IT Connector Market Size & Share Analysis - Industry Research Report

Name: IT Connector Market Size & Share Analysis - Industry Research Report - Growth Trends 2030
Creator: Mordor Intelligence
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IT Connector Market Size and Share

Market Overview

Study Period	2019 - 2030
Market Size (2025)	USD 7.72 Billion
Market Size (2030)	USD 10.07 Billion
Growth Rate (2025 - 2030)	5.46% CAGR
Fastest Growing Market	Asia Pacific
Largest Market	Middle East and Africa
Market Concentration	Medium
Major Players *Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

IT Connector Market Summary — Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

IT Connector Market Analysis by Mordor Intelligence

The IT connector market is valued at USD 7.72 billion in 2025 and is forecast to reach USD 10.07 billion by 2030, tracking a 5.46% CAGR. Growth stems from the urgent need to move data at 224 Gbps-per-lane and beyond inside hyperscale data centers, the region-wide acceleration of 5G / 6G deployments, and the automotive transition to zonal EE architectures in electric vehicles. Co-packaged optics, more efficient RF and VSFF designs, and the availability of on-shore semiconductor capacity funded by the U.S. CHIPS Act round out the demand drivers. At the same time, connector suppliers are working through thermal-mechanical limits above 112 Gbps PAM4 and margin pressure created by a volatile copper price environment.

Key Report Takeaways

By connector type, PCB connectors led with 45% of the IT connector market share in 2024; IO/High-Speed Backplane and Pluggable is projected to expand at a 5.7% CAGR through 2030.
By mounting configuration, board-to-board held 36% revenue share in 2024, whereas wire-to-board is advancing at 6.2% CAGR to 2030.
By data-rate class, ≤10 Gbps commanded a 48% share of the IT connector market size in 2024; ≥56 Gbps PAM4 is rising at a 7.1% CAGR over the forecast period.
By end-user industry, IT and telecom accounted for 38% share in 2024, while automotive and e-mobility is the fastest-growing segment at 3.4% CAGR through 2030.
By geography, Asia Pacific captured 46% of the IT connector market share in 2024; the Middle East and Africa market is forecast to widen at 6.1% CAGR to 2030.

Global IT Connector Market Trends and Insights

Drivers Impact Analysis

Driver	(~) % Impact on CAGR Forecast	Geographic Relevance	Impact Timeline
Surging Demand for High-Speed (>25 Gbps) Interconnects in Hyperscale Data Centers	1.2%	Global, with concentration in North America & Asia Pacific	Medium term (2-4 years)
Rapid 5G/6G Network Roll-outs Elevating RF & VSFF Connector Adoption in Asia	0.9%	Asia Pacific, with spillover to North America	Short term (≤ 2 years)
Automotive Zonal EE Architectures Boosting High-Speed Board-to-Board Connectors in EVs	0.7%	Global, with concentration in Europe & Asia Pacific	Medium term (2-4 years)
Growth of Co-Packaged Optics Accelerating IO Connector Innovation	0.8%	North America & Asia Pacific	Long term (≥ 4 years)
Edge-AI & Industrial IoT Driving Rugged, Sealed Connectors in Factory Automation (EU Focus)	0.6%	Europe, with spillover to North America	Medium term (2-4 years)
U.S. CHIPS Act–Backed On-Shore PCB Production Lifts Domestic Connector Demand	0.5%	North America	Medium term (2-4 years)

Source: Mordor Intelligence

Surging demand for high-speed interconnects in hyperscale data centers

Bandwidth-hungry AI clusters are transitioning beyond 224 Gbps per lane, forcing connector designers to mitigate insertion loss and thermal rise inside cramped server trays. Molex cites rapid uptake of optical transceivers for 224 Gbps PAM4 links, noting that heat removal is now as critical as signal integrity. Activities range from evaluating PAM-6 / PAM-8 modulation to deploying co-packaged copper and optics that shorten electrical channels. Hyperscalers plan to bring 120-130 new sites online every year, compressing build schedules to six weeks and favoring high-density connector systems that can be kitted and assembled rapidly.

Rapid 5G / 6G network roll-outs elevating RF connector adoption

Spectrum auctions in markets such as Vietnam for the 2.6 GHz and 3.5 GHz bands are fueling mid-band macro and small-cell deployments. Massive-MIMO radios are scaling from 4T4R to 32T32R, spurring the shift to compact VSFF interfaces that compress fiber counts. Connector vendors are responding with SN-class footprints that quadruple port density inside front-haul shelves, while carrier-neutral host operators expand distributed antenna systems valued at USD 8.7 billion by 2028.^{[1]5G Americas, “Neutral Host Opportunities for 5G & Beyond,” 5gamericas.org}

Automotive zonal EE architectures boosting high-speed connectors

Redesigning vehicle wiring into zonal domains can reduce harness weight by up to 40%, raising demand for multi-lane board-to-board connectors able to shuttle high-speed data between zone controllers and central compute modules. Molex’s MX-DaSH consolidates signal, power, and data, simplifying line-side routing. The electrified powertrain introduces high-current nodes that push the global high-voltage connector market toward USD 15 billion by 2033 at 6.5% CAGR. These dynamics make zonal EV platforms the fastest-growing design win category for the IT connector market.

Growth of co-packaged optics accelerating IO connector innovation

Integrating optical engines with ASICs eliminates retimer stages, lowering power by 30% and shrinking link budgets. The Optical Internetworking Forum unveiled a high-density connector project in Q1 2025 to formalize mechanical envelopes for co-packaged solutions. Ultra-low-loss fibers and blind-mate optical ferrules are being co-developed, creating new addressable revenue for connector companies skilled in opto-electronic alignment.

Restraints Impact Analysis

Restraint	(~) % Impact on CAGR Forecast	Geographic Relevance	Impact Timeline
Copper and Rare-Metal Price Volatility Raising BOM Costs	-0.7%	Global	Short term (≤ 2 years)
Thermal-Mechanical Reliability Limits at ≥112 Gbps PAM4	-0.5%	Global, with concentration in North America	Medium term (2-4 years)
Lengthy Automotive PPAP Cycles Slowing Connector Design-ins	-0.3%	Global	Medium term (2-4 years)
Regulatory Push for Halogen-Free Plastics Increasing Re-qualification Costs (EU)	-0.4%	Europe, with spillover to global supply chains	Medium term (2-4 years)

Source: Mordor Intelligence

Copper and rare-metal price volatility raising BOM costs

Surging copper and palladium prices have triggered multiple component price notices, such as Panasonic’s January 2025 flex PCB increase.^{[2]Panasonic, “Electronic Materials News,” industrial.panasonic.com} High-speed connectors use thick copper alloys and precious-metal platings, so even a 5% upswing can erode gross margins. Vendors are locking annual supply contracts, qualifying alternative platings, and redesigning contact beams to lower mass without compromising insertion cycles.

Thermal-mechanical reliability limits at high data rates

Exceeding 112 Gbps PAM4 stresses solder joints, lead frames, and housing plastics. Indium Corporation points to electromigration, tin whisker growth, and CTE mismatch as root causes of early field returns. Low-temperature solders and reinforced LCP housings offer partial mitigation, yet accelerated qualification now dominates the engineering roadmap for data-center interconnects.

Segment Analysis

By Connector Type: IO/high-speed backplane outpacing legacy links

PCB connectors accounted for 45% of the IT connector market size in 2024, reflecting their ubiquity across motherboards, storage planes, and industrial controllers. Robust pin integrity, proven mating cycles, and broad component ecosystems keep this category entrenched in volume applications. The segment still benefits from the CHIPS Act-driven reshoring of PCB assembly, which lifts domestic demand for fine-pitch mezzanine formats.

The IO/high-speed backplane-and-pluggable group is forecast to grow at 5.7% CAGR, propelled by data center upgrades to QSFP-DD 800 and OSFP Xtreme cages capable of 112 Gbps per channel. RF/VSFF connectors benefit from 5G small-cell densification, while circular and rectangular housings remain essential for harsh-duty industrial controls. Microminiature options are seeing new use cases in robotic surgery and CubeSats that reward every millimeter saved.

By Mounting Configuration: wire-to-board gaining momentum

Board-to-board held a 36% share in 2024 and remains the workhorse for modular sub-assemblies. Stacked mezzanine and card-edge variants help OEMs meet tight Z-height restrictions inside laptops and switch blades. However, wire-to-board is advancing at 6.2% CAGR as designers favor harnesses that simplify maintenance in EV battery packs and household appliances.

Wire-to-wire assemblies continue to service motor drives and HVAC compressors where board real estate is limited. The miniaturization trend now extends across all mounting styles; Molex’s rugged miniaturized series offers 20-55% footprint reduction while retaining IP67 sealing, directly addressing robotics and outdoor telecom enclosures.

By Data-Rate Class: PAM4 technologies reshape the high-end

The ≤10 Gbps category held a dominant 48% share of the IT connector market size during 2024 because many industrial sensors, infotainment head units, and embedded PCs do not need bleeding-edge bandwidth. The cost-performance sweet spot of these connectors keeps them popular when link budgets favor longer cable runs or multiple drops.

The ≥56 Gbps PAM4 bracket will climb 7.1% CAGR to 2030 as AI inference, NVMe-oF storage fabrics, and disaggregated memory pools migrate to 224 Gbps lanes. OIF’s high-density proposal signals ecosystem alignment around thicker copper-sheet cages and low-skew pair routing that support upgrade paths beyond 800 Gbps per port.

By End-user Industry: automotive and e-mobility accelerating

IT & telecom retained 38% revenue in 2024, driven by cloud service expansions and continuous campus-backbone refurbishment. Hyperscalers’ preference for ODM hardware translates into high-volume demand for cage, mezzanine, and PAM4 twin-ax assemblies.

Automotive and e-mobility, though smaller, is set to grow 3.4% CAGR. SAE-level 2+ autonomy requires high-speed links between cameras, radar, and centralized ADAS processors, complementing the EV push for high-current battery connectors. Industrial automation and medical devices are also raising their share as edge AI uses rugged IP-rated housings that preserve signal integrity despite vibration and chemical exposure.

By Application: 5G/6G base-stations spearhead growth trajectory

Servers and storage occupied 30% of the IT connector market revenue in 2024. Tier-three colocation facilities, regional edge nodes, and AI super-clusters all rely on high-speed cages and orthogonal backplanes to balance cost with upgradability.

The 5G/6G base-station segment will compound 6.5% annually through 2030 as operators compress radio footprints and increase antenna counts. SN and MDC duplex fiber connectors, plus IPx coax links, are winning in remote radio heads tailored for mid-band coverage. EV powertrain / ADAS and factory robots follow closely, with collaborative robot arms debuting built-in connector modularity for hot-swap servo drive.

By Material: halogen-free compounds gain traction

Standard thermoplastics still capture 78% share thanks to established molding cycles and cost advantages. Yet low-halogen or halogen-free resins will rise 5.8% CAGR as REACH and RoHS tighten limits on halogens and brominated flame retardants. TE Connectivity and BizLink have each confirmed active conversion programs for eco-friendly jacketing.

Suppliers that expedite material qualification, including UL 94 V-0 approvals, position themselves for design-in wins on EU automotive platforms and consumer wearables that market sustainability credentials.

Geography Analysis

Asia Pacific dominated with 46% market revenue in 2024, led by China’s vertically integrated electronics base and India’s fast-growing telecom backbone. Mainland connector producers benefit from provincial incentives aimed at reliability upgrades, with the domestic connector sector forecast to add RMB 12.6 billion year-on-year during 2024. Japan and South Korea contribute through the early adoption of co-packaged optics inside advanced foundry lines.

North America ranks second. The CHIPS and Science Act has already channeled USD 6.6 billion to TSMC Arizona and USD 8.5 billion to Intel, underpinning a localized ecosystem for advanced substrates and connector cages compliant with 224 Gbps PAM4 thermal requirements. Aerospace and defense programs also pull through rugged circular MIL-spec variants that command premium margins.

Europe plays to its strengths in automotive, Industry 4.0, and medical. The push for halogen-free plastics has turned many OEMs into early adopters of eco-class housings.^{[3]Kyocera Corporation, “Guideline on Environmentally Hazardous Substances,” kyocera.com} Meanwhile, the Middle East and Africa is set for 6.1% CAGR as hyperscalers install regional cloud zones and governments award smart-city fiber concessions, particularly in Saudi Arabia and the UAE. South America shows steady but lower expansion, weighted toward Brazilian telecom and Argentine industrial automation projects.

Competitive Landscape

TE Connectivity, Amphenol, and Molex anchor the leadership tier. TE Connectivity derived USD 5.7 billion from the Americas, USD 4.8 billion from EMEA, and USD 5.8 billion from APAC in FY 2024, reflecting a balanced geographic footprint.^{[4]TE Connectivity, “TE Connectivity 2024 Annual Report,” te.com} Amphenol’s 27% stock gain in the past 12 months builds on acquisitions such as CommScope’s Outdoor Wireless Networks, which is expected to add USD 1.3 billion to 2025 sales.

Mid-tier firms are differentiating through domain focus: ZJK Industrial introduced liquid-cooled quick couplings for GPU servers at COMPUTEX 2025. Niche medical specialists such as Sumitomo Electric Lightwave earned 4.5/5 in the 2025 Lightwave+BTR Innovation Reviews for field-splicable optical connectors.

Competitive intensity is rising around system-level know-how. Customers increasingly request full-stack solutions: firmware, thermal models, and compliance test plans bundled with the physical connector. This service overlay rewards companies with cross-disciplinary engineering teams and advanced simulation toolchains. Smaller entrants concentrate on ultraminiature or eco-friendly niches, positioning themselves as acquisition targets for strategics looking to plug technology gaps.

IT Connector Industry Leaders

3M Company
Molex Inc. (Koch)
TE Connectivity Limited
Amphenol Corporation
Samtec Inc.
*Disclaimer: Major Players sorted in no particular order

it connector market Concentration.png — Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0.

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Recent Industry Developments

May 2025: Amphenol showcased ExaMAX and OverPass interconnects for 56 G-224 G PAM4 AI servers at COMPUTEX TAIPEI 2025.
May 2025: ZJK Industrial unveiled liquid-cooled quick connectors compatible with NVIDIA MGX platforms.
April 2025: Sumitomo Electric Lightwave’s Lynx-CustomFit splice-on connectors scored 4.5 in the 2025 Lightwave+BTR Innovation Reviews.
April 2025: IBASE Technology launched the EC3100 rugged edge-AI system powered by NVIDIA Orin modules for industrial AIoT.

Table of Contents for IT Connector Industry Report

1. INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

4.1 Market Overview
4.2 Market Drivers
- 4.2.1 Surging Demand for High-Speed (>25 Gbps) Interconnects in Hyperscale Data Centers
- 4.2.2 Rapid 5G/6G Network Roll-outs Elevating RF and VSFF Connector Adoption in Asia
- 4.2.3 Automotive Zonal EE Architectures Boosting High-Speed Board-to-Board Connectors in EVs
- 4.2.4 Growth of Co-Packaged Optics Accelerating IO Connector Innovation
- 4.2.5 Edge-AI and Industrial IoT Driving Rugged, Sealed Connectors in Factory Automation (EU Focus)
- 4.2.6 United States CHIPS Act-Backed On-Shore PCB Production Lifts Domestic Connector Demand
4.3 Market Restraints
- 4.3.1 Copper and Rare-Metal Price Volatility Raising BOM Costs
- 4.3.2 Thermal-Mechanical Reliability Limits at ≥112 Gbps PAM4
- 4.3.3 Lengthy Automotive PPAP Cycles Slowing Connector Design-ins
- 4.3.4 Regulatory Push for Halogen-Free Plastics Increasing Re-qualification Costs (EU)
4.4 Industry Ecosystem Analysis
4.5 Technological Outlook
4.6 Porter's Five Forces Analysis
- 4.6.1 Bargaining Power of Suppliers
- 4.6.2 Bargaining Power of Buyers
- 4.6.3 Threat of New Entrants
- 4.6.4 Threat of Substitutes
- 4.6.5 Competitive Rivalry

5. MARKET SIZE AND GROWTH FORECASTS (VALUES)

5.1 By Connector Type
- 5.1.1 PCB Connectors
- 5.1.2 IDC Connectors
- 5.1.3 IO/High-Speed Backplane and Pluggable
- 5.1.4 Circular and Rectangular
- 5.1.5 RF/VSFF (SN, CS, MMC)
- 5.1.6 Microminiature/Nano Connectors
5.2 By Mounting Configuration
- 5.2.1 Board-to-Board
- 5.2.2 Wire-to-Board
- 5.2.3 Wire-to-Wire/Cable Assemblies
5.3 By Data-Rate Class
- 5.3.1 ≤10 Gbps
- 5.3.2 10-25 Gbps
- 5.3.3 25-56 Gbps
- 5.3.4 ≥56 Gbps/PAM4 112 G
5.4 By End-user Industry
- 5.4.1 IT and Telecom (incl. Data Centers)
- 5.4.2 Consumer Electronics and Computing
- 5.4.3 Automotive and e-Mobility
- 5.4.4 Industrial Automation/IIoT
- 5.4.5 Healthcare and Medical Devices
5.5 By Application
- 5.5.1 Servers and Storage
- 5.5.2 5G/6G Base-Stations
- 5.5.3 EV Powertrain and ADAS
- 5.5.4 Factory Robotics and PLCs
5.6 By Material
- 5.6.1 Standard Thermoplastics
- 5.6.2 Halogen-free/Eco-friendly Compounds
5.7 Geography
- 5.7.1 North America
- 5.7.1.1 United States
- 5.7.1.2 Canada
- 5.7.1.3 Mexico
- 5.7.2 Europe
- 5.7.2.1 Germany
- 5.7.2.2 United Kingdom
- 5.7.2.3 France
- 5.7.2.4 Italy
- 5.7.2.5 Spain
- 5.7.2.6 Russia
- 5.7.2.7 Rest of Europe
- 5.7.3 Asia-Pacific
- 5.7.3.1 China
- 5.7.3.2 Japan
- 5.7.3.3 South Korea
- 5.7.3.4 India
- 5.7.3.5 ASEAN
- 5.7.3.6 Rest of Asia-Pacific
- 5.7.4 South America
- 5.7.4.1 Brazil
- 5.7.4.2 Argentina
- 5.7.4.3 Rest of South America
- 5.7.5 Middle East and Africa
- 5.7.5.1 Saudi Arabia
- 5.7.5.2 United Arab Emirates
- 5.7.5.3 Turkey
- 5.7.5.4 South Africa
- 5.7.5.5 Rest of Middle East and Africa

6. COMPETITIVE LANDSCAPE

6.1 Market Concentration
6.2 Strategic Moves
6.3 Market Share Analysis
6.4 Company Profiles (includes Global level Overview, Market level overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
- 6.4.1 3M Company
- 6.4.2 TE Connectivity Ltd.
- 6.4.3 Molex Inc. (Koch)
- 6.4.4 Amphenol Corporation
- 6.4.5 Samtec Inc.
- 6.4.6 Hirose Electric Co., Ltd.
- 6.4.7 Aptiv PLC
- 6.4.8 Yazaki Corporation
- 6.4.9 Hon Hai Precision (FOXCONN)
- 6.4.10 Phoenix Contact GmbH and Co. KG
- 6.4.11 Harting Technology Group
- 6.4.12 JST Mfg. Co., Ltd.
- 6.4.13 WAGO Kontakttechnik
- 6.4.14 Rosenberger Hochfrequenztechnik
- 6.4.15 Bel Fuse Inc.
- 6.4.16 Kyocera Corporation
- 6.4.17 Luxshare Precision Industry
- 6.4.18 JAE (Japan Aviation Electronics)
- 6.4.19 Fischer Connectors SA
- 6.4.20 CONEC Elektronische Bauelemente GmbH
- 6.4.21 Omnetics Connector Corp.
- 6.4.22 Würth Elektronik GmbH and Co. KG

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

7.1 White-space and Unmet-need Assessment

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Global IT Connector Market Report Scope

Connectors are connectivity devices used to transmit data, signals, and power supply for electronic devices. Moreover, the connectors are electro-mechanical devices used for joining electrical terminations. Connectors are also referred to as input-output connectors and form the interface for linking electronic devices with cable help. The market is segmented based on type (PCB Connectors, IDC Connectors, IO Connectors, and Other Types (Circular/Rectangular)), end-user verticle (IT and Telecom, Consumer Electronics (Computer, Peripherals, and Business Equipment)), and geography (North America, Europe, Asia-Pacific, Latin America, and Middle East and Africa). For each segment, the market sizing and forecasts have been provided on the basis of value (in USD million) and volume (in metric tons).

By Connector Type	PCB Connectors
	IDC Connectors
	IO/High-Speed Backplane and Pluggable
	Circular and Rectangular
	RF/VSFF (SN, CS, MMC)
	Microminiature/Nano Connectors
By Mounting Configuration	Board-to-Board
	Wire-to-Board
	Wire-to-Wire/Cable Assemblies
By Data-Rate Class	≤10 Gbps
	10-25 Gbps
	25-56 Gbps
	≥56 Gbps/PAM4 112 G
By End-user Industry	IT and Telecom (incl. Data Centers)
	Consumer Electronics and Computing
	Automotive and e-Mobility
	Industrial Automation/IIoT
	Healthcare and Medical Devices
By Application	Servers and Storage
	5G/6G Base-Stations
	EV Powertrain and ADAS
	Factory Robotics and PLCs
By Material	Standard Thermoplastics
	Halogen-free/Eco-friendly Compounds

Geography	North America	United States
		Canada
		Mexico

	Europe	Germany
		United Kingdom
		France
		Italy
		Spain
		Russia
		Rest of Europe

	Asia-Pacific	China
		Japan
		South Korea
		India
		ASEAN
		Rest of Asia-Pacific

	South America	Brazil
		Argentina
		Rest of South America

	Middle East and Africa	Saudi Arabia
		United Arab Emirates
		Turkey
		South Africa
		Rest of Middle East and Africa

By Connector Type

PCB Connectors

IDC Connectors

IO/High-Speed Backplane and Pluggable

Circular and Rectangular

RF/VSFF (SN, CS, MMC)

Microminiature/Nano Connectors

By Mounting Configuration

Board-to-Board

Wire-to-Board

Wire-to-Wire/Cable Assemblies

By Data-Rate Class

≤10 Gbps

10-25 Gbps

25-56 Gbps

≥56 Gbps/PAM4 112 G

By End-user Industry

IT and Telecom (incl. Data Centers)

Consumer Electronics and Computing

Automotive and e-Mobility

Industrial Automation/IIoT

Healthcare and Medical Devices

By Application

Servers and Storage

5G/6G Base-Stations

EV Powertrain and ADAS

Factory Robotics and PLCs

By Material

Standard Thermoplastics

Halogen-free/Eco-friendly Compounds

Geography

North America	United States
	Canada
	Mexico
Europe	Germany
	United Kingdom
	France
	Italy
	Spain
	Russia
	Rest of Europe
Asia-Pacific	China
	Japan
	South Korea
	India
	ASEAN
	Rest of Asia-Pacific
South America	Brazil
	Argentina
	Rest of South America
Middle East and Africa	Saudi Arabia
	United Arab Emirates
	Turkey
	South Africa
	Rest of Middle East and Africa

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Key Questions Answered in the Report

What is the current size of the IT connector market?

The IT connector market stands at USD 7.72 billion in 2025 and is projected to reach USD 10.07 billion by 2030.

Which region commands the largest demand for IT connectors?

Asia Pacific leads with 46% market revenue, supported by expansive electronics manufacturing and rapid 5G roll-outs.

Which connector type is growing the fastest?

IO / high-speed backplane and pluggable connectors are forecast to grow at a 5.7% CAGR through 2030, buoyed by hyperscale data-center bandwidth upgrades.

How will 5G and 6G deployments affect connector demand?

Expanded mid-band spectrum use and massive-MIMO radio installations are lifting demand for RF and VSFF interfaces that pack higher density into base-station and fronthaul gear.

Why are automakers shifting toward zonal EE architectures?

Zonal layouts cut wiring weight, lower material cost, and support centralized compute, thereby increasing the need for multi-lane board-to-board connectors able to carry high-speed data and power inside electric vehicles.

What environmental regulations are influencing material choices?

EU RoHS and REACH directives are pushing connector makers toward halogen-free compounds, a material class projected to advance at a 5.8% CAGR between 2025 and 2030.

Page last updated on: June 18, 2025