Global 5G Chipset Market Size and Share
Global 5G Chipset Market Analysis by Mordor Intelligence
The 5G chipset market size generated USD 33.40 billion in 2025 and is forecast to reach USD 79.59 billion by 2030, translating to an 18.97% CAGR over the period. Roll-outs of 5G infrastructure, tighter integration of AI engines inside system-on-chip (SoC) packages, and sustained capital spending by handset and automotive OEMs have underpinned revenue growth. Smartphone vendors used AI-enhanced connectivity to lift average selling prices, while industrial companies poured funds into private 5G deployments that demand ultra-reliable, low-latency links. At the same time, geopolitical export controls reshaped global supply chains, prompting Chinese design houses to build domestic electronic-design-automation (EDA) tools and pushing multinational firms to diversify foundry footprints. Sub-10 nm process migration continued to unlock performance gains but also spiked wafer costs because of yield drag at 3 nm extreme-ultraviolet (EUV) nodes. As a result, design houses balanced leading-edge silicon for premium tiers with cost-optimized nodes above 28 nm for volume segments.
Key Report Takeaways
- By chipset type, SoC with integrated modem held 74.5% of the 5G chipset market share in 2024, while mmWave technology chips are projected to expand at a 21.2% CAGR to 2030.
- By operational frequency, sub-6 GHz solutions commanded 90.2% share of the 5G chipset market in 2024; chipsets operating above 39 GHz are advancing at a 23.5% CAGR through 2030.
- By end-user industry, consumer electronics led with 65.1% revenue share in 2024, whereas automotive and transportation are forecast to post the fastest 26.3% CAGR through 2030.
- By process node, < 10 nm devices accounted for 66.4% share of the 5G chipset market size in 2024, while > 28 nm nodes are set to expand at 27.1% CAGR between 2025 and 2030.
- By geography, Asia-Pacific contributed 45.3% of 2024 revenue, and the Middle East and Africa region is on track to grow at 19.1% CAGR over the forecast horizon.
Global 5G Chipset Market Trends and Insights
Drivers Impact Analysis
Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
---|---|---|---|
Commercial-grade SoC integration driving smartphone ASP premiumization | +4.2% | Global, strong in Asia-Pacific and North America | Medium term (2–4 years) |
Automotive-grade 5G telematics control units accelerating adoption in ADAS-centric vehicles | +3.8% | North America and the EU, expanding to Asia-Pacific | Long term (≥ 4 years) |
Private 5G roll-outs in Industry 4.0 manufacturing hubs of Germany and Japan | +2.9% | Europe and Japan core; spill-over to North America | Medium term (2–4 years) |
O-RAN reference designs spurring merchant-silicon demand from tier-2 telcos | +2.1% | Global, early adoption in India and Southeast Asia | Short term (≤ 2 years) |
BWA subsidy programs in rural United States and India catalyzing fixed-wireless CPE chip sales | +1.7% | United States rural markets and India | Short term (≤ 2 years) |
Source: Mordor Intelligence
Commercial-grade SoC Integration Driving Smartphone ASP Premiumization
Qualcomm’s Snapdragon 8 Elite for Galaxy is packed with dedicated tensor engines besides its 5G modem, enabling on-device large-language-model inference and allowing flagship phones to command 25–30% higher ASPs than 4G predecessors.[1]Samsung Newsroom, “MWC 2025: Explore AI-Powered Innovation,” news.samsung.com MediaTek echoed the approach with its Dimensity 9400+, integrating 42 TOPS AI horsepower without a battery-life penalty. Higher margins created a virtuous circle, funding fresh R&D at advanced nodes and widening the total addressable 5G chipset market for premium suppliers. Mid-range handsets followed suit: Samsung’s Galaxy A56 5G shipped scaled-down AI-ready silicon, bringing “Awesome Intelligence” to mainstream price points and broadening demand for integrated chipsets.
Automotive-Grade 5G Telematics Control Units Accelerating Adoption in ADAS-centric Vehicles
Hyundai partnered with Samsung to validate 5G Reduced Capability (RedCap) modules exhibiting 40% lower power draw yet sub-10 ms latency, meeting stringent functional-safety targets for emergency braking use cases. Automakers saw connectivity as a gateway to subscription services and over-the-air updates, shifting revenue models beyond initial vehicle sales. Tesla’s Berlin Gigafactory embedded private 5G across its production line, underscoring how end-to-end 5G networking supports both manufacturing efficiency and connected-car features. Regulatory triggers such as EU eCall mandates further guaranteed a baseline install rate for 5G-capable telematics units in new vehicles.
Private 5G Roll-outs in Industry 4.0 Manufacturing Hubs of Germany and Japan
Siemens and O₂ Telefónica equipped German plants with licensed-spectrum private 5G, reducing unplanned downtime that could previously cost an automotive line EUR 1.3 million (USD 1.47 million) per hour. Japanese factories fused 5G and digital-twin software to lower overall-equipment-effectiveness losses by 15–20%. Edge nodes collocated with base stations processed sensor flows locally, cutting response times to milliseconds and supporting predictive maintenance. Deutsche Telekom’s commercial mmWave links for industrial clients highlighted a structural pivot from public macro networks to deterministic, factory-owned grids.
O-RAN Reference Designs Spurring Merchant-Silicon Demand from Tier-2 Telcos
Verizon fielded multi-vendor O-RAN radios powered by merchant silicon, slashing capex by as much as 30% and avoiding full-stack vendor lock-in. Operators in India and Southeast Asia mirrored the move; Vodafone Idea’s O-RAN blueprint accelerated deployment in price-sensitive geographies. Start-ups such as EdgeQ merged AI inference engines with open-interface base station logic, letting software dynamically re-balance compute between beam-forming and RAN analytics.
Restraints Impact Analysis
Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
---|---|---|---|
Geopolitical export controls limiting China-bound EDA/IP toolchains | −3.1% | China, global supply-chain spill-overs | Long term (≥ 4 years) |
Yield-drain at 3 nm EUV nodes elevating foundry costs for 5G baseband dies | −2.8% | Global, concentrated in Taiwan and South Korea | Medium term (2–4 years) |
Fragmented mid-band spectrum harmonization is hindering global SKU reuse | −1.9% | Worldwide, acute in emerging markets | Long term (≥ 4 years) |
Thermal design constraints in mmWave smartphones capping RF front-end attach rates | −1.4% | North America and other developed markets | Short term (≤ 2 years) |
Source: Mordor Intelligence
Geopolitical Export Controls Limiting China-bound EDA/IP Toolchains
Washington’s 2024 restrictions on leading EDA suites from firms such as Synopsys and Cadence blocked China-based chip designers from advanced verification flows, stretching tape-out cycles, and inflating costs. Domestic programs like QiMeng attempted to bridge the gap, but fragmentation forced multinationals to duplicate design pipelines for Chinese and non-Chinese variants. Huawei pivoted by crafting proprietary EDA stacks, signaling a structural re-routing of global design IP portfolios.
Yield-drain at 3 nm EUV Nodes Elevating Foundry Costs for 5G Baseband Dies
TSMC’s early 3 nm yields hovered near 55% in 2024, far lower than mature nodes, lifting per-die costs for complex modem-RF designs. Samsung’s competing 3 nm line faced similar setbacks. Limited wafer output delayed flagship processor launches and splits the 5G chipset market into a high-price premium tier on advanced nodes and a mainstream tier on 5/6 nm or 14 nm nodes.
Segment Analysis
By Chipset Type: Integration Becomes the Performance Baseline
SoC designs embedding modem, AI tensor engines, and RF front-end captured 74.5% of the 5G chipset market share in 2024, illustrating OEM demand for smaller footprints and lower power envelopes. That dominance lifted the 5G chipset market size for SoCs to USD 22.1 billion in 2025. Millimeter-wave chips, though only a sub-segment today, are scaling at 21.2% CAGR as thermal envelopes improve in both smartphones and enterprise gateways. Samsung’s 5G RedCap demonstration with Hyundai confirmed niche chip architectures tailored for prolonged operation on reduced batteries, signaling fresh revenue pools beyond flagship handsets.
The tilt toward deep integration reshaped supplier dynamics. Vendors possessing both modem IP and application-processor know-how exploited cross-domain co-optimization that discrete approaches could not match. At the same time, demand for radio-frequency integrated circuits (RFICs) in small-cell and massive-MIMO infrastructure remained resilient, and field-programmable gate arrays (FPGAs) served specialized defense and test-equipment niches. Edge-AI workload diversity compelled chipset designers to add configurable accelerators, keeping doors open for programmable logic within RAN and private-network applications.
Note: Segment shares of all individual segments available upon report purchase
By Operational Frequency: Sub-6 GHz Holds Coverage; mmWave Accelerates Capacity
Sub-6 GHz solutions accounted for 90.2% of the 2024 5G chipset market, equating to USD 30.1 billion of the 2025 5G chipset market size on steady network coverage requirements. Their favorable propagation and global spectrum availability aligned with operators’ economics for nationwide roll-outs. Yet chipsets engineered for > 39 GHz registered the fastest 23.5% CAGR because industrial indoor deployments and fixed-wireless access embraced multi-gigabit throughput. Researchers at the University of Bristol demonstrated gallium-nitride amplifiers breaking new efficiency records in the W-band, foreshadowing 6G-readiness and spurring R&D spend above 70 GHz.[2]Science Daily, “Breakthrough in Semiconductor Technology Set to Supercharge 6G Delivery,” sciencedaily.com
In urban grids, the 26–39 GHz band bridged capacity and coverage. Smartphone vendors nevertheless watched thermal ceilings carefully: high-frequency power amplifiers pushed skin-temperature limits, explaining why mmWave attach rates climbed first in enterprise CPE before migrating into consumer handsets. Spectrum fragmentation persisted as a design headache; chip builders had to support dissimilar channel bandwidths and duplexing modes across regions, inflating front-end bill-of-materials and validation cycles.
By End-User Industry: Automotive Surge Redraws Demand Mix
Consumer electronics kept 65.1% of revenue in 2024, but the 5G chipset market size for automotive and transportation is poised to jump from USD 1.9 billion in 2025 to USD 6.2 billion by 2030, riding a 26.3% CAGR. Automakers rely on high-bandwidth over-the-air updates and vehicle-to-everything (V2X) safety streams, embedding multiple 5G antennas per car. John Deere’s private 5G inside its U.S. plants exemplified how industrial automation is sucking chip volume from beyond the handset base.
Healthcare, while smaller today, is emerging: latency-critical telesurgery and real-time diagnostics pull specialized modems into portable imaging and wearables. Energy utilities adopted 5G for smart-grid telemetry and drone-based inspection, while the retail sector ran augmented-reality product guides and shelf analytics. Each vertical leans on a mix of sub-6 GHz chips for reach and mmWave or RedCap devices for capacity-plus-battery goals.

By Process Node: Dual-Track Silicon Strategy Appears
sets that required transistor-dense layouts. Yet, devices fabricated on > 28 nm nodes are expanding 27.1% CAGR because industrial IoT and non-premium smartphones prefer cost-optimized wafers less vulnerable to EUV yield risk. TSMC’s USD 42 billion capacity build aimed at 2 nm mass production underscores competition for leadership-class silicon. Samsung vowed to match with 2 nm mobile chips in 2025 and an enhanced 1.4 nm generation by 2027.
Automotive OEMs, bound by long design cycles, aligned to 10–28 nm to secure decade-plus supply guarantees, while handset flagships transitioned swiftly to 3 nm once yields stabilized. Supply-chain resilience strategies compelled device makers to dual-source across foundries and node generations, mitigating geopolitical exposures.
Geography Analysis
Asia-Pacific dominated the 5G chipset market in 2024 with a 45.3% revenue slice, reflecting China’s accelerated base-station roll-out, South Korea’s early commercial launches, and Japan’s private-network appetite. Taiwan’s foundry ecosystem and South Korea’s memory-plus-logic stack formed a synergistic production hub impossible to replicate quickly elsewhere.[3]Samsung Newsroom, “Samsung Solidifies Its Mobile AI Leadership at MWC 2025,” news.samsung.com Chinese policy backed domestic silicon champions with procurement preference, enabling break-even wafer volumes even when export restrictions trimmed addressable overseas demand.
North America followed, driven by private 5G in manufacturing and logistics, plus the integration of 5G telematics across vehicle portfolios. Enterprise Wi-Fi off-loading to 5G and edge-cloud synergies drew hyperscalers and chip suppliers into joint reference designs, securing predictable demand for both sub-6 GHz and C-band infrastructure logic. Regulatory clarity around spectrum auctions and neutral-host models supported capital flow into campus networks.
Europe’s Industry 4.0 programs anchored 5G deployment budgets inside German automotive and chemical industries. Spectrum licensing rules favored local control, letting corporations acquire dedicated 3.7 GHz blocks. This spurred chipset demand tuned for low-bandwidth, time-sensitive networking. EU supply-chain sovereignty goals translated into funding for R&D in alternative semiconductor materials, such as gallium nitride, to hedge Asia-centric production risk.
The Middle East and Africa have emerged as the fastest-growing zone at 19.1% CAGR, with Gulf states installing smart-city platforms and cross-border logistics corridors that lean on multi-band 5G devices. Operators leapfrogged legacy fixed infrastructure, adopting 5G for last-mile broadband and industrial sensor networks. African telcos started to deploy fixed-wireless CPE using affordable RedCap chips to connect suburban households, creating new mass-volume device categories.

Competitive Landscape
Qualcomm, MediaTek, Samsung, and Apple together controlled a significant share of 70% of 2024 revenue, underscoring a highly concentrated battlefield. Qualcomm preserved scale via modem-RF platforms that reached both premium Android phones and automotive telematics, while branching into extended-reality headsets with its X85 modem-RF system. MediaTek doubled down on Big-Core AI compute, pitching Dimensity 9400+ to handset OEMs seeking on-device generative-AI services.
Samsung blended foundry capability with captive device demand, leveraging 2 nm roadmaps to internalize risk amid EUV yield volatility. Apple’s vertical stack ensured unique performance-per-watt metrics and lock-in across its device lineup. EdgeQ, Marvell, and NXP carved out infrastructure and industrial slices by fusing protocol-stack software with programmable AI blocks, catering to private-network and O-RAN operators. Intellectual-property tussles expanded: Meta filed beam-forming patents for immersive augmented-reality, and Samsung showcased XR-optimized wireless during MWC 2025, widening the competitive perimeter.[4]Samsung Newsroom, “MWC 2025 Photo: Samsung Brings the Future of Mobile Technology,” news.samsung.com
Mergers and venture funding mirrored strategic shifts. Foundries pursued joint ventures with automakers to guarantee long-term wafer allocations. Chinese players, excluded from some EDA/IP, obtained state backing to build design stacks from scratch, aiming to cut foreign royalty outflows. Overall, barriers to entry—patent estates, radio-compliance certification costs, and capital-intensive EUV nodes—kept the market firmly in the hands of a handful of global titans.
Global 5G Chipset Industry Leaders
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Intel Corporation
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Qualcomm Technologies Inc.
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Broadcom Inc.
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Samsung Electronics Co. Ltd
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MediaTek Inc.
- *Disclaimer: Major Players sorted in no particular order

Recent Industry Developments
- June 2025: Ericsson activated a citywide private 5G network in Istres, France, with SPIE and Unitel, trimming deployment costs by 60% versus fiber and enabling encrypted AI video surveillance.
- May 2025: TSMC allocated USD 42 billion for nine new plants, targeting 80,000 2 nm wafers per month by year-end 2025.
- April 2025: MediaTek rolled out Dimensity 9400+ boasting 42 TOPS AI and 10 km Bluetooth reach, with first phones slated for Q2 2025.
- April 2025: Airtel launched a private 5G network for an Indian manufacturer to accelerate Industry 4.0 processes.
Global 5G Chipset Market Report Scope
5G chipsets enable 5G packet transmission on smartphones, portable hotspots, IoT devices, and, increasingly, notebook PCs with mobile network capabilities. 5G mobile devices will combine familiar sub-6GHz bands with new MIMO antenna systems and high-frequency millimeter-wave (mmWave) bands with highly focused beam-steering.
The global 5g chipset market is segmented by chipset type (application-specific integrated circuits (ASIC), radio frequency integrated circuit (RFIC), millimeter wave technology chips, field-programmable gate array (FPGA)), operational frequency (sub-6 GHZ, between 26 and 39 GHz, and above 39 GHz), end user (consumer electronics, industrial automation, automotive and transportation, energy and utilities, healthcare, and retail), and geography(North America, Europe, Asia-Pacific, Middle-East and Africa and Latin America). The report offers the market size in value terms in (USD) for all the segments mentioned above.
By Chipset Type | Application-Specific Integrated Circuits (ASIC) | |||
System-on-Chip with Integrated Modem (SoC) | ||||
Radio-Frequency Integrated Circuits (RFIC) | ||||
Millimeter-Wave Technology Chips | ||||
Field-Programmable Gate Arrays (FPGA) | ||||
By Operational Frequency | Sub-6 GHz | |||
26–39 GHz | ||||
Above 39 GHz | ||||
By End-User Industry | Consumer Electronics | |||
Industrial Automation | ||||
Automotive and Transportation | ||||
Energy and Utilities | ||||
Healthcare | ||||
Retail | ||||
Others | ||||
By Process Node | < 10 nm | |||
10-28 nm | ||||
> 28 nm | ||||
By Geography | North America | United States | ||
Canada | ||||
Mexico | ||||
Europe | Germany | |||
France | ||||
United Kingdom | ||||
Italy | ||||
Spain | ||||
Rest of Europe | ||||
Asia-Pacific | China | |||
Taiwan | ||||
South Korea | ||||
Japan | ||||
India | ||||
Rest of Asia-Pacific | ||||
South America | Brazil | |||
Mexico | ||||
Argentina | ||||
Rest of South America | ||||
Middle East and Africa | Middle East | Saudi Arabia | ||
United Arab Emirates | ||||
Turkey | ||||
Rest of Middle East | ||||
Africa | South Africa | |||
Rest of Africa |
Application-Specific Integrated Circuits (ASIC) |
System-on-Chip with Integrated Modem (SoC) |
Radio-Frequency Integrated Circuits (RFIC) |
Millimeter-Wave Technology Chips |
Field-Programmable Gate Arrays (FPGA) |
Sub-6 GHz |
26–39 GHz |
Above 39 GHz |
Consumer Electronics |
Industrial Automation |
Automotive and Transportation |
Energy and Utilities |
Healthcare |
Retail |
Others |
< 10 nm |
10-28 nm |
> 28 nm |
North America | United States | ||
Canada | |||
Mexico | |||
Europe | Germany | ||
France | |||
United Kingdom | |||
Italy | |||
Spain | |||
Rest of Europe | |||
Asia-Pacific | China | ||
Taiwan | |||
South Korea | |||
Japan | |||
India | |||
Rest of Asia-Pacific | |||
South America | Brazil | ||
Mexico | |||
Argentina | |||
Rest of South America | |||
Middle East and Africa | Middle East | Saudi Arabia | |
United Arab Emirates | |||
Turkey | |||
Rest of Middle East | |||
Africa | South Africa | ||
Rest of Africa |
Key Questions Answered in the Report
What is the current value of the 5G chipset market?
The market generated USD 33.40 billion in 2025 and is projected to reach USD 79.59 billion by 2030 at an 18.97% CAGR.
Which region leads 5G chipset revenue?
Asia-Pacific held 45.3% of global revenue in 2024 thanks to aggressive roll-outs in China, South Korea, and Japan.
Why are millimeter-wave chips growing faster than other types?
Thermal-design improvements and demand for high-capacity private 5G networks are pushing mmWave chip sales at a 21.2% CAGR.
How are export controls affecting the market?
U.S. restrictions on EDA tools are slowing Chinese design cycles and forcing multinationals to duplicate design flows, trimming projected CAGR by roughly 3.1%.
Which end-user industry will expand quickest?
Automotive and transportation is forecast to grow at 26.3% CAGR as 5G telematics and ADAS demands accelerate.
What process node is gaining the most volume?
Sub-10 nm chips own the largest share, yet chips made on cost-optimized > 28 nm nodes are growing 27.1% CAGR because of industrial IoT and supply-chain diversification needs.
Page last updated on: July 7, 2025