High-end Copper Foil Market - Growth, Trends, and Forecast (2019 - 2024)

The market is segmented by Type (Rolled Copper Foil and Electrodeposited (ED) Copper Foil), Application (Circuit Boards, Batteries, Solar and Alternative Energy, Appliances, Medical, and Other Applications), and Geography.

Market Snapshot

CAGR Chart
Study Period:

2016-2024

Base Year:

2018

Fastest Growing Market:

Asia Pacific

Largest Market:

Asia Pacific

Key Players:

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Market Overview

The market for high-end copper foil is expected to register a CAGR of 6.35% during the forecast period (2019-2024). One of the major factors driving the market studied is the growing application as a printed circuit board (PCB) material. Development of single crystal graphene sheet as a substitute for copper foil is expected to hinder the growth of the market studied.

  • Circuit boards application dominated the market in 2018, and is expected to grow at a moderate rate during the forecast period, owing to the increasing demand for consumer gadgets, such as smartphones, PCs, tablets, and other medical electronics products.
  • Copper foils in transformer and grid-level energy storage are likely to act as an opportunity in the future.
  • Asia-Pacific dominated the market across the world, with the largest consumption from countries, such as China and India.

Scope of the Report

The high-end copper foil market report includes:

Type
Rolled Copper Foil
Electrodeposited (ED) Copper Foil
Application
Circuit Boards
Batteries
Solar and Alternative Energy
Appliances
Medical
Other Applications
Geography
Asia-Pacific
China
India
Japan
South Korea
Australia & New Zealand
Rest of Asia-Pacific
North America
United States
Canada
Mexico
Europe
Germany
United Kingdom
Italy
France
Russia
Rest of Europe
South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

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Key Market Trends

Growing Application as a Printed Circuit Board (PCB) Material

  • High-end copper foils are often used in the manufacturing of single- and double-sided printed circuit boards (PCBs). PCBs usually consist of a woven glass epoxy base material, which is clad with copper on one side or both sides of the board with varying thickness.
  • The copper foils that are used in circuit boards typically vary from 0.0007 and 0.00134 inches in thickness, and have an average weight of 1 oz. per square foot.
    • The different classes of copper used in the PCB industries have their own limitation and capabilities. Both, rolled copper and electro-deposited (ED) copper are used during the manufacturing process.
  • The development of PCBs offers the electronics industry with a reliable and cost-effective way to interconnect electronic components.
  • The demand for printed circuit boards and laminates is proportional to the demand for computers and other sophisticated electronic equipment. The computer components include mainframes, peripherals, mini-computers, terminals, printers, and various add-on devices.
    • These are also used in communication devices, military equipment, industrial electronics, scientific and medical instruments, business and educational equipment, tablets, cell phones, mobile radios, electronic warfare apparatus, and guidance control systems.
  • With an increase in world population and the increase in disposable incomes of individuals, the demand for these devices is increasing. This, in turn, is increasing the demand for PCBs.
  • With the increasing implementation of PCBs in numerous electronic equipment and devices, the demand for high-end copper foils is expected to continue to increase in the coming years.
Driver Chart

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Asia-Pacific Region to Dominate the Market

The Asia-Pacific region dominated the global market share in 2018, owing to the increasing production activities in countries, including China and India, among others. More than 50% of PCBs are manufactured in China, owing to the huge incentives offered by the government to PCB factories. China is also producing these circuit boards at a very low cost. As a result, many companies across the world are closing their operations. In India, the FAME scheme has been launched by the government to boost the electric vehicles manufacturing, which aims to achieve production of around 7 million EVs (Electric Vehicles) by 2020. The PCB manufacturers in South Korea have advanced technical skills, which is likely to benefit the high-end copper foil market. These manufacturers have won orders for PCB from Apple. TAESUNG is the main company dealing with the manufacturing of PCB for Apple. The aforementioned factors, coupled with government support, are like to contribute to the increasing demand for high-end copper foil consumption in the region, during the forecast period.

Map Chart

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Competitive Landscape

The high-end copper foil market is partially consolidated, with top five players accounting for a considerable chunk of the market. The major companies include Mitsui Mining & Smelting Co. Ltd, Furukawa Electric Co. Ltd, Sumitomo Metal Mining Co. Ltd, Doosan Corporation, and Olin Brass (Global Brass and Copper Holding Inc.).

Table of Contents

  1. 1. INTRODUCTION

    1. 1.1 Study Deliverables

    2. 1.2 Study Assumptions

    3. 1.3 Scope of the Study

  2. 2. RESEARCH METHODOLOGY

  3. 3. EXECUTIVE SUMMARY

  4. 4. MARKET DYNAMICS

    1. 4.1 Drivers

      1. 4.1.1 Growing Application as a Printed Circuit Board (PCB) Material

      2. 4.1.2 Increasing Demand for Lithium Ion Batteries From Transportation and Energy Storage Sector

    2. 4.2 Restraints

      1. 4.2.1 Development of Single Crystal Graphene Sheet as a Substitute for Copper Foil

    3. 4.3 Industry Value Chain Analysis

    4. 4.4 Porters Five Forces Analysis

      1. 4.4.1 Bargaining Power of Suppliers

      2. 4.4.2 Bargaining Power of Consumers

      3. 4.4.3 Threat of New Entrants

      4. 4.4.4 Threat of Substitute Products and Services

      5. 4.4.5 Degree of Competition

  5. 5. MARKET SEGMENTATION

    1. 5.1 Type

      1. 5.1.1 Rolled Copper Foil

      2. 5.1.2 Electrodeposited (ED) Copper Foil

    2. 5.2 Application

      1. 5.2.1 Circuit Boards

      2. 5.2.2 Batteries

      3. 5.2.3 Solar and Alternative Energy

      4. 5.2.4 Appliances

      5. 5.2.5 Medical

      6. 5.2.6 Other Applications

    3. 5.3 Geography

      1. 5.3.1 Asia-Pacific

        1. 5.3.1.1 China

        2. 5.3.1.2 India

        3. 5.3.1.3 Japan

        4. 5.3.1.4 South Korea

        5. 5.3.1.5 Australia & New Zealand

        6. 5.3.1.6 Rest of Asia-Pacific

      2. 5.3.2 North America

        1. 5.3.2.1 United States

        2. 5.3.2.2 Canada

        3. 5.3.2.3 Mexico

      3. 5.3.3 Europe

        1. 5.3.3.1 Germany

        2. 5.3.3.2 United Kingdom

        3. 5.3.3.3 Italy

        4. 5.3.3.4 France

        5. 5.3.3.5 Russia

        6. 5.3.3.6 Rest of Europe

      4. 5.3.4 South America

        1. 5.3.4.1 Brazil

        2. 5.3.4.2 Argentina

        3. 5.3.4.3 Rest of South America

      5. 5.3.5 Middle East & Africa

        1. 5.3.5.1 Saudi Arabia

        2. 5.3.5.2 South Africa

        3. 5.3.5.3 Rest of Middle East & Africa

  6. 6. COMPETITIVE LANDSCAPE

    1. 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements

    2. 6.2 Market Share Analysis**

    3. 6.3 Strategies Adopted by Leading Players

    4. 6.4 Company Profiles

      1. 6.4.1 Mitsui Mining & Smelting Co. Ltd

      2. 6.4.2 The Furukawa Electric Co. Ltd

      3. 6.4.3 Chang Chun Petrochemical Co. Ltd

      4. 6.4.4 JX Nippon Mining & Metals Corporation

      5. 6.4.5 Fukuda Metal Foil & Powder Co. Ltd

      6. 6.4.6 Targray Technology International Inc.

      7. 6.4.7 Olin Brass (Global Brass and Copper Holdings Inc.)

      8. 6.4.8 Sumitomo Metal Mining Co. Ltd

      9. 6.4.9 SH Copper Products Co. Ltd

      10. 6.4.10 Doosan Corporation

      11. 6.4.11 Civen Metal Material(Shanghai) Co. Ltd

      12. 6.4.12 UACJ Foil Corporation

  7. 7. MARKET OPPORTUNITIES AND FUTURE TRENDS

    1. 7.1 Copper Foils In Transformer and Grid-level Energy Storage

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