High-end Copper Foil Market | Growth, Trends, and Forecast (2020

ABOUT THIS REPORT
- Market Snapshot
- Market Overview
- Scope of the Report
- Key Market Trends
- Competitive Landscape
- Major Players
TABLE OF CONTENTS

Market Snapshot

Study Period:

2016-2025

Base Year:

2019

Fastest Growing Market:

Asia Pacific

Largest Market:

Asia Pacific

CAGR:

6 %

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Market Overview

The market for high-end copper foil is expected to register a CAGR of more than 6% during the forecast period. One of the major factors driving the market studied is the growing application as a printed circuit board (PCB) material. Development of single crystal graphene sheet as a substitute for copper foil is expected to hinder the growth of the market studied.

Circuit boards application dominated the market and is expected to grow at a moderate rate during the forecast period, owing to the increasing demand for consumer gadgets, such as smartphones, PCs, tablets, and other medical electronics products.
Copper foils in transformer and grid-level energy storage are likely to act as an opportunity in the future.
Asia-Pacific dominated the market across the world, with the largest consumption from countries, such as China and India.

Scope of the Report

The high-end copper foil market report includes:

Type
		Rolled Copper Foil
		Electrodeposited (ED) Copper Foil

Application
		Circuit Boards
		Batteries
		Solar and Alternative Energy
		Appliances
		Medical
		Other Applications

Geography

Asia-Pacific
	China
	India
	Japan
	South Korea
	Australia & New Zealand
	Rest of Asia-Pacific

North America
	United States
	Canada
	Mexico

Europe
	Germany
	United Kingdom
	Italy
	France
	Russia
	Rest of Europe

South America
	Brazil
	Argentina
	Rest of South America

Middle East & Africa
	Saudi Arabia
	South Africa
	Rest of Middle East & Africa

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Key Market Trends

Increasing Demand for Circuit Boards

Most of the electronics products manufactured contains printed circuit boards (PCBs). High quality PCB manufacturing technology has allowed the electronics products manufacturers to produce smaller and more complex products. It is the key to today’s dynamic and rapidly progressing electronic innovations.
The substrate used to manufacture printed circuit boards is a type of fiberglass-reinforced epoxy laminate. Epoxy resin has a copper foil bonded to one or both sides.
Two main types of copper foil are used in PCBs: electrodeposited and rolled copper foil. Both these types have many possible variations, with the most choices available for ED copper. Copper foil characteristics are very important for high-frequency circuits.
Rolled copper foil is used extensively for flexible circuit boards where smooth surface is preferred. Electrodeposited copper foils are used in rigid flexible circuits.
The demand for consumer gadgets, such as smartphones, PCs, tablets, and other medical electronics products is rapidly increasing across the world, with India and China expected to remain at the top of market growth. As printed circuits boards are deployed in almost all electronics products, it is likely to drive the demand for high quality copper foil in the coming years.
Over 51% of the PCBs are manufactured in China, owing to offering of huge incentives by the government to the PCB factories. China is also producing these circuit boards at a very low cost. As a result, many companies across the world are closing their operations.
The United Kingdom used to have over 300 PCB factories over the last decade, but it has now reduced to less than 35. South Africa is also experiencing the same effects due to cost of raw materials going up and more labor costs.
The Chinese government has given massive incentives for the production of electric vehicles, which is utilizing high-end copper foils for lithium ion batteries. Due to this, the PCB manufacturers are facing copper foils crisis as they are increasingly being utilized in EVs, PHEVs, etc.

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Asia-Pacific Region to Dominate the Market

The Asia-Pacific region dominated the global market share, owing to the increasing production activities in countries, including China and India, among others.
More than 50% of PCBs are manufactured in China, owing to the huge incentives offered by the government to PCB factories.
China is also producing these circuit boards at a very low cost. As a result, many companies across the world are closing their operations. In India, the FAME scheme has been launched by the government to boost the electric vehicles manufacturing, which aims to achieve production of around 7 million EVs (Electric Vehicles) by 2020.
The PCB manufacturers in South Korea have advanced technical skills, which is likely to benefit the high-end copper foil market. These manufacturers have won orders for PCB from Apple. TAESUNG is the main company dealing with the manufacturing of PCB for Apple.
The aforementioned factors, coupled with government support, are like to contribute to the increasing demand for high-end copper foil consumption in the region, during the forecast period.

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Competitive Landscape

The high-end copper foil market is partially consolidated, with top five players accounting for a considerable chunk of the market. The major companies include Mitsui Mining & Smelting Co. Ltd, Furukawa Electric Co. Ltd, Sumitomo Metal Mining Co. Ltd, Doosan Corporation, and Olin Brass (Global Brass and Copper Holding Inc.).

Major Players

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1. INTRODUCTION
1. 1.1 Study Deliverables
2. 1.2 Study Assumptions
3. 1.3 Scope of the Study
2. RESEARCH METHODOLOGY
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
1. 4.1 Drivers
  1. 4.1.1 Growing Application as a Printed Circuit Board (PCB) Material
  2. 4.1.2 Increasing Demand for Lithium Ion Batteries From Transportation and Energy Storage Sector
2. 4.2 Restraints
  1. 4.2.1 Development of Single Crystal Graphene Sheet as a Substitute for Copper Foil
3. 4.3 Industry Value Chain Analysis
4. 4.4 Porter's Five Forces Analysis
  1. 4.4.1 Bargaining Power of Suppliers
  2. 4.4.2 Bargaining Power of Consumers
  3. 4.4.3 Threat of New Entrants
  4. 4.4.4 Threat of Substitute Products and Services
  5. 4.4.5 Degree of Competition
5. MARKET SEGMENTATION
1. 5.1 Type
  1. 5.1.1 Rolled Copper Foil
  2. 5.1.2 Electrodeposited (ED) Copper Foil
2. 5.2 Application
  1. 5.2.1 Circuit Boards
  2. 5.2.2 Batteries
  3. 5.2.3 Solar and Alternative Energy
  4. 5.2.4 Appliances
  5. 5.2.5 Medical
  6. 5.2.6 Other Applications
3. 5.3 Geography
  1. 5.3.1 Asia-Pacific
    1. 5.3.1.1 China
    2. 5.3.1.2 India
    3. 5.3.1.3 Japan
    4. 5.3.1.4 South Korea
    5. 5.3.1.5 Australia & New Zealand
    6. 5.3.1.6 Rest of Asia-Pacific
  2. 5.3.2 North America
    1. 5.3.2.1 United States
    2. 5.3.2.2 Canada
    3. 5.3.2.3 Mexico
  3. 5.3.3 Europe
    1. 5.3.3.1 Germany
    2. 5.3.3.2 United Kingdom
    3. 5.3.3.3 Italy
    4. 5.3.3.4 France
    5. 5.3.3.5 Russia
    6. 5.3.3.6 Rest of Europe
  4. 5.3.4 South America
    1. 5.3.4.1 Brazil
    2. 5.3.4.2 Argentina
    3. 5.3.4.3 Rest of South America
  5. 5.3.5 Middle East & Africa
    1. 5.3.5.1 Saudi Arabia
    2. 5.3.5.2 South Africa
    3. 5.3.5.3 Rest of Middle East & Africa
6. COMPETITIVE LANDSCAPE
1. 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
2. 6.2 Market Ranking Analysis
3. 6.3 Strategies Adopted by Leading Players
4. 6.4 Company Profiles
  1. 6.4.1 Mitsui Mining & Smelting Co. Ltd
  2. 6.4.2 The Furukawa Electric Co. Ltd
  3. 6.4.3 Chang Chun Petrochemical Co. Ltd
  4. 6.4.4 JX Nippon Mining & Metals Corporation
  5. 6.4.5 Fukuda Metal Foil & Powder Co. Ltd
  6. 6.4.6 Targray Technology International Inc.
  7. 6.4.7 Olin Brass (Global Brass and Copper Holdings Inc.)
  8. 6.4.8 Sumitomo Metal Mining Co. Ltd
  9. 6.4.9 SH Copper Products Co. Ltd
  10. 6.4.10 Doosan Corporation
  11. 6.4.11 Civen Metal Material(Shanghai) Co. Ltd
  12. 6.4.12 UACJ Foil Corporation

*List Not Exhaustive

7. MARKET OPPORTUNITIES AND FUTURE TRENDS
1. 7.1 Copper Foils In Transformer and Grid-level Energy Storage

** Subject to Availability