Semiconductor Wafer Polishing and Grinding Equipment Market Research Report, 2030

Name: Semiconductor Wafer Polishing and Grinding Equipment Market Research Report, 2030
Creator: Mordor Intelligence
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Semiconductor Wafer Polishing And Grinding Equipment Market Size and Share

Market Overview

Study Period	2019 - 2030
Market Size (2025)	USD 1.58 Billion
Market Size (2030)	USD 2.13 Billion
Growth Rate (2025 - 2030)	6.20% CAGR
Fastest Growing Market	Middle East and Africa
Largest Market	Asia Pacific
Market Concentration	Medium
Major Players *Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

Semiconductor Wafer Polishing and Grinding Equipment Market (2025 - 2030) — Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

Semiconductor Wafer Polishing And Grinding Equipment Market Analysis by Mordor Intelligence

The semiconductor wafer polishing and grinding equipment market size stood at USD 1.58 billion in 2025 and is forecast to reach USD 2.13 billion by 2030, reflecting a 6.2% CAGR as device makers pursue smaller geometries and higher performance.^{[1]Semiconductor Industry Association, “2024 State of the U.S. Semiconductor Industry,” semiconductors.org} During the period, capital spending on larger wafers, wide-bandgap materials, and automation tools has driven sustained order volumes for precision material-removal systems. Equipment suppliers scaled real-time process-control features to manage atomic-level tolerances, while AI-enabled diagnostics offset technician shortages and improved yield. Export-control rules reshaped sourcing strategies, prompting parallel investments in North America and Europe that reduced over-reliance on Asia and strengthened regional service footprints. Sustainability mandates also influenced tool selection, accelerating the shift toward slurry-free CMP pads and low-consumable grinding technologies.

Key Report Takeaways

By equipment type, Chemical Mechanical Polishing (CMP) led with 56.4% revenue share in 2024; integrated grinder-polisher tools are projected to expand at a 7.9% CAGR to 2030.
By wafer size, 300 mm accounted for 62.4% of the semiconductor wafer polishing and grinding equipment market share in 2024, while the 450 mm and above segment is poised for an 11.2% CAGR through 2030.
By technology, CMP tools commanded 56.4% revenue in 2024; edge-grinding and bevel-polishing solutions are advancing at an 8.9% CAGR over the forecast horizon.
By semiconductor type, logic and SoC devices held a 33.2% share in 2024, whereas SiC / GaN power devices are set for a 10.2% CAGR to 2030.
By end-user, foundries represented 50.4% of demand in 2024, while OSAT and advanced-packaging facilities are growing at a 7.8% CAGR.
By geography, Asia-Pacific dominated with 68.5% revenue in 2024; the Middle East and Africa region shows the fastest 9.2% CAGR from 2025-2030.

Global Semiconductor Wafer Polishing And Grinding Equipment Market Trends and Insights

Drivers Impact Analysis

Driver	(~) % Impact on CAGR Forecast	Geographic Relevance	Impact Timeline
Growing consumption of consumer electronics with advanced-node chips	+1.2%	Asia-Pacific, spillover to North America and Europe	Medium term (2-4 years)
Miniaturization push driving demand for 300 mm and 450 mm CMP tools	+1.5%	Global concentration in Taiwan, South Korea, and Japan	Long term (≥ 4 years)
Foundry capacity investments in the U.S. and Europe under the CHIPS Act	+1.8%	North America, Europe	Medium term (2-4 years)
Transition to SiC/GaN power devices requires ultra-precision grinding	+1.3%	Global, early adoption in Japan, Germany, USA	Medium term (2-4 years)
Yield-enhancement needs for 3D-IC and heterogeneous integration	+0.9%	Global: Taiwan, South Korea, USA	Short term (≤ 2 years)
Sustainability mandates advancing slurry-free polishing technologies	+0.7%	Europe, North America, Japan	Long term (≥ 4 years)

Source: Mordor Intelligence

Growing consumption of consumer electronics with advanced-node chips in Asia

Rapid uptake of flagship smartphones and AI-enabled wearables across China, India, and Southeast Asia accelerated demand for sub-3 nm devices that require atomically smooth wafer surfaces and defect densities measured in parts per billion. Local foundries expanded CMP and fine-grinding capacity despite export-license uncertainty, while tool makers introduced chlorine-free pads that met strict environmental codes without compromising planarity. As multi-core SoCs proliferated, process uniformity across diverse material stacks became critical, spurring investment in adaptive-control CMP systems tailored for heterogeneous layers.

Miniaturization push driving demand for 300 mm and 450 mm CMP tools

The search for cost-effective die density sustained 300 mm as the mainstream format, yet exploratory 450 mm development resurfaced because a larger blank yields 2.25 times more die area. Tool makers tackled the scale-up challenge by reinforcing platens, optimizing slurry distribution, and embedding in-situ metrology to maintain nanometer-level removal uniformity across wider surfaces. TSMC’s prototype 510 mm × 515 mm rectangular substrate hinted at an alternate path that could triple usable area without fully overhauling legacy tool architectures.

Foundry capacity investments in the U.S. and Europe under the CHIPS Act

Between 2024 and 2025, more than USD 450 billion of private projects were announced in the United States, while the European Chips Act mobilized EUR 43 billion to double the region’s output share by 2030. Both programs required localized CMP and grinding ecosystems that conform to tighter export-control rules and deliver rapid service response. Vendors responded by expanding U.S. refurbishment centers and EU demo labs, shortening lead times, and ensuring compliance with the Foreign Direct Product (FDP) regulations.

Transition to SiC/GaN power devices requires ultra-precision grinding

SiC and GaN wafers reached 16% penetration of power-device output in 2024 and are projected to exceed 32% by 2029, a shift that demanded harder wheels, ultrasonic assistance, and EDM-based non-contact methods to prevent subsurface damage. Material-removal rates lagged silicon by 30-50%, so tool builders prioritized process efficiency, integrating AI-driven spark-detection and coolant-flow analytics to safeguard wafer integrity and cut cycle time.

Restraints Impact Analysis

Restraint	(~) % Impact on CAGR Forecast	Geographic Relevance	Impact Timeline
High capital cost and long ROI cycle for 300 mm tools	-1.2%	Global, higher impact in emerging markets	Medium term (2-4 years)
Consumables cost inflation (pads, slurries, wheels)	-0.8%	Global	Short term (≤ 2 years)
Export controls and IP barriers limiting shipments to China	-1.4%	China with a global ripple	Medium term (2-4 years)
Skilled technician shortage for process setup and maintenance	-0.9%	Global, acute in North America and Europe	Long term (≥ 4 years)

Source: Mordor Intelligence

High capital cost and long ROI cycle for 300 mm tools

A single 300 mm CMP platform carried a USD 3-5 million price tag in 2024, with facility upgrades adding USD 1-2 million, stretching payback beyond 4 years in lower-volume fabs. Smaller players delayed expansion and opted for refurbished or shared-capacity models, slowing overall tool uptake despite clear cost-per-die advantages at scale.

Export controls and IP barriers limiting shipments to China

The December 2024 U.S. interim rule expanded the FDP framework, cutting projected 2025 equipment shipments to China by up to 30% and forcing vendors to re-engineer modules that embed U.S. technology.^{[2]U.S. Bureau of Industry and Security, “Foreign-Produced Direct Product Rule Additions, and Refinements to Controls for Advanced Computing and Semiconductor Manufacturing Items,” federalregister.gov} Chinese customers accelerated domestic tool programs, diversifying global demand but compressing margins for companies highly exposed to the market.

Segment Analysis

By Equipment Type: CMP Dominates, Integrated Solutions Accelerate

CMP tools generated 56.4% of 2024 revenue and remained central to advanced-node planarity targets that mandate removal accuracy below 0.1 nm. The semiconductor wafer polishing and grinding equipment market benefited as fabs adopted abrasive-free slurries and AI-assisted endpoint detection to push sub-3 nm yields upward. Integrated grinder-polisher platforms reduced wafer transfers, trimming particle risks, and cutting queue time.

Integrated systems’ 7.9% CAGR through 2030 outpaced standalone grinders as customers consolidated process steps to free cleanroom space. Vendors bundled closed-loop temperature control, predictive maintenance, and consumable-life analytics, enhancing OEE for high-mix production. Emerging lapping and slicing tools addressed diamond and other ultra-hard substrates, extending the semiconductor wafer polishing and grinding equipment market reach into niche photonics and quantum-device lines.

Semiconductor Wafer Polishing and Grinding Equipment Market — Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

By Wafer Size: 300 mm Dominates, 450 mm Emerges

The 300 mm node held 62.4% of market revenue, underlining decades of process maturity, optimized consumables, and well-depreciated fab assets. Continuous enhancements in CMP pad texture and back-grinding wheel geometry further raised throughput, reinforcing the segment’s economic moat within the semiconductor wafer polishing and grinding equipment market.

Conversely, the 450 mm and above category registered the fastest 11.2% CAGR, driven by pilot lines exploring rectangular formats that promise 3× more die per wafer. Equipment makers prototyped enlarged platens, robotic handlers, and high-capacity slurry-delivery systems adaptable to multiple diameters, positioning themselves for potential mass adoption beyond 2028 as the semiconductor wafer polishing and grinding equipment industry evaluates ROI at scale.

By Technology: CMP Leads, Edge-Grinding Accelerates

CMP, spanning metal and oxide steps, retained a 56.4% share by combining chemical selectivity with mechanical abrasion that achieves angstrom-level flatness. Real-time friction sensing and machine-learning models cut within-wafer non-uniformity below 1.5%, a critical metric for gate-all-around transistors. These advances widened the semiconductor wafer polishing and grinding equipment market opportunity in logic, memory, and 3D-IC flows.

Edge-grinding and bevel-polishing saw an 8.9% CAGR as 300 mm and larger wafers raised stress at peripheries, triggering crack-containment efforts. Vendors launched auto-centering chucks and laser-measurement modules to safeguard thin dies destined for stacked packages. Double-side grinding sustained moderate growth, offering superior parallelism for immersion lithography depth-of-focus windows, whereas back-grinding thrived in advanced packaging where thickness targets fell below 50 µm.

By Semiconductor Type: Logic and SoC Leads, Power Devices, Surge

Logic and SoC lines captured 33.2% revenue in 2024, reflecting relentless compute demand from AI, edge, and cloud services. Multi-layer copper interconnects and high-k dielectrics multiply CMP steps per wafer, expanding the semiconductor wafer polishing and grinding equipment market addressable spend.

Power and analog devices based on SiC / GaN are projected to grow at a 10.2% CAGR, propelled by EV inverters and renewable power stages that tolerate higher voltages and temperatures. Nanometer-grade grinding minimized subsurface micro-cracks that degrade on-state resistance, making specialized wheels and coolant chemistries a decisive differentiator within the semiconductor wafer polishing and grinding equipment industry.

By End-User: Foundries Dominate, OSAT Facilities Accelerate

Foundries accounted for 50.4% of 2024 demand thanks to aggressive capacity ramps below 5 nm and stringent uptime commitments. Tool suppliers provided on-site field engineers and cloud-based analytics to meet multi-fab copy-exact requirements, reinforcing the semiconductor wafer polishing and grinding equipment market’s concentration at top-tier fabs.

OSAT and advanced-packaging houses are on track for a 7.8% CAGR because heterogeneous integration and chiplets re-located thinning, polishing, and bonding steps into back-end lines. These customers required compact footprints, wafer-level warpage control, and recipe agility to manage diverse substrate stacks, broadening system specifications, and fostering incremental semiconductor wafer polishing and grinding equipment market growth.

Geography Analysis

Asia-Pacific retained 68.5% of global revenue in 2024, anchored by Taiwan, South Korea, Japan, and China, where integrated device roadmaps and foundry expansions sustained tool procurements. TSMC’s chlorine-free pad rollout and Japan’s subsidy-backed fab clusters reinforced a regional preference for environmentally optimized equipment. Export-control uncertainties nudged Chinese fabs to local suppliers, yet high-end CMP imports persisted via license exceptions, preserving baseline semiconductor wafer polishing and grinding equipment market demand.

North America experienced an investment renaissance following the 2022 CHIPS and Science Act, which mobilized USD 52 billion in incentives and prompted over 90 fab announcements worth nearly USD 450 billion through 2025. Capacity additions raised tool orders, although technician gaps of 67,000 positions by 2030 drove automation priorities and partnerships with academic consortia to accelerate workforce pipelines.

Europe followed with the EUR 43 billion (USD 49.83 billion) Chips Act that targeted a 20% global output share by 2030.^{[3]European Commission, “European Chips Act,” commission.europa.eu} Germany’s precision-engineering firms, France’s advanced-packaging hubs, and Nordic material-science institutes demanded CMP systems featuring energy-recovery pumps and water-recycling loops, aligning procurement with EU Green Deal objectives and fostering differentiated semiconductor wafer polishing and grinding equipment market solutions.

Competitive Landscape

thresholds, patented slurry-delivery architectures, and dense service networks. Applied Materials held more than 70% share of CMP systems, leveraging proprietary platen designs and endpoint optics while bundling global support contracts that lock in consumable revenues. Tokyo Seimitsu (ACCRETECH), Ebara, Logitech, and DISCO filled strategic niches in grinding, edge-polishing, and specialty back-grind lines.

Technology roadmaps emphasized atomic-scale metrology, AI-driven feed-forward correction, and consumable lifecycle analytics that trimmed total cost of ownership. Sustainability also emerged as a competitive axis; Fraunhofer’s low-CO₂ silica slurries entered joint qualification with multiple tool OEMs, while vendors advertised closed-loop filtration to cut slurry waste by 30%.^{[4]Fraunhofer IPMS, “Environmentally Compatible Silicon Oxide-Based Slurries for CMP,” ipms.fraunhofer.de} In May 2025, Mitsui purchased a 30% stake in Okamoto Machine Tool Works to expand sales reach and co-fund R&D for next-generation grinders, illustrating strategic alliances as a pathway to scale in specialized segments.

Regionalization trends reshaped after-sales models: U.S. labs added refurbishment lines to bypass export licensing delays, and EU subsidiaries localized spare-parts depots to hedge against transcontinental shipping risks. Smaller innovators such as Axus Technology captured SiC opportunities by offering modular CMP benches tailored for wide-bandgap wafers, thereby carving space in the broader semiconductor wafer polishing and grinding equipment market despite dominant incumbents.

Semiconductor Wafer Polishing And Grinding Equipment Industry Leaders

DISCO Corporation
Tokyo Seimitsu Co. Ltd (ACCRETECH)
Applied Materials Inc.
Ebara Corporation
Revasum Inc.
*Disclaimer: Major Players sorted in no particular order

Semiconductor Wafer Polishing and Grinding Equipment Market Concentration — Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

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Recent Industry Developments

May 2025: Mitsui and Co. invested JPY 9.8 billion (USD 63.6 million) for a 30% stake in Okamoto Machine Tool Works to accelerate global sales and joint R&D on polishing systems.
April 2025: ChEmpower raised USD 18.7 million to progress high-precision wafer-polishing technology, focusing on atomic-level control for advanced nodes.
March 2025: TSMC launched its chlorine-free CMP Pad Transformation Project, targeting full deployment by 2026.
December 2024: The U.S. Bureau of Industry and Security issued an interim rule tightening export controls on advanced grinding and polishing equipment.

Table of Contents for Semiconductor Wafer Polishing And Grinding Equipment Industry Report

1. INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

4.1 Market Overview
4.2 Market Drivers
- 4.2.1 Growing Consumption of Consumer Electronics with Advanced-Node Chips in Asia
- 4.2.2 Miniaturization Push Driving Demand for 300 mm and 450 mm CMP Tools
- 4.2.3 Foundry Capacity Investments in U.S. and Europe under CHIPS Acts
- 4.2.4 Transition to SiC/GaN Power Devices Requiring Ultra-Precision Grinding
- 4.2.5 Yield-Enhancement Needs for 3D-IC and Heterogeneous Integration
- 4.2.6 Sustainability Mandates Advancing Slurry-Free Polishing Technologies
4.3 Market Restraints
- 4.3.1 High Capital Cost and Long ROI Cycle for 300 mm Tools
- 4.3.2 Consumables Cost Inflation (Pads, Slurries, Diamond Wheels)
- 4.3.3 Export-Control and IP Barriers Limiting Shipments to China
- 4.3.4 Skilled-Technician Shortage for Process Set-up and Maintenance
4.4 Value Chain Analysis
4.5 Regulatory or Technological Outlook
4.6 Porter’s Five Forces
- 4.6.1 Threat of New Entrants
- 4.6.2 Bargaining Power of Buyers
- 4.6.3 Bargaining Power of Suppliers
- 4.6.4 Threat of Substitute Products
- 4.6.5 Intensity of Competitive Rivalry
4.7 Industry Value Chain Analysis
4.8 Secondary Equipment Market Dynamics
4.9 Investment Analysis
4.10 Macroeconomic Impact Assessment

5. MARKET SIZE AND GROWTH FORECASTS (VALUE)

5.1 By Equipment Type
- 5.1.1 Wafer Grinding Machines
- 5.1.2 Wafer Polishing (CMP) Equipment
- 5.1.3 Integrated Grinder-Polisher Tools
- 5.1.4 Others (Lapping, Slicing Thinners)
5.2 By Wafer Size
- 5.2.1 ≤150 mm
- 5.2.2 200 mm
- 5.2.3 300 mm
- 5.2.4 450 mm and Above
5.3 By Technology
- 5.3.1 Back-Grinding
- 5.3.2 Double-Side Grinding
- 5.3.3 Chemical Mechanical Polishing (CMP)
- 5.3.4 Edge-Grinding / Bevel Polishing
5.4 By Semiconductor Type
- 5.4.1 Memory (DRAM, NAND)
- 5.4.2 Logic and SoC
- 5.4.3 Power and Analog (Si, SiC, GaN)
- 5.4.4 MEMS and Sensors
- 5.4.5 CMOS Image Sensors
- 5.4.6 LED and Optoelectronics
5.5 By End-User
- 5.5.1 Foundries
- 5.5.2 Integrated Device Manufacturers (IDMs)
- 5.5.3 OSAT / Advanced Packaging Facilities
- 5.5.4 Research and Development Institutes and Pilot Lines
5.6 By Geography
- 5.6.1 North America
- 5.6.1.1 United States
- 5.6.1.2 Canada
- 5.6.2 South America
- 5.6.2.1 Brazil
- 5.6.2.2 Rest of South America
- 5.6.3 Europe
- 5.6.3.1 Germany
- 5.6.3.2 United Kingdom
- 5.6.3.3 France
- 5.6.3.4 Italy
- 5.6.3.5 Rest of Europe
- 5.6.4 Asia-Pacific
- 5.6.4.1 China
- 5.6.4.2 Taiwan
- 5.6.4.3 Japan
- 5.6.4.4 South Korea
- 5.6.4.5 India
- 5.6.4.6 Rest of Asia-Pacific
- 5.6.5 Middle East and Africa
- 5.6.5.1 Middle East
- 5.6.5.1.1 Saudi Arabia
- 5.6.5.1.2 United Arab Emirates
- 5.6.5.1.3 Turkey
- 5.6.5.1.4 Rest of Middle East
- 5.6.5.2 Africa
- 5.6.5.2.1 South Africa
- 5.6.5.2.2 Nigeria
- 5.6.5.2.3 Rest of Africa

6. COMPETITIVE LANDSCAPE

6.1 Market Concentration
6.2 Strategic Moves
6.3 Market Share Analysis
6.4 Company Profiles (includes Global-level Overview, Market-level Overview, Core Segments, Financials, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
- 6.4.1 Applied Materials Inc.
- 6.4.2 Ebara Corporation
- 6.4.3 DISCO Corporation
- 6.4.4 Tokyo Seimitsu Co. Ltd (ACCRETECH)
- 6.4.5 Revasum Inc.
- 6.4.6 Komatsu NTC Ltd.
- 6.4.7 Okamoto Machine Tool Works Co. Ltd.
- 6.4.8 Lapmaster Wolters GmbH (Precision Surfacing Solutions)
- 6.4.9 Logitech Ltd.
- 6.4.10 Entrepix Inc. (Amtech Systems)
- 6.4.11 G&N Genauigkeits Maschinenbau Nürnberg GmbH
- 6.4.12 Hantop Intelligence Tech Co. Ltd.
- 6.4.13 CMP-Tec Inc.
- 6.4.14 Koyo Machinery Co. Ltd.
- 6.4.15 Shanghai ShinEne Technology Co. Ltd.
- 6.4.16 Qingdao Lapping & Polishing Equipment Co. Ltd.
- 6.4.17 Nagase Integrex Co. Ltd.
- 6.4.18 Strausbaugh Inc. (S-Cubed)
- 6.4.19 Pureon AG
- 6.4.20 Vibrantz Technologies Inc.
- 6.4.21 Axus Technology
- 6.4.22 SHANGHAI FAMOUS TRADE CO.,LTD (ZMSH)
- 6.4.23 Huahai Machinery Group
- 6.4.24 Hansung Engineering Co. Ltd.
- 6.4.25 GPMT Co. Ltd.

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

7.1 White-space and Unmet-Need Assessment

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Global Semiconductor Wafer Polishing And Grinding Equipment Market Report Scope

Grinding and polishing are significant components of the semiconductor wafer fabrication process. They are often dependent on end-user customization and packaging requirements. Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface. However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device to overcome the drawbacks of performing these operations separately, and any grinding method causes particular damage to the wafer.

The Semiconductor Wafer Polishing and Grinding Equipment Market is Segmented by Geography (North America, Europe, Asia Pacific, Rest of the World). The market sizes and forecasts are provided in terms of value (USD million) for the above segments.

By Equipment Type	Wafer Grinding Machines
	Wafer Polishing (CMP) Equipment
	Integrated Grinder-Polisher Tools
	Others (Lapping, Slicing Thinners)
By Wafer Size	≤150 mm
	200 mm
	300 mm
	450 mm and Above
By Technology	Back-Grinding
	Double-Side Grinding
	Chemical Mechanical Polishing (CMP)
	Edge-Grinding / Bevel Polishing
By Semiconductor Type	Memory (DRAM, NAND)
	Logic and SoC
	Power and Analog (Si, SiC, GaN)
	MEMS and Sensors
	CMOS Image Sensors
	LED and Optoelectronics
By End-User	Foundries
	Integrated Device Manufacturers (IDMs)
	OSAT / Advanced Packaging Facilities
	Research and Development Institutes and Pilot Lines

By Geography	North America	United States
		Canada

	South America	Brazil
		Rest of South America

	Europe	Germany
		United Kingdom
		France
		Italy
		Rest of Europe

	Asia-Pacific	China
		Taiwan
		Japan
		South Korea
		India
		Rest of Asia-Pacific

	Middle East and Africa	Middle East	Saudi Arabia
			United Arab Emirates
			Turkey
			Rest of Middle East

		Africa	South Africa
			Nigeria
			Rest of Africa

By Equipment Type

Wafer Grinding Machines

Wafer Polishing (CMP) Equipment

Integrated Grinder-Polisher Tools

Others (Lapping, Slicing Thinners)

By Wafer Size

≤150 mm

200 mm

300 mm

450 mm and Above

By Technology

Back-Grinding

Double-Side Grinding

Chemical Mechanical Polishing (CMP)

Edge-Grinding / Bevel Polishing

By Semiconductor Type

Memory (DRAM, NAND)

Logic and SoC

Power and Analog (Si, SiC, GaN)

MEMS and Sensors

CMOS Image Sensors

LED and Optoelectronics

By End-User

Foundries

Integrated Device Manufacturers (IDMs)

OSAT / Advanced Packaging Facilities

Research and Development Institutes and Pilot Lines

By Geography

North America	United States
	Canada
South America	Brazil
	Rest of South America
Europe	Germany
	United Kingdom
	France
	Italy
	Rest of Europe
Asia-Pacific	China
	Taiwan
	Japan
	South Korea
	India
	Rest of Asia-Pacific

Middle East and Africa	Middle East	Saudi Arabia
		United Arab Emirates
		Turkey
		Rest of Middle East

	Africa	South Africa
		Nigeria
		Rest of Africa

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Key Questions Answered in the Report

What is the current size of the semiconductor wafer polishing and grinding equipment market?

The market stood at USD 1.58 billion in 2025 and is projected to reach USD 2.13 billion by 2030, posting a 6.2% CAGR.

Which equipment type holds the largest revenue share?

Chemical Mechanical Polishing tools led with 56.4% revenue in 2024, owing to their critical role in achieving atomic-level planarity.

Why is the 450 mm wafer segment attracting renewed interest?

Larger substrates offer 2.25× more die area than 300 mm wafers, promising lower cost per chip once technical and capital hurdles are resolved.

How are export-control rules influencing equipment demand?

Stricter U.S., Dutch, and Japanese regulations have cut projected 2025 shipments to China by up to 30%, pushing vendors to localize supply chains in the U.S. and Europe.

What drives rapid growth in SiC / GaN power-device polishing tools?

Electric vehicles and renewable energy systems favor wide-bandgap devices, lifting demand for specialized grinders that handle ultra-hard materials and ensure minimal subsurface damage.