Thermoset Molding Compound Market Size and Share
Thermoset Molding Compound Market Analysis by Mordor Intelligence
The Thermoset Molding Compound Market size is estimated at USD 11.88 Billion in 2025, and is expected to reach USD 16.11 Billion by 2030, at a CAGR of 6.28% during the forecast period (2025-2030). Robust demand from electrical and electronics packaging, the accelerating shift to electric vehicles, and the continued build-out of renewable-energy assets anchor near-term growth for the thermoset molding compound market. Supply chains are slowly re-balancing after trade measures on epoxy resin imports prompted regional capacity additions, while process automation is lowering production costs and broadening end-use adoption. Sustainability pressures are prompting rapid innovation in bio-based feedstocks and recyclable chemistries, positioning forward-leaning producers to capture premium pricing. Capital-intensive manufacturing requirements and strict performance specifications create a moderate barrier to entry that helps support profitability across the thermoset molding compound market.
Key Report Takeaways
- By resin type, phenolic resins commanded 28.89% share of the Thermoset Molding Compound market size in 2024, while epoxy compounds are advancing at a 6.77% CAGR through 2030.
- By fiber reinforcement, glass fiber accounted for 64.45% of the Thermoset Molding Compound market size in 2024; carbon fiber reinforcement is expanding at a 6.90% CAGR over the forecast period.
- By application, electrical and electronics held 37.78% of the Thermoset Molding Compound market share in 2024; automotive is forecast to post the fastest 7.12% CAGR through 2030.
- By geography, Asia-Pacific controlled 46.79% revenue in 2024 and is growing at a 7.05% CAGR, the fastest among all regions.
Global Thermoset Molding Compound Market Trends and Insights
Drivers Impact Analysis
| Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Growing Use in Electrical and Electronics | +1.8% | Global, APAC leading adoption | Medium term (2-4 years) |
| Light-weighting Push in Automotive and Aerospace | +1.5% | North America & Europe primary, APAC emerging | Long term (≥ 4 years) |
| Renewable-energy Composite Demand Surge | +1.2% | Global, EU and China leading installations | Medium term (2-4 years) |
| Infrastructure Prefabs Adopting High-durability Compounds | +0.9% | APAC core, spill-over to MEA & Latin America | Long term (≥ 4 years) |
| Regional Capacity Build-up After Epoxy Anti-dumping Duties | +0.6% | North America & Europe defensive additions | Short term (≤ 2 years) |
| Source: Mordor Intelligence | |||
Growing Use in Electrical and Electronics
Semiconductor packaging is moving toward advanced molding compounds that withstand temperatures beyond 200°C while retaining dielectric strength, driving maleimide-based blends into mainstream use[1]T. Kawahara et al., “Thermal and Mechanical Reliability of High-Temperature Molding Compounds,” Journal of Electronics Packaging, jiep.or.jp. Wide-bandgap power modules deployed in 5G base stations and electric vehicles rely on these compounds to mitigate thermal cycling fatigue. Device miniaturization intensifies the need for dimensional stability at ever-smaller lead pitches, reinforcing demand for the thermoset molding compound market. Electronics manufacturers are also embracing formaldehyde-free systems to comply with stricter workplace exposure limits, opening a niche for bio-based hardener chemistries. Collectively, these trends boost consumption volumes and enhance pricing power for high-performance grades within the thermoset molding compound market.
Light-weighting Push in Automotive and Aerospace
Electric vehicle battery enclosures fabricated from carbon-fiber sheet molding compounds achieve more than 30% weight savings over aluminum housings while meeting crashworthiness criteria. Faster compression-molding cycles shrink takt times, making thermoset solutions cost-competitive with metal stampings. Aerospace tier suppliers are shifting complex interior and secondary-structure parts to compression-molded thermosets that meet flame retardancy standards without adding halogens. Recycled carbon fiber integration is gaining traction, satisfying original-equipment manufacturer sustainability mandates and reinforcing a circular economy narrative, thereby widening the appeal of the thermoset molding compound market.
Renewable-energy Composite Demand Surge
Next-generation polyurethane infusion resins trim 10-15% manufacturing cost from large wind-turbine blades through faster wet-out and demold cycles while boosting fatigue resistance. Offshore installations require compounds that resist hydrolysis and stress cracking during 25-year duty cycles, cementing demand for high-end thermoset systems. Photovoltaic mounting brackets increasingly specify corrosion-proof thermoset composites to reduce maintenance in desert and coastal climates. Bio-derived epoxies formulated from rosin feedstocks are showing equivalent modulus and strength to petroleum-based alternatives, aligning with renewable-energy operators’ low-carbon procurement guidelines. Together, these factors underpin a durable growth channel for the thermoset molding compound market.
Infrastructure Prefabs Adopting High-durability Compounds
Bridge decks, chemical-storage tanks, and wastewater piping fabricated from vinyl-ester and epoxy-vinyl ester resins outlast steel or concrete alternatives in chloride-rich or acidic service. Prefabricated modules using pultruded thermoset profiles accelerate construction schedules while lowering life-cycle maintenance costs, especially across fast-growing Asia-Pacific economies. Phase-change materials embedded in thermoset matrices create energy-saving facade panels that smooth indoor temperature swings. These multifunctional benefits continue to widen acceptance across civil-engineering specifications, reinforcing revenue visibility within the thermoset molding compound market.
Restraints Impact Analysis
| Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Recyclability and End-of-life Environmental Issues | -1.1% | Global, with EU regulations driving impact | Medium term (2-4 years) |
| Formaldehyde-based Compound Health and Safety Risks | -0.8% | Global, with stricter enforcement in developed markets | Short term (≤ 2 years) |
| Protectionist Trade Barriers Disrupting Supply Chains | -0.7% | North America & EU primarily, affecting Asian suppliers | Short term (≤ 2 years) |
| Source: Mordor Intelligence | |||
Recyclability and End-of-life Environmental Issues
The permanent cross-linked network that grants thermosets their performance also complicates recycling, with mechanical grinding yielding short fibers of limited structural value. Chemical solvolysis technologies remain capital intensive and energy demanding, hindering commercial rollout. Proposed European rules will make producers financially responsible for composite waste, likely increasing compliance costs and eroding margins. Vitrimer chemistries and dynamic covalent networks promise reprocessability yet still face scalability hurdles. End-of-life turbine-blade disposal exemplifies the magnitude of the challenge confronting the thermoset molding compound market.
Formaldehyde-based Compound Health and Safety Risks
Occupational exposure limits for formaldehyde continue to tighten, obliging manufacturers to upgrade ventilation systems and personal protective equipment, which elevates operating costs[2]OSHA, “Formaldehyde: Health Hazards and Precautions,” osha.gov. Consumer-facing applications such as furniture and interior panels face outright substitution mandates in parts of Europe. Research institutes have demonstrated formaldehyde-free amino resins, but early adopters report cost premiums and process-window constraints. The need for customer requalification lengthens adoption timelines, tempering near-term growth across segments reliant on phenolic and urea formaldehyde systems within the thermoset molding compound market.
Segment Analysis
By Resin Type: Phenolic Dominance Faces Epoxy Challenge
Phenolic resins accounted for 28.89% of the thermoset molding compound market share in 2024, thanks to proven flame resistance and cost efficiency in high-volume electrical parts. Epoxy grades, however, are growing at a 6.77% CAGR as recyclability breakthroughs, including Sichuan University’s 192°C glass-transition epoxy capable of carbon-fiber recovery, address sustainability barriers. Phenolic demand remains resilient in circuit breakers and switchgear,r where elevated short-circuit temperatures necessitate superior char formation. Epoxy systems, meanwhile, benefit from aerospace and wind-blade certifications that unlock larger contracts and higher average selling prices. Melamine and urea formaldehyde volumes remain stable in decorative lamination, though formaldehyde regulations pressure producers to reformulate.
Epoxy suppliers target bio-based content and dynamic covalent bonds to unlock end-of-life recoverability, positioning themselves for regulatory tailwinds in Europe and North America. Nanocellulose reinforcement in urea formaldehyde systems shows potential to cut emissions while improving screw-holding metrics in engineered wood panels. Polyester gains favor in automotive headlamp housings where rapid curing trumps ultimate temperature performance. In aggregate, widening material portfolios give end users multiple pathways to balance cost, performance, and sustainability within the thermoset molding compound market.
Note: Segment shares of all individual segments available upon report purchase
By Fiber Reinforcement: Glass Fiber Supremacy Under Carbon Pressure
Glass fiber composites captured 64.45% of the Thermoset Molding Compound market size in 2024, supported by attractive economics and well-established supply networks. Ongoing surface-treatment improvements boost interfacial bonding, pushing tensile strength toward the carbon fiber baseline. Carbon fiber compounds, though still smaller in volume, are adding 6.90% CAGR on the back of tightening vehicle emission standards and broader aerospace adoption. Hybrid formulations that blend recycled carbon fiber with virgin glass fiber lower costs while increasing modulus, widening addressable applications. Recycled fiber supply chains are maturing, aided by pyrolysis processes that retain 80-90% of virgin tensile properties, a milestone directly benefits the thermoset molding compound market.
Natural fiber reinforcements such as flax and kenaf are making headway in interior trim where odor and moisture resistance can be managed, though mechanical limits curtail structural roles. Specialty fibers like basalt and aramid fill high-temperature or ballistic niches that command premium prices. Hollow-glass fiber innovations are reducing density by up to 15% while maintaining stiffness, an attractive trade-off for lightweight electrical housings. Across reinforcements, the ability to fine-tune cost-to-performance ratios is bolstering the competitive depth of the thermoset molding compound market.
By Application: Electronics Leadership Yields to Automotive Growth
Electrical and electronics retained 37.78% revenue in 2024 through their entrenched need for dimensionally stable, flame-retardant compounds in semiconductor and power-module encapsulation. Automotive applications are growing faster at 7.12% CAGR as battery-pack, motor-housing, and structural components pivot to carbon-fiber sheet molding compounds that deliver crash safety and electromagnetic shielding. In power electronics, maleimide resin blends surpass 200°C operational thresholds, supporting the thermal management of silicon-carbide devices. Aerospace cabin interiors are shifting to low-density compression-molded panels that shave kilograms from each aircraft, directly improving fuel efficiency.
Consumer goods makers increasingly specify bio-based thermoset grades for premium kitchenware and appliance housings, reflecting rising brand emphasis on sustainability. Marine and industrial sectors use specialty epoxy-vinyl ester blends to tackle saltwater and chemical exposures. Each niche adds incremental volume and higher margins, enhancing total addressable opportunity for the thermoset molding compound market.
Note: Segment shares of all individual segments available upon report purchase
Geography Analysis
Asia-Pacific generated 46.79% of global revenue in 2024 and is advancing at a 7.05% CAGR to 2030. The region’s integrated value chain, abundant feedstock, and surging electronics and automotive output give it a cost and scale advantage that is difficult to replicate. China expanded bisphenol A capacity to 5.48 Million t/y in 2024, reinforcing backward integration for epoxy producers and creating a pricing corridor that favors domestic converters. India and Southeast Asia are adding molding-compound plants close to appliance and two-wheeler Original Equipment Manufacturer (OEM) clusters, shortening lead times and lowering import duties. Government-backed renewable-energy targets in China, India, and South Korea amplify demand for composite wind-blade, solar-frame, and grid-infrastructure applications.
North America benefits from stable polyurethane and epoxy raw-material supply tied to shale-gas economics, yet ongoing trade duties on select Asian resins are catalyzing fresh investment in local production. New epoxy reactors in Texas and Ohio are set to come on-stream by 2026, supporting regional autonomy and just-in-time inventories for aerospace and defense contractors. Canada is leveraging hydroelectric power to court carbon-fiber producers seeking low-carbon electricity, a potential draw for future sheet-molding-compound capacity.
Europe, with mature automotive and wind-energy sectors, faces margin pressure from elevated energy costs but counters with process automation and high-value aerospace contracts. BASF’s USD 260 Million hexamethylenediamine project in France supports domestic polyamide 6.6 demand, indirectly lifting glass-fiber compound usage in under-the-hood parts. Strict waste regulations are pushing recyclability innovations that could reshape material selection across the thermoset molding compound market.
South America and the Middle East-Africa remain nascent yet promising. Brazil’s offshore wind roadmap and Saudi Arabia’s Vision 2030 construction pipeline are spawning early composites adoption. However, limited local feedstock and molding-equipment availability sustain import reliance, tempering near-term momentum. Over the forecast period, gradual development of regional fabrication hubs is expected to smooth logistics and stimulate broader penetration of the thermoset molding compound market.
Competitive Landscape
The Thermoset Molding Compound market is moderately concentrated. Incumbents rely on proprietary formulations, integrated supply chains, and dedicated customer technical centers to defend share. Hexion broadened its melamine resin range to capture decorative laminate and industrial-coatings growth, leveraging backward-integrated formaldehyde assets. AOC and Ashland continue to refine low-styrene polyester compounds for sanitary ware, while Sumitomo Bakelite focuses on electronic encapsulants that meet 5G thermal-cycling standards. Near-source manufacturing for large components such as wind-turbine blades is emerging, with containerized pultrusion and molding cells enabling on-site production that bypasses transport bottlenecks. Collectively, these strategic moves reinforce competitive dynamics while enhancing customer value and sustainability credentials across the thermoset molding compound market.
Thermoset Molding Compound Industry Leaders
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Resonac Holdings Corporation
-
Hexion Inc.
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BASF
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Sumitomo Bakelite Co., Ltd.
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SHIKOKU CHEMICALS CORPORATION
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- December 2024: McClarin Composites signed a joint development deal with ExxonMobil’s Proxxima division. This partnership seeks to fast-track the expansion of high-speed, closed-mold composites manufacturing. The collaboration follows McClarin's strategic move, which acquired and relocated specific polyolefin thermoset molding facilities from ExxonMobil affiliate, Materia Inc.
- October 2024: IDI Composites International (IDI) inaugurated its state-of-the-art global headquarters and manufacturing facility in Noblesville, Indiana, to produce thermoset composite materials. The facility, spanning 120,000 square feet, features dedicated spaces for producing sheet molding compound (SMC) and bulk molding compound (BMC), alongside the 3i Composites Technology Center.
Global Thermoset Molding Compound Market Report Scope
| Epoxy |
| Melamine Formaldehyde (MF) |
| Urea Formaldehyde (UF) |
| Phenolic |
| Polyester |
| Other Thermoset Resins |
| Glass Fiber |
| Carbon Fiber |
| Other Reinforcements |
| Electrical and Electronics |
| Automotive |
| Aerospace |
| Construction |
| Consumer Goods |
| Other Applications |
| Asia-Pacific | China |
| India | |
| Japan | |
| South Korea | |
| ASEAN Countries | |
| Rest of Asia-Pacific | |
| North America | United States |
| Canada | |
| Mexico | |
| Europe | Germany |
| United Kingdom | |
| France | |
| Italy | |
| Rest of Europe | |
| South America | Brazil |
| Argentina | |
| Rest of South America | |
| Middle-East and Africa | Saudi Arabia |
| South Africa | |
| Rest of Middle-East and Africa |
| By Resin Type | Epoxy | |
| Melamine Formaldehyde (MF) | ||
| Urea Formaldehyde (UF) | ||
| Phenolic | ||
| Polyester | ||
| Other Thermoset Resins | ||
| By Fiber Reinforcement | Glass Fiber | |
| Carbon Fiber | ||
| Other Reinforcements | ||
| By Application | Electrical and Electronics | |
| Automotive | ||
| Aerospace | ||
| Construction | ||
| Consumer Goods | ||
| Other Applications | ||
| By Geography | Asia-Pacific | China |
| India | ||
| Japan | ||
| South Korea | ||
| ASEAN Countries | ||
| Rest of Asia-Pacific | ||
| North America | United States | |
| Canada | ||
| Mexico | ||
| Europe | Germany | |
| United Kingdom | ||
| France | ||
| Italy | ||
| Rest of Europe | ||
| South America | Brazil | |
| Argentina | ||
| Rest of South America | ||
| Middle-East and Africa | Saudi Arabia | |
| South Africa | ||
| Rest of Middle-East and Africa | ||
Key Questions Answered in the Report
How large is the Thermoset Molding Compound market in 2025?
The Thermoset Molding Compound market size is USD 11.88 Billion in 2025, with a projected CAGR of 6.28% to 2030.
Which region contributes most to global demand?
Asia-Pacific leads with 46.79% revenue share in 2024 and is growing at a 7.05% CAGR, driven by electronics, automotive, and infrastructure sectors.
What is the fastest-growing application segment?
Automotive components, particularly electric-vehicle battery enclosures, are advancing at a 7.12% CAGR through 2030 due to lightweighting imperatives.
How are producers addressing recyclability challenges?
Companies are developing vitrimer epoxies, dynamic-covalent networks, and recycled-fiber blends to enable reprocessing while preserving thermoset performance.
Which resin type is gaining the most momentum?
Epoxy compounds are growing fastest at a 6.77% CAGR, buoyed by aerospace certifications and renewable-energy composite demand.
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