System in Package Technology Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The System in Package Technology Market is segmented by Package (Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages), Package Technology (2D IC, 5D IC, 3D IC), Packaging Method (Wire Bond, Flip Chip and Fan-Out Wafer Level), Device (Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Baseband Processor, Application Processor and Others), Application (Consumer Electronics, Telecommunications, Industrial Systems, Automotive and Transportation, Aerospace and Defense, Healthcare and Others), and Geography.

System in Package Technology Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

System In Package Technology Market Size

System in Package Technology Market Forecast
Study Period 2019 - 2030
Base Year For Estimation 2024
Forecast Data Period 2025 - 2030
CAGR 8.00 %
Fastest Growing Market Asia Pacific
Largest Market North America
Market Concentration Medium

Major Players

System in Package Technology Market Key Players

*Disclaimer: Major Players sorted in no particular order

Compare market size and growth of System in Package Technology Market with other markets in Technology, Media and Telecom Industry

Automation

Digital Commerce

Electronics

Information Technology

Media and Entertainment

Security & Surveillance

System In Package Technology Market Analysis

The System in Package Technology Market is expected to register a CAGR of 8% during the forecast period.

  • As system in package technology maximizes system performance due to higher integration and eliminates re-packaging with shorter development cycles at reduced costs has increased its adoption in most advanced consumer electronic devices. According to the 2020 Consumer Technology Association report, the United States consumer technology industry is expected to a record USD 422 billion in retail revenues in 2020 with nearly 4% growth over last year due to increased popularity of streaming services and wireless earbuds along with 5G connectivity and artificial intelligence (AI) enabled devices.
  • Increased utilization of drones, Unmanned Aerial Vehicles (UAVs) in military, commercial, scientific, and consumer markets due to reduction in manufacturing costs, and open source software frameworks for security purposes is thriving the market. As per Federal Aviation and Administration, there are total of 1,563,263 registered drones out of that 441,709 are commercial drones and 1,117,900 are recreational drones as of March 2020.
  • Higher level of integration leads to thermal issues that can compromise the efficiency of devices and would hinder the growth of the market. However, increased demand for compact size and enhanced durability of electronic component in smart gadgets are expected to provide lucrative opportunities to the market.

System In Package Technology Industry Overview

The system in package technology market is competitive and is dominated by a few major players like Amkor Technology Inc., ASE Group, Samsung Electronics Co Ltd., Toshiba Corporation, and Qualcomm. These major players with a prominent share in the market are focusing on expanding their customer base across foreign countries. These companies are leveraging strategic collaborative initiatives to increase their market share and increase their profitability. However, with technological advancements and product innovations, mid-size to smaller companies are increasing their market presence by securing new contracts and by tapping new markets.

  • April 2020 - Fujitsu has received a supercomputer order from Japan Aerospace Exploration Agency. Its new computing system will consist of Fujitsu Supercomputer PRIMEHPC FX1000 with 19.4 petaflops (approximately 5.5 times the theoretical computing performance of the current computing system), in addition to 465 nodes of x86 servers Fujitsu Server PRIMERGY series for general-purpose systems handling diverse computing needs. The new system will be used for conventional numerical simulations, AI computational processing platform for joint research/shared use, and large-scale data analysis platform to aggregate/analyze satellite observation data.
  • March 2020 - Toshiba Corporation has launched 80V N-channel power MOSFETs fabricated with the latest generation process. The new MOSFETs are suitable for switching power supplies in industrial equipment used in data centers and communication base stations.The expanded line-up includes "TPH2R408QM," housed in SOP Advance, a surface-mount type packaging, and "TPN19008QM," housed in a TSON Advance package.

System In Package Technology Market Leaders

  1. Samsung Electronics Co., Ltd.

  2. ASE Group

  3. Amkor Technology Inc.

  4. Toshiba Corporation

  5. Qualcomm Incorporated

  6. ChipMOS Technologies Inc

  7. *Disclaimer: Major Players sorted in no particular order
Amkor Technology Inc., ASE Group, Samsung Electronics Co Ltd., Toshiba Corporation,Qualcomm
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System In Package Technology Market Report - Table of Contents

1. INTRODUCTION

  • 1.1 Study Deliverables
  • 1.2 Study Assumptions
  • 1.3 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Growing demand for miniaturization of electronic devices
    • 4.2.2 Rapid Technological Advances Led to Cost Reduction
  • 4.3 Market Restraints
    • 4.3.1 Thermal Issues Due to Higher level of Integration
  • 4.4 Value Chain Analysis
  • 4.5 Porter's Five Force Analysis
    • 4.5.1 Threat of New Entrants
    • 4.5.2 Bargaining Power of Buyers/Consumers
    • 4.5.3 Bargaining Power of Suppliers
    • 4.5.4 Threat of Substitute Products
    • 4.5.5 Intensity of Competitive Rivalry
  • 4.6 Assessment of COVID-19 Impact on the Industry

5. MARKET SEGMENTATION

  • 5.1 Package
    • 5.1.1 Flat Packages
    • 5.1.2 Pin Grid Arrays
    • 5.1.3 Surface Mount
    • 5.1.4 Small Outline
  • 5.2 Package Technology
    • 5.2.1 2D IC
    • 5.2.2 3D IC
    • 5.2.3 5D IC
  • 5.3 Packaging Method
    • 5.3.1 Wire Bond
    • 5.3.2 Flip Chip
    • 5.3.3 Fan-Out Wafer Leve
  • 5.4 Device
    • 5.4.1 Power Management Integrated Circuit (PMIC)
    • 5.4.2 Microelectromechanical Systems (MEMS)
    • 5.4.3 RF Front-End
    • 5.4.4 RF Power Amplifier
    • 5.4.5 Application Processor
    • 5.4.6 Baseband Processor
    • 5.4.7 Others
  • 5.5 Application
    • 5.5.1 Consumer Electronics
    • 5.5.2 Telecommunications
    • 5.5.3 Industrial Systems
    • 5.5.4 Automotive and Transportation
    • 5.5.5 Aerospace and Defense
    • 5.5.6 Healthcare
    • 5.5.7 Other Applications
  • 5.6 Geography
    • 5.6.1 North America
    • 5.6.2 Europe
    • 5.6.3 Asia-Pacific
    • 5.6.4 Latin America
    • 5.6.5 Middle East and Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Company Profiles
    • 6.1.1 Amkor Technology Inc.
    • 6.1.2 ASE Group
    • 6.1.3 Samsung Electronics Co Ltd.
    • 6.1.4 Powertech Technologies Inc.
    • 6.1.5 Fujitsu Ltd.
    • 6.1.6 Toshiba Corporation
    • 6.1.7 Qualcomm
    • 6.1.8 Renesas Electronics Corporation
    • 6.1.9 ChipMOS Technologies Inc.
    • 6.1.10 Jiangsu Changjiang Electronics Technology Co. Ltd.
    • 6.1.11 Powertech Technologies Inc.
    • 6.1.12 Siliconware Precision Industries Co.
    • 6.1.13 Freescale Semiconductor Inc.
  • *List Not Exhaustive

7. INVESTMENT ANALYSIS

8. MARKET OPPORTUNITIES AND FUTURE TRENDS

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System In Package Technology Industry Segmentation

System in package (SIP) technology utilizes a functional package that integrates multiple functional chips to develop solutions that can be customized as per the user requirement. It accepts many types of bare chips and modules for arrangement and assembly as they can be structured in either a planar arrangement (2D) or in a stacked arrangement (3D) depending upon the number of modules to be used in confined space.

Package Flat Packages
Pin Grid Arrays
Surface Mount
Small Outline
Package Technology 2D IC
3D IC
5D IC
Packaging Method Wire Bond
Flip Chip
Fan-Out Wafer Leve
Device Power Management Integrated Circuit (PMIC)
Microelectromechanical Systems (MEMS)
RF Front-End
RF Power Amplifier
Application Processor
Baseband Processor
Others
Application Consumer Electronics
Telecommunications
Industrial Systems
Automotive and Transportation
Aerospace and Defense
Healthcare
Other Applications
Geography North America
Europe
Asia-Pacific
Latin America
Middle East and Africa
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System In Package Technology Market Research FAQs

What is the current System in Package Technology Market size?

The System in Package Technology Market is projected to register a CAGR of 8% during the forecast period (2025-2030)

Who are the key players in System in Package Technology Market?

Samsung Electronics Co., Ltd., ASE Group, Amkor Technology Inc., Toshiba Corporation, Qualcomm Incorporated and ChipMOS Technologies Inc are the major companies operating in the System in Package Technology Market.

Which is the fastest growing region in System in Package Technology Market?

Asia Pacific is estimated to grow at the highest CAGR over the forecast period (2025-2030).

Which region has the biggest share in System in Package Technology Market?

In 2025, the North America accounts for the largest market share in System in Package Technology Market.

What years does this System in Package Technology Market cover?

The report covers the System in Package Technology Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the System in Package Technology Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

System in Package Technology Industry Report

Statistics for the 2025 System in Package Technology market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. System in Package Technology analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.