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Power Module Packaging Companies

This report lists the top Power Module Packaging companies based on the 2023 & 2024 market share reports. Mordor Intelligence expert advisors conducted extensive research and identified these brands to be the leaders in the Power Module Packaging industry.

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Power Module Packaging Top Companies

  1. Fuji Electric Co. Ltd

  2. Infineon Technologies AG

  3. Mitsubishi Electric Corporation

  4. Semikron Danfoss Holding A/S (Danfoss A/S)

  5. Amkor Technology Inc.

*Disclaimer: Top companies sorted in no particular order

Power Module Packaging Market Major Players

Power Module Packaging Market Concentration

Power Module Packaging Market Concentration

Power Module Packaging Company List

                  • Fuji Electric Co. Ltd

                  • Infineon Technologies AG

                  • Mitsubishi Electric Corporation

                  • Semikron Danfoss Holding A/S (Danfoss A/S)

                  • Amkor Technology Inc.

                  • Hitachi Ltd

                  • STMicroelectronics NV

                  • Macmic Science & Technology Co. Ltd

                  • Texas Instruments Inc.

                  • Starpower Semiconductor Ltd

                  • Toshiba Corporation


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              Power Module Packaging Market Report Snapshots

              Power Module Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)