MEMS Pressure Sensors Market Size and Share
Market Overview
| Study Period | 2019 - 2030 |
|---|---|
| Market Size (2025) | USD 2.67 Billion |
| Market Size (2030) | USD 3.60 Billion |
| Growth Rate (2025 - 2030) | 6.20% CAGR |
| Fastest Growing Market | Asia-Pacific |
| Largest Market | Asia-Pacific |
| Market Concentration | Medium |
Major Players
*Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0. |
|
MEMS Pressure Sensors Market Analysis by Mordor Intelligence
The MEMS pressure sensor market size was USD 2.67 billion in 2025 and is projected to reach USD 3.60 billion by 2030, growing at a 6.20% CAGR during the forecast period. Consistent adoption across automotive, medical, industrial, aerospace, and consumer electronics segments underpins demand, while investments in 300 mm wafer fabrication steadily lower production costs. Technical advances in parylene coatings, silicon-capacitive cell designs, and through-silicon-via architectures improve accuracy and long-term stability, sustaining replacement cycles. Regulatory programs, such as ISO 26262 for vehicle functional safety and FDA digital-health guidance, solidify design-win pipelines for suppliers who can quickly certify devices. Meanwhile, foundry-as-a-service business models help fabless start-ups prototype rapidly, broadening the supplier ecosystem and cushioning supply-chain shocks.
Key Report Takeaways
- By application, the automotive sector led with a 38.77% revenue share in 2024, while medical devices recorded the highest projected CAGR of 6.39% through 2030.
- By sensor type, silicon capacitive technology held a 53.49% market share of the MEMS pressure sensor market in 2024 and is projected to post a 7.89% CAGR through 2030.
- By 2024, absolute pressure sensors captured 47.86% of the MEMS pressure sensor market size, whereas differential devices are projected to advance at a 7.56% CAGR through 2030.
- By pressure range, the 10 kPa-100 kPa band commanded 55.92% of the MEMS pressure sensor market size in 2024; sub-10 kPa devices are forecast to accelerate at a 7.69% CAGR by 2030.
- By geography, the Asia-Pacific region controlled 49.71% of the MEMS pressure sensor market in 2024 and is projected to maintain the fastest regional growth at a 6.88% CAGR through 2030.
Global MEMS Pressure Sensors Market Trends and Insights
Drivers Impact Analysis
| Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Growing Adoption of Advanced Driver Assistance Systems | +1.8% | North America and Europe first movers, global roll-out | Medium term (2-4 years) |
| Proliferation of IoT-Enabled Consumer Electronics | +1.5% | Asia-Pacific core, North America spill-over | Short term (≤2 years) |
| Rapid Industrial Automation and Industry 4.0 Rollout | +1.2% | Germany, China, Japan clusters | Medium term (2-4 years) |
| Rising Miniaturization in Medical Devices | +0.9% | North America and European Union, growing Asia-Pacific | Long term (≥4 years) |
| Emerging Demand for Drone-Based Atmospheric Sensing | +0.6% | North America and Europe, nascent Asia-Pacific | Long term (≥4 years) |
| MEMS Foundry-as-a-Service Accelerating Start-Up Innovation | +0.4% | Foundry hubs in Asia-Pacific | Medium term (2-4 years) |
| Source: Mordor Intelligence | |||
Growing Adoption of Advanced Driver Assistance Systems (ADAS)
MEMS pressure sensors now underpin brake-line monitoring, thermal loops in electric vehicle battery packs, and altitude-assisted navigation. Devices must withstand temperatures ranging from −40 °C to 150 °C and deliver a millisecond response, prompting automakers to specify ASIL-rated parts. Silicon-capacitive die architectures help vendors achieve <0.1% full-scale linearity and under-2 µA standby current, supporting multi-sensor arrays without draining vehicle 48 V networks.[1]“A Micro and Low-Cost Packaging Technology of High Accuracy Piezoresistive Pressure Sensors With Parylene Coating,” IEEE, ieee.org
Proliferation of IoT-Enabled Consumer Electronics
Smartphones, wearables, and smart-home gadgets embed barometric sensors measuring no larger than 2 mm² to derive floor-level positioning, indoor climate cues, and fitness metrics. Bosch Sensortec’s BMP581 consumes only 1.3 µA at 1 Hz while sustaining ±30 Pa accuracy, exemplifying the low-power benchmark consumers now expect.[2]Muhannad Ghanam et al., “MEMS Shielded Capacitive Pressure and Force Sensors With Excellent Thermal Stability,” Sensors, mdpi.com
Rapid Industrial Automation and Industry 4.0 Rollout
Factory digitization drives the integration of MEMS pressure sensors into pneumatic cylinders, robotics, and predictive-maintenance dashboards. Wireless LoRaWAN transducers extend coverage to legacy brownfield assets, allowing supervisors to flag leaks or drifts before downtime occurs. Fraunhofer research confirms that silicon-ceramic hybrids remain stable beyond 350 °C, unlocking potential for petrochemical and power-generation applications.[3]“Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors,” Micromachines, mdpi.com
Rising Miniaturization in Medical Devices
Implantables and wearables rely on parylene-coated MEMS cells to meet the ISO 10993 biocompatibility standard. Parylene VT4 reduces urinary biofouling by 60%, making long-term bladder monitors feasible. Algorithms compensate for drift to ±1 mmHg across multi-year lifespans, supporting FDA-cleared digital biomarkers for chronic disease management.
Restraints Impact Analysis
| Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Complexity of Integrating Multiple Interface Standards | −0.8% | Fragmented European automotive supply chains | Short term (≤2 years) |
| Price Erosion Due to Intensifying Competition | −0.6% | Asia-Pacific cost leadership, global ripple | Medium term (2-4 years) |
| Supply Chain Risks in Advanced Wafer Bonding Materials | −0.4% | Semiconductor hubs worldwide | Short term (≤2 years) |
| Calibration Drift Under High Cycle Fatigue Conditions | −0.3% | High-reliability verticals worldwide | Long term (≥4 years) |
| Source: Mordor Intelligence | |||
Complexity of Integrating Multiple Interface Standards
Automakers face mixed I²C, SPI, SENT, and I³C buses within a single ECU, forcing the allocation of extra microcontroller resources and prolonging validation cycles by up to 12 months. Each protocol also demands separate cybersecurity and functional-safety documentation, straining engineering budgets and delaying platform launches.
Price Erosion Due to Intensifying Competition
Subsidized 300 mm fabs in East Asia drive wafer output higher and unit ASPs down. Large incumbents survive through volume scaling, but smaller fabless firms see their margins compress as list prices fall faster than cost reductions. Continuous innovation in process control and package miniaturization becomes essential to sustain profitability.
Segment Analysis
By Application: Automotive Integration Anchors Near-Term Revenue
The MEMS pressure sensor market size for the automotive sector reached USD 1.04 billion in 2024, accounting for a 38.77% share, driven by TPMS, brake-line diagnostics, and EV thermal loops. OEMs now request sensors with self-test routines and over-the-air firmware capability, enhancing fleet maintenance analytics. The MEMS pressure sensor market share for medical devices remains smaller in 2024 but displays a 6.39% CAGR outlook, driven by continuous glucose monitors and implantable cardiovascular platforms that require sub-millimeter form factors.
Industrial automation utilizes LoRa-enabled pressure nodes to reduce maintenance costs by 30%, while aerospace programs require radiation-hardened units for launch vehicles. Consumer electronics are extending barometric sensing to augmented-reality headsets, targeting an elevation accuracy of ±0.5 m indoors.
Note: Segment shares of all individual segments available upon report purchase
By Type: Silicon Capacitive Cells Ascend
Silicon-capacitive elements accounted for 53.49% of 2024 revenue, with the MEMS pressure sensor market size for this type projected to expand at a 7.89% annual rate. Their superior linearity and drift of -40 °C to 125 °C, below 0.05%/°C, suit safety-critical ADAS and medical tools. Piezoresistive dies remain preferred for legacy analog ECUs due to their simple signal chains, but temperature-induced leakage limits their use in extreme environments.
The adoption of through-silicon-via interposers enables the 3D stacking of ASICs under the diaphragm, thereby shrinking the Z-height and boosting EMI immunity. Silicon-carbide piezoresistive prototypes now withstand temperatures exceeding 300 °C, paving the way for future deployment in gas turbines and down-hole drilling.
By Technology: Absolute Sensing Retains Leadership
Absolute devices accounted for 47.86% of the total value in 2024. Smartphones, altimeters, and vacuum systems benefit from sealed reference cavities that decouple readings from ambient air. Differential sensors rise fastest at 7.56% CAGR on HVAC, ventilator, and flow-meter demand. Gauge models cover brake-fluid monitors where atmospheric compensation suffices.
Wafer-level hermetic sealing tightens reference drift to <20 ppm/°C, extending calibration intervals and lowering the total cost of ownership for fleet operators. Software-defined sensors capable of toggling between absolute and gauge modes attract integrators seeking design reuse across platforms.
Note: Segment shares of all individual segments available upon report purchase
By Pressure Range: Mid-Band Dominates Volume, Low-End Leads Growth
The 10 kPa-100 kPa category accounted for 55.92% of the overall 2024 shipments, aligning with the barometric and TPMS sweet spots. Below-10 kPa sensors, although comprising just 13% of 2024 units, exhibit a 7.69% CAGR as semiconductor fabs and medical suction equipment demand high-vacuum accuracy. Above-100 kPa models serve hydraulics and aerospace bleed-air loops, commanding premium ASPs yet lower volume.
DRIE and silicon-on-insulator processes now enable the tailoring of diaphragm thickness down to 200 nm, yielding high-resolution sub-kPa sensors for drone meteorology that resolve 4 cm altitude steps.
Geography Analysis
Asia-Pacific commanded 49.71% of 2024 revenue and is on course to clock 6.88% CAGR through 2030. Strong smartphone assembly, expanding EV production, and government semiconductor incentives sustain momentum. China’s localization drive channels capital into domestic fabs, while Japan and South Korea refine front-end process know-how for advanced packaging.
North America ranks second; defense, aerospace, and medical regulations favor high-margin sensor designs. U.S. CHIPS Act grants underwrite new 300 mm MEMS lines, de-risking supply for critical sectors. Europe remains steady, thanks to Germany’s automotive core and stringent environmental regulations that drive sensor upgrades in industrial machinery.
The Middle East and Africa register early traction in oil-rig and desalination plants that require harsh-environment sensors, whereas South America’s growth is tied to vehicle output in Brazil and Argentina. Region-specific safety and data-privacy mandates occasionally complicate the reuse of cross-border design, nudging vendors to localize their firmware stacks.
Competitive Landscape
The MEMS pressure sensor market features moderate concentration. Bosch Sensortec, STMicroelectronics, and TDK-InvenSense integrate design, front-end, packaging, and software, enabling cost synergies. STMicroelectronics bolstered its portfolio through a USD 950 million acquisition of NXP's MEMS business, securing sockets for the automotive and industrial sectors. Foundry-as-a-service leaders such as Silex Microsystems open 300 mm lines to fabless challengers, diversifying supply yet heightening price competition.
Strategic R&D themes include ultra-low-power ASICs, parylene-encapsulated diaphragms for aqueous media, and bundled machine-learning libraries that convert pressure waveforms into actionable diagnostics. Intellectual-property depth around wafer bonding and hermetic sealing remains a decisive barrier for new entrants.
Niche disruptors explore silicon-carbide die for 500 °C environments, while academic consortia investigate graphene diaphragms for sub-100 Pa resolution. Price erosion persists in commodity barometric parts, but aerospace and medical verticals sustain premium pricing through performance and certification hurdles.
MEMS Pressure Sensors Industry Leaders
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Robert Bosch GmbH (Bosch Sensortec)
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STMicroelectronics N.V.
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Murata Manufacturing Co., Ltd.
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Infineon Technologies AG
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Honeywell International Inc.
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- September 2025: Silex Microsystems completed phase-one construction of its 300 mm MEMS fabrication-facility expansion in Järfälla, Sweden, representing part of a USD 200 million investment to increase global foundry capacity and reduce per-unit manufacturing costs for pressure-sensor clients through larger wafer-processing capabilities.
- May 2025: Bosch Sensortec introduced the BMP581 barometric pressure sensor, positioned as a benchmark device for altitude-tracking applications with 1.3 µA current consumption and ±30 Pa absolute accuracy across 300-1100 hPa pressure ranges, targeting GPS modules, wearables, and smart-home applications Bosch Sensortec.
- March 2025: Rogue Valley Microdevices initiated production at its new 300 mm MEMS manufacturing facility in Palm Bay, Florida, following USD 6.7 million CHIPS Act funding, targeting aerospace, defense, and medical pressure-sensor applications with enhanced domestic supply-chain capabilities.
- January 2025: STMicroelectronics completed acquisition of NXP Semiconductors' MEMS sensor business for USD 950 million, strengthening its position in automotive and industrial pressure-sensor markets while expanding manufacturing capacity and customer relationships across Europe and Asia-Pacific regions.
Global MEMS Pressure Sensors Market Report Scope
Micro-electro-mechanical systems, or MEMS, is a technology that, in its most general form, can be defined as miniaturized mechanical and electro-mechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. Moreover, MEMS pressure sensors use piezoresistors, tiny strain gauges embedded in a thin silicon membrane, to translate pressure signals into electrical signals. Pressure deflects the membrane mechanically, resulting in a mechanical strain that is transformed into a change in electrical resistance and detected as a change in voltage. The ability of the interface electronics to connect to commercially available monitors and utilize existing device circuitry reduces system complexity, lowers project costs, and shortens time to market.
The MEMS Pressure Sensors Market is Segmented by Application (Medical, Automotive, Industrial, Aerospace and Defense, and Consumer Electronics), Type (Silicon Piezoresistive and Silicon Capacitive), and Geography (North America, Europe, Asia Pacific, Latin America, Middle East, and Africa). The market sizes and forecasts are provided in terms of value (USD million) for all the above segments.
| Medical |
| Automotive |
| Industrial |
| Aerospace and Defense |
| Consumer Electronics |
| Silicon Piezoresistive |
| Silicon Capacitive |
| Gauge |
| Absolute |
| Differential |
| Below 10 kPa |
| 10 kPa – 100 kPa |
| Above 100 kPa |
| North America | United States | |
| Canada | ||
| Mexico | ||
| Europe | Germany | |
| United Kingdom | ||
| France | ||
| Russia | ||
| Rest of Europe | ||
| Asia-Pacific | China | |
| Japan | ||
| India | ||
| South Korea | ||
| Australia | ||
| Rest of Asia-Pacific | ||
| Middle East and Africa | Middle East | Saudi Arabia |
| United Arab Emirates | ||
| Rest of Middle East | ||
| Africa | South Africa | |
| Egypt | ||
| Rest of Africa | ||
| South America | Brazil | |
| Argentina | ||
| Rest of South America | ||
| By Application | Medical | ||
| Automotive | |||
| Industrial | |||
| Aerospace and Defense | |||
| Consumer Electronics | |||
| By Type | Silicon Piezoresistive | ||
| Silicon Capacitive | |||
| By Technology | Gauge | ||
| Absolute | |||
| Differential | |||
| By Pressure Range | Below 10 kPa | ||
| 10 kPa – 100 kPa | |||
| Above 100 kPa | |||
| By Geography | North America | United States | |
| Canada | |||
| Mexico | |||
| Europe | Germany | ||
| United Kingdom | |||
| France | |||
| Russia | |||
| Rest of Europe | |||
| Asia-Pacific | China | ||
| Japan | |||
| India | |||
| South Korea | |||
| Australia | |||
| Rest of Asia-Pacific | |||
| Middle East and Africa | Middle East | Saudi Arabia | |
| United Arab Emirates | |||
| Rest of Middle East | |||
| Africa | South Africa | ||
| Egypt | |||
| Rest of Africa | |||
| South America | Brazil | ||
| Argentina | |||
| Rest of South America | |||
Key Questions Answered in the Report
How large is the MEMS pressure sensor market in 2025?
The MEMS pressure sensor market size reached USD 2.67 billion in 2025, reflecting broad uptake across vehicles, medical devices and IoT gadgets.
What is the growth outlook for MEMS pressure sensors to 2030?
Revenue is projected to rise to USD 3.60 billion by 2030, translating into a 6.20% CAGR as automotive electrification and medical wearables expand.
Which application area shows the fastest momentum?
Medical devices post the highest forecast CAGR at 6.39% thanks to continuous glucose monitors, implantables and digital therapeutics.
Why are silicon-capacitive sensors gaining share?
Capacitive designs offer better than 0.1% full-scale linearity and lower temperature drift, supporting stringent ADAS and implantable use-cases.
Which region leads global shipments?
Asia-Pacific accounts for about 50% of 2024 revenue, supported by consumer electronics assembly hubs and expanding vehicle production.
How intense is price pressure in commodity segments?
Price erosion persists as East Asian 300 mm fabs scale output, compelling established players to differentiate through performance and software features.
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