time are affected globally at the same time. Thick film devices manufacturing requires people to be physically on-site. Most of the factories making these devices are not designed to be managed remotely. February 2020 also witnessed the biggest-ever fall in the history of the worldwide smartphone market. Due to the dampened sales of these durables, the market vendors' operating profit has drastically decreased.

Thick Film Devices Industry Overview

The thick film devices market is consolidated due to a significant share of the market is occupied by top players. Moreover, the new player finds it difficult to enter the market due to the strong dominance of existing players. Some of the key players include Panasonic Corporation, Samsung Electronics Co. Ltd, Vishay Intertechnology Inc., TE Connectivity Ltd, KOA Speer Electronics, Inc., and AVX Corporation others.

  • April 2020 - Panasonic Corporation introduced NEW ERJ-UP3 Series Anti-Sulfurated Thick Film Chip Resistors, Anti-Surge Type in 0603-inch case size. It is designed to be extremely durable in challenging or unclean, harsh environments. It provides anti-sulfurization characteristics that avoid an open circuit caused by a sulfide disconnection.
  • February 2020 - Vishay Intertechnology, Inc. introduced the first high power resistors on the market to be offered with its AEC-Q200 qualified thick film high power resistors. It is designed for direct mounting on a heatsink. The company's Sfernice LPSA range of products delivers high power dissipation and pulse handling capabilities, which in turn helps the designers to reduce component counts and lower costs in automotive applications.

Thick Film Devices Market Leaders

  1. Panasonic Corporation

  2. Samsung Electronics Co. Ltd

  3. TE Connectivity Ltd

  4. Vishay Intertechnology Inc.

  5. Rohm Semiconductor GmbH

  6. *Disclaimer: Major Players sorted in no particular order
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Thick Film Devices Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Force Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Consumers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis

5. MARKET DYNAMICS

  • 5.1 Market Drivers
  • 5.2 Market Restraints

6. TECHNOLOGY SNAPSHOT

  • 6.1 Technology Overview
    • 6.1.1 Flexography Printing
    • 6.1.2 Gravure Printing
    • 6.1.3 Offset Printing
    • 6.1.4 Screen Printing
    • 6.1.5 Inkjet Printing
    • 6.1.6 Other Technologies
  • 6.2 Comparative Analysis
  • 6.3 Technology Road Map

7. MARKET SEGMENTATION

  • 7.1 By Type
    • 7.1.1 Capacitors
    • 7.1.2 Resistors
    • 7.1.3 Photovoltaic cells
    • 7.1.4 Heaters
    • 7.1.5 Other Types
  • 7.2 By End-user Industry
    • 7.2.1 Automotive
    • 7.2.2 Healthcare
    • 7.2.3 Consumer Electronics
    • 7.2.4 Infrastructure
    • 7.2.5 Other End-user Industries
  • 7.3 Geography
    • 7.3.1 North America
    • 7.3.2 Europe
    • 7.3.3 Asia-Pacific
    • 7.3.4 Rest of the World

8. COMPETITIVE LANDSCAPE

  • 8.1 Company Profiles
    • 8.1.1 Panasonic Corporation
    • 8.1.2 Samsung Electronics Co. Ltd
    • 8.1.3 Vishay Intertechnology Inc.
    • 8.1.4 Rohm Semiconductor GmbH
    • 8.1.5 TE Connectivity Ltd
    • 8.1.6 KOA Speer Electronics Inc.
    • 8.1.7 AVX Corporation
    • 8.1.8 Aragonesa de Componentes Pasivos SA
    • 8.1.9 Wurth Electronics Inc.
  • *List Not Exhaustive
  • 8.2 Other Companies Analyzed
    • 8.2.1 Murata Manufacturing Co. Ltd
    • 8.2.2 YAGEO Corp.
    • 8.2.3 Viking Tech Corporation
    • 8.2.4 Walsin Technology Corporation
    • 8.2.5 Bourns Inc.
    • 8.2.6 Chromalox Inc.
    • 8.2.7 Ferro Techniek BV
    • 8.2.8 Watlow Electric Manufacturing Co.
    • 8.2.9 Midas Microelectronics Corp.
    • 8.2.10 Tempco Electric Heater Corporation
    • 8.2.11 Thermo Heating Elements LLC
    • 8.2.12 Datec Coating Corporation

9. INVESTMENT ANALYSIS

10. FUTURE OF THE MARKET

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Thick Film Devices Industry Segmentation

Thick film devices are single-layered or multi-layered structures that are made up by the deposition of a formulated paste on a substrate. The substrate is made of different materials such as ceramic, polymer, and metals. The layer deposited on the substrate facilitates mechanical, electrical, and chemical functionality for the device, in which the coating is fabricated. Thick film devices are widely used in energy devices such as photovoltaic cells and fuel cells as well as in electronic devices such as capacitors and circuit devices. Moreover, the thick film devices find their use in mechanical and chemical apparatus, which consist of optical sensors and piezoelectric devices.

By Type Capacitors
Resistors
Photovoltaic cells
Heaters
Other Types
By End-user Industry Automotive
Healthcare
Consumer Electronics
Infrastructure
Other End-user Industries
Geography North America
Europe
Asia-Pacific
Rest of the World
By Type
Capacitors
Resistors
Photovoltaic cells
Heaters
Other Types
By End-user Industry
Automotive
Healthcare
Consumer Electronics
Infrastructure
Other End-user Industries
Geography
North America
Europe
Asia-Pacific
Rest of the World
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Thick Film Devices Market Research FAQs

What is the current Thick Film Devices Market size?

The Thick Film Devices Market is projected to register a CAGR of 14.04% during the forecast period (2025-2030)

Who are the key players in Thick Film Devices Market?

Panasonic Corporation, Samsung Electronics Co. Ltd, TE Connectivity Ltd, Vishay Intertechnology Inc. and Rohm Semiconductor GmbH are the major companies operating in the Thick Film Devices Market.

Which is the fastest growing region in Thick Film Devices Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in Thick Film Devices Market?

In 2025, the Asia Pacific accounts for the largest market share in Thick Film Devices Market.

What years does this Thick Film Devices Market cover?

The report covers the Thick Film Devices Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Thick Film Devices Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

Thick Film Devices Industry Report

Statistics for the 2025 Thick Film Devices market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Thick Film Devices analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.

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