United Kingdom MLCC Market Size and Share
Market Overview
| Study Period | 2019 - 2030 |
|---|---|
| Base Year For Estimation | 2024 |
| Forecast Data Period | 2025 - 2030 |
| Market Size (2025) | USD 1.12 Billion |
| Market Size (2030) | USD 2.44 Billion |
| Growth Rate (2025 - 2030) | 16.77% CAGR |
| Market Concentration | High |
Major Players
*Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0. |
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United Kingdom MLCC Market Analysis by Mordor Intelligence
The United Kingdom MLCC market size is valued at USD 1.12 billion in 2025 and is projected to reach USD 2.44 billion by 2030, advancing at a 16.77% CAGR. Demand acceleration stems from three synchronized forces: the 2030 ban on internal-combustion engines, which is prompting automakers to electrify their lineups, nationwide 5G densification programs that increase the number of small-cell radio nodes, and defense-electronics localization under the AUKUS framework. Rising electric-vehicle production is increasing per-car capacitor counts to 18,000–20,000, while Open RAN and cloud-native 5G architectures add discrete passives across distributed radio units. Government incentives worth more than USD 1 billion underscore a strategic intent to reshore electronics manufacturing capabilities, though domestic MLCC fabrication remains negligible. At the same time, long lead times and raw material volatility expose a structural supply gap, magnifying the urgency for deeper supplier diversification and local value-added services.
Key Report Takeaways
- By dielectric type, Class 1 devices captured 62.7% of the MLCC market share in 2024; Class 1 is also forecast to expand at a 17.89% CAGR through 2030.
- By case size, 201 packages led with 56.48% revenue share in 2024; 402 packages are advancing at a 17.65% CAGR to 2030.
- By voltage rating, components with a rating of ≤100 V accounted for 59.34% of the MLCC market size in 2024 and are expected to remain the fastest-growing segment at a 17.56% CAGR through 2030.
- By mounting method, surface-mount technology held 41.7% of the MLCC market share in 2024, while metal-cap products are projected to record the highest CAGR at 17.34% from 2024 to 2030.
- By end-user, consumer electronics accounted for 51.46% of the MLCC market size in 2024, whereas the automotive sector is predicted to grow at the fastest rate, with an 18.22% CAGR, through 2030.
United Kingdom MLCC Market Trends and Insights
Drivers Impact Analysis
| Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Surge in EV manufacturing ahead of 2030 ICE ban | +4.2% | Midlands automotive corridor | Medium term (2-4 years) |
| Accelerated 5 G small-cell deployment | +3.8% | Urban centers nationwide | Short term (≤ 2 years) |
| Government tax incentives for on-shore passive-component lines | +2.1% | South Wales cluster | Long term (≥ 4 years) |
| Rising demand for compact medical wearables | +1.9% | Cambridge-London corridor | Medium term (2-4 years) |
| Higher-capacitance battery-management designs | +2.3% | Gigafactory locations | Medium term (2-4 years) |
| Defense-electronics localization under AUKUS | +1.4% | UK defense network | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
Surge in EV Manufacturing Ahead of 2030 ICE-Ban
The Zero Emission Vehicle mandate requires 22% battery-electric sales in 2024 and 100% by 2035, sharply expanding automotive-grade MLCC demand. Each electric car now integrates 18,000–20,000 capacitors, compared to 2,000 in a combustion model, with battery-management systems alone consuming thousands of high-voltage MLCCs rated above 500 V. [1]Samsung Electro-Mechanics, “World’s First MLCC for LiDAR Applications,” samsungsem.com The planned gigafactory capacity of 135 GWh by 2030 will tighten local supply chains; however, the MLCC market remains almost entirely import-dependent. Automotive specifications mandate operating windows of –55 °C to +150 °C and failure rates below 1 PPM, forcing suppliers to prioritize premium Class 1 dielectrics and robust case sizes. Accelerated driver-assistance adoption-Level 2+ penetration topped 40% in 2024-further lifts per-vehicle counts, especially in 1005 packages for radar and LiDAR modules. The compressed timetable intensifies competition for nickel electrode powders, an essential precursor for high-capacitance stacks.
Accelerated 5 G Infrastructure Roll-Out Boosting Small-Cell Demand
Scenario modeling indicates the UK needs more than 4,000 additional infill sites to guarantee 50 Mbps per-user service by 2030, with each small cell hosting dense RF front-ends that rely on temperature-stable MLCCs. [2]Department for Digital, Culture, Media and Sport, “Ensuring Future Wireless Connectivity Needs Are Met,” assets.publishing.service.gov.uk A single urban node typically embeds 1.8-2.2 times the MLCC count of a 4G macro site, and Open RAN disaggregation adds separate radio, compute, and power boards. Mid-band 3.5 GHz deployments require Class 1 capacitors with a ±30 ppm/°C drift, while mmWave at 26 GHz pushes self-resonant frequency constraints. Enterprise private-5 G and network slicing multiply bespoke radio units, lifting long-tail demand for specialized dielectric formulations.
Government Tax Incentives for On-Shore Passive-Component Production
The USD 1 billion National Semiconductor Strategy extends relief to passive parts through the Automotive Transformation Fund, intersecting with the South Wales compound semiconductor hub. However, equipment footprints, 1,000–1,300 °C sintering furnaces, and raw-powder supply chains differ significantly from wafer processes, limiting immediate relocation of MLCCs. Tax credits also face 16-year average raw-material lead times and post-Brexit customs procedures. RoHS-compliant alternatives to lead glaze raise process-qualification costs, while UKCA labeling rules add documentation overhead.
Rising Demand for Compact Medical Wearables and Implantable
Miniaturized devices-from continuous glucose monitors to neurostimulators-now specify 0201M (0.25 × 0.125 mm) capacitors delivering 0.1 µF, a five-fold volume reduction compared to 0402M generations. Implantables require ISO 14708 compliance, hermetic sealing, and failure rates below 0.1 PPM, which restricts supply to a handful of vendors with in-house biocompatible packaging. NHS remote-patient initiatives raise shipment volumes, and battery-life optimization drives adoption of ultra-low ESR MLCCs.
Restraints Impact Analysis
| Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Persistent supply–demand imbalance inflating lead-times | -2.8% | Global, felt in UK procurement | Short term (≤ 2 years) |
| Nickel and copper price volatility | -1.7% | Global commodity markets | Short term (≤ 2 years) |
| Regulatory hurdles for new fabs | -1.2% | UK planning regimes | Long term (≥ 4 years) |
| Substitution by embedded capacitors in HDI PCBs | -0.9% | Global adoption hubs | Medium term (2-4 years) |
| Source: Mordor Intelligence | |||
Persistent MLCC Supply-Demand Imbalance Inflating Lead-Times
Global manufacturers remain reluctant to add commodity capacity, focusing instead on lucrative smartphone grades. Automotive and large-case MLCCs now face 20–24 week deliveries compared with 8–12 weeks for consumer parts. [3]TTI, Inc., “Worldwide MLCC Shortage,” tti.com As an importer, the UK sits low on allocation priority when shortages recur.
Nickel and Copper Price Volatility Squeezing Margins
Base-metal electrode MLCCs consume nickel at scale, so price swings erode already tight margins. The UK must raise nickel-sulfate imports 12-fold by 2030 to meet domestic battery plans, leaving MLCC buyers exposed to the same raw-material risks.
Segment Analysis
By Dielectric Type: Class 1 Stability Drives Precision Demand
Class 1 devices captured 62.7% of the MLCC market in 2024, powered by ±30 ppm/°C drift and low-loss traits that suit automotive powertrains and defense radios. The segment is projected to post a 17.89% CAGR, outperforming Class 2 as electric-vehicle designs favor temperature-stable BMS capacitors. Samsung’s 2.2 µF, 10 V Class 1 breakthrough in 1005 packages underscores technology momentum. Class 2 remains vital for high-capacitance decoupling in consumer electronics but faces slower growth as handset unit sales plateau.
Class 1 innovation focuses on thinner dielectric layers and nickel electrode compatibility to maintain cost-effectiveness while ensuring capacitance linearity. Class 2 vendors are experimenting with doped-barium-titanate mixes to raise volumetric efficiency, yet processing windows narrow at ≤0402 sizes. Both classes must meet the RoHS and UKCA labeling rules, which adds compliance assurance costs.
By Case Size: 402 Packages Emerge as Growth Engine
201 footprints retained a 56.48% revenue share in 2024, thanks to the demand for smartphone density, but 402 packages are set to log a 17.65% CAGR, as EV inverters and industrial drives require higher voltage ratings. Ultra-miniatures such as 0201M push the frontiers of pick-and-place accuracy, with mounting yields falling below 90% unless optical-alignment systems are optimized. Conversely, footprints of 603 and larger are resilient in high-temperature under-hood modules, where PCB real estate is less constrained.
Yields decline sharply when electrode layer counts exceed 1,000, resulting in increased scrap costs for ultra-small parts. That dynamic tilts incremental capacity toward 402 and 603 sizes, aligning with automotive growth vectors rather than the saturated demand for smartphones.
By Voltage Rating: ≤100 V Parts Maintain Volume Leadership
Low-voltage MLCCs (≤100 V) contributed 59.34% of the revenue in 2024 and are expected to expand at the fastest rate of 17.56% CAGR, reflecting the scale of 3–12 V logic rails across consumer and telecom boards. Mid-voltage (100–500 V) inventories are rising as 400 V EV battery packs and 48 V mild-hybrid systems proliferate, whereas parts exceeding 500 V remain niche for medical, grid, and aerospace applications.
Samsung’s ability to fit 10 V ratings into 1005 packages illustrates the miniaturization-versus-voltage balancing act. Future 800 V drivetrains will raise design-margin requirements, steering demand to thicker-dielectric 1210 formats unless new ceramic chemistries emerge.
By Mounting Type: SMT Dominance Reinforced
Surface-mount MLCCs accounted for 41.7% of 2024 sales and remain the integration baseline, as automated placement delivers labor savings and board-space efficiency. Metal-cap units gain traction at a 17.34% CAGR where shock and moisture standards are stringent, notably in under-hood automotive modules. Radial-lead formats linger in power-supply and railway controls that require through-hole stability and higher creepage distances.
The transition to lead-free solders increased peak reflow temperatures, prompting suppliers to validate termination metallurgy that can withstand 260 °C profiles without micro-cracking.
Note: Segment shares of all individual segments available upon report purchase
By End-User: Automotive Surges Past Consumer Growth
Consumer electronics still generate 51.46% of 2024 demand, but a mature handset base limits incremental unit growth. In contrast, automotive applications are forecast to record an 18.22% CAGR as electric powertrains, ADAS, and infotainment subsystems embed tens of thousands of MLCCs per vehicle. Telecommunications equipment follows, buoyed by small-cell densification and the rollout of Open RAN. Medical wearables and implantables, while a smaller slice, command premium ASPs and rigorous quality regimes.
Aerospace and defense procurements prioritize parts with long lifetimes and radiation tolerance, aligning with Class 1 dielectric strengths but hindered by limited domestic fabrication capacity.
Geography Analysis
The MLCC market in the United Kingdom is primarily driven by imported supply, principally from Japan, South Korea, and Taiwan, and local design integration. Midlands auto plants, Greater London design houses, and Scotland’s defense electronics cluster comprise the core consumption triad. Post-Brexit customs protocols prolong import clearance by two to three weeks versus EU routes, eroding responsiveness for build-to-order assemblies. Northern Ireland enjoys dual-market access under the Windsor Framework, enabling channel partners to leverage EU inventory hubs for faster fulfillment.
Government schemes worth USD 1 billion under the National Semiconductor Strategy channel funds into South Wales’ compound-semiconductor hub, adding adjacent opportunities for MLCC finishing or testing, but not yet bulk fabrication. Collaborative research through the EU Chips Joint Undertaking injects a modest USD 43 million into UK coffers over the next five years, with a priority focus on silicon photonics. Exchange-rate volatility versus the euro and dollar complicates pricing for distributors, especially during nickel spikes that inflate landed costs.
Regionally, the wider European bloc represents the second-largest MLCC market, after the Asia-Pacific region, and the UK accounts for an estimated 8–12% of that volume, paralleling its share of automotive output. Germany’s carmakers and the Netherlands’ EMS centers shape sourcing patterns, while Eastern Europe provides cost-efficient PCBA lines. Harmonized RoHS and WEEE directives enable UK-qualified parts to transition smoothly into EU assembly, facilitating shared inventory strategies for pan-regional OEMs.
Competitive Landscape
Innovation and Customization Drive Future Success
Four Asia-headquartered leaders-Murata, Samsung Electro-Mechanics, TDK, and Kyocera-collectively command approximately 70% of the global MLCC capacity, resulting in a high concentration of offshore suppliers in the UK market. Their competitive edge stems from proprietary ceramic powders, multi-billion-dollar sintering furnaces, and decades of experience with the AEC-Q200 process. New entrants confront steep capital outlays and a multiyear qualification path, particularly in automotive programs where validation can stretch to five years.
Technology rivalry now centers on extreme miniaturization; Murata’s 0201M portfolios and Samsung’s AEC-Q200-qualified 1005 high-voltage parts fetch premium margins. Embedded-capacitor PCBs nibble at MLCC sockets in wearables and HPC boards, but reworkability and supply-chain familiarity keep discrete MLCCs favored in mission-critical designs. Distributors in the UK, such as TTI and Rutronik, have shifted toward inventory buffering and vendor-managed stockrooms to mitigate volatility, offering engineering support that localizes expertise from far-flung factories.
Vishay’s USD 323 million buyout of Newport Wafer Fab marks the largest domestic hardware investment in years, yet the site focuses on silicon carbide rather than ceramic passives. Still, co-location creates spill-over opportunities for substrate suppliers and testing labs that could support future MLCC pilot lines. Regulatory hurdles remain formidable; planning approvals must satisfy environmental-impact reviews and community-consultation mandates that prolong build schedules.
United Kingdom MLCC Industry Leaders
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Kyocera AVX Components Corporation
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MARUWA Co., Ltd.
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Murata Manufacturing Co., Ltd.
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Nippon Chemi-Con Corporation
-
Samsung Electro-Mechanics Co., Ltd.
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- March 2025: Vishay finished a GBP 250 million upgrade of the Newport, Wales fab to mass-produce silicon-carbide power devices, adding 500 high-skill jobs
- February 2025: Samsung Electro-Mechanics launched the world’s first 2.2 µF, 10 V MLCC in a 1005 case specifically for LiDAR sensors, achieving AEC-Q200 qualification
- September 2024: UKRI granted GBP 11.5 million to sixteen semiconductor scale-up projects, some targeting passive-component innovations
- July 2025: The Office for Product Safety and Standards updated RoHS guidance to clarify UKCA labeling for passive components entering Great Britain markets
United Kingdom MLCC Market Report Scope
Class 1, Class 2 are covered as segments by Dielectric Type. 0 201, 0 402, 0 603, 1 005, 1 210, Others are covered as segments by Case Size. 500V to 1000V, Less than 500V, More than 1000V are covered as segments by Voltage. 100µF to 1000µF, Less than 100µF, More than 1000µF are covered as segments by Capacitance. Metal Cap, Radial Lead, Surface Mount are covered as segments by Mlcc Mounting Type. Aerospace and Defence, Automotive, Consumer Electronics, Industrial, Medical Devices, Power and Utilities, Telecommunication, Others are covered as segments by End User.| Class 1 |
| Class 2 |
| 201 |
| 402 |
| 603 |
| 1005 |
| 1210 |
| Other Case Sizes |
| Low Voltage (less than or equal to 100 V) |
| Mid Voltage (100 ? 500 V) |
| High Voltage (above 500 V) |
| Metal Cap |
| Radial Lead |
| Surface Mount |
| Aerospace and Defence |
| Automotive |
| Consumer Electronics |
| Industrial |
| Medical Devices |
| Power and Utilities |
| Telecommunication |
| Other End-User Applications |
| By Dielectric Type | Class 1 |
| Class 2 | |
| By Case Size | 201 |
| 402 | |
| 603 | |
| 1005 | |
| 1210 | |
| Other Case Sizes | |
| By Voltage | Low Voltage (less than or equal to 100 V) |
| Mid Voltage (100 ? 500 V) | |
| High Voltage (above 500 V) | |
| By MLCC Mounting Type | Metal Cap |
| Radial Lead | |
| Surface Mount | |
| By End-User Application | Aerospace and Defence |
| Automotive | |
| Consumer Electronics | |
| Industrial | |
| Medical Devices | |
| Power and Utilities | |
| Telecommunication | |
| Other End-User Applications |
Market Definition
- MLCC (Multilayer Ceramic Capacitor) - A type of capacitor that consists of multiple layers of ceramic material, alternating with conductive layers, used for energy storage and filtering in electronic circuits.
- Voltage - The maximum voltage that a capacitor can safely withstand without experiencing breakdown or failure. It is typically expressed in volts (V)
- Capacitance - The measure of a capacitor's ability to store electrical charge, expressed in farads (F). It determines the amount of energy that can be stored in the capacitor
- Case Size - The physical dimensions of an MLCC, typically expressed in codes or millimeters, indicating its length, width, and height
| Keyword | Definition |
|---|---|
| MLCC (Multilayer Ceramic Capacitor) | A type of capacitor that consists of multiple layers of ceramic material, alternating with conductive layers, used for energy storage and filtering in electronic circuits. |
| Capacitance | The measure of a capacitor's ability to store electrical charge, expressed in farads (F). It determines the amount of energy that can be stored in the capacitor |
| Voltage Rating | The maximum voltage that a capacitor can safely withstand without experiencing breakdown or failure. It is typically expressed in volts (V) |
| ESR (Equivalent Series Resistance) | The total resistance of a capacitor, including its internal resistance and parasitic resistances. It affects the capacitor's ability to filter high-frequency noise and maintain stability in a circuit. |
| Dielectric Material | The insulating material used between the conductive layers of a capacitor. In MLCCs, commonly used dielectric materials include ceramic materials like barium titanate and ferroelectric materials |
| SMT (Surface Mount Technology) | A method of electronic component assembly that involves mounting components directly onto the surface of a printed circuit board (PCB) instead of through-hole mounting. |
| Solderability | The ability of a component, such as an MLCC, to form a reliable and durable solder joint when subjected to soldering processes. Good solderability is crucial for proper assembly and functionality of MLCCs on PCBs. |
| RoHS (Restriction of Hazardous Substances) | A directive that restricts the use of certain hazardous materials, such as lead, mercury, and cadmium, in electrical and electronic equipment. Compliance with RoHS is essential for automotive MLCCs due to environmental regulations |
| Case Size | The physical dimensions of an MLCC, typically expressed in codes or millimeters, indicating its length, width, and height |
| Flex Cracking | A phenomenon where MLCCs can develop cracks or fractures due to mechanical stress caused by bending or flexing of the PCB. Flex cracking can lead to electrical failures and should be avoided during PCB assembly and handling. |
| Aging | MLCCs can experience changes in their electrical properties over time due to factors like temperature, humidity, and applied voltage. Aging refers to the gradual alteration of MLCC characteristics, which can impact the performance of electronic circuits. |
| ASPs (Average Selling Prices) | The average price at which MLCCs are sold in the market, expressed in USD million. It reflects the average price per unit |
| Voltage | The electrical potential difference across an MLCC, often categorized into low-range voltage, mid-range voltage, and high-range voltage, indicating different voltage levels |
| MLCC RoHS Compliance | Compliance with the Restriction of Hazardous Substances (RoHS) directive, which restricts the use of certain hazardous substances, such as lead, mercury, cadmium, and others, in the manufacturing of MLCCs, promoting environmental protection and safety |
| Mounting Type | The method used to attach MLCCs to a circuit board, such as surface mount, metal cap, and radial lead, which indicates the different mounting configurations |
| Dielectric Type | The type of dielectric material used in MLCCs, often categorized into Class 1 and Class 2, representing different dielectric characteristics and performance |
| Low-Range Voltage | MLCCs designed for applications that require lower voltage levels, typically in the low voltage range |
| Mid-Range Voltage | MLCCs designed for applications that require moderate voltage levels, typically in the middle range of voltage requirements |
| High-Range Voltage | MLCCs designed for applications that require higher voltage levels, typically in the high voltage range |
| Low-Range Capacitance | MLCCs with lower capacitance values, suitable for applications that require smaller energy storage |
| Mid-Range Capacitance | MLCCs with moderate capacitance values, suitable for applications that require intermediate energy storage |
| High-Range Capacitance | MLCCs with higher capacitance values, suitable for applications that require larger energy storage |
| Surface Mount | MLCCs designed for direct surface mounting onto a printed circuit board (PCB), allowing for efficient space utilization and automated assembly |
| Class 1 Dielectric | MLCCs with Class 1 dielectric material, characterized by a high level of stability, low dissipation factor, and low capacitance change over temperature. They are suitable for applications requiring precise capacitance values and stability |
| Class 2 Dielectric | MLCCs with Class 2 dielectric material, characterized by a high capacitance value, high volumetric efficiency, and moderate stability. They are suitable for applications that require higher capacitance values and are less sensitive to capacitance changes over temperature |
| RF (Radio Frequency) | It refers to the range of electromagnetic frequencies used in wireless communication and other applications, typically from 3 kHz to 300 GHz, enabling the transmission and reception of radio signals for various wireless devices and systems. |
| Metal Cap | A protective metal cover used in certain MLCCs (Multilayer Ceramic Capacitors) to enhance durability and shield against external factors like moisture and mechanical stress |
| Radial Lead | A terminal configuration in specific MLCCs where electrical leads extend radially from the ceramic body, facilitating easy insertion and soldering in through-hole mounting applications. |
| Temperature Stability | The ability of MLCCs to maintain their capacitance values and performance characteristics across a range of temperatures, ensuring reliable operation in varying environmental conditions. |
| Low ESR (Equivalent Series Resistance) | MLCCs with low ESR values have minimal resistance to the flow of AC signals, allowing for efficient energy transfer and reduced power losses in high-frequency applications. |
Research Methodology
Mordor Intelligence has followed the following methodology in all our MLCC reports.
- Step 1: Identify Data Points: In this step, we identified key data points crucial for comprehending the MLCC market. This included historical and current production figures, as well as critical device metrics such as attachment rate, sales, production volume, and average selling price. Additionally, we estimated future production volumes and attachment rates for MLCCs in each device category. Lead times were also determined, aiding in forecasting market dynamics by understanding the time required for production and delivery, thereby enhancing the accuracy of our projections.
- Step 2: Identify Key Variables: In this step, we focused on identifying crucial variables essential for constructing a robust forecasting model for the MLCC market. These variables include lead times, trends in raw material prices used in MLCC manufacturing, automotive sales data, consumer electronics sales figures, and electric vehicle (EV) sales statistics. Through an iterative process, we determined the necessary variables for accurate market forecasting and proceeded to develop the forecasting model based on these identified variables.
- Step 3: Build a Market Model: In this step, we utilized production data and key industry trend variables, such as average pricing, attachment rate, and forecasted production data, to construct a comprehensive market estimation model. By integrating these critical variables, we developed a robust framework for accurately forecasting market trends and dynamics, thereby facilitating informed decision-making within the MLCC market landscape.
- Step 4: Validate and Finalize: In this crucial step, all market numbers and variables derived through an internal mathematical model were validated through an extensive network of primary research experts from all the markets studied. The respondents are selected across levels and functions to generate a holistic picture of the market studied.
- Step 5: Research Outputs: Syndicated Reports, Custom Consulting Assignments, Databases, and Subscription Platform
