Market Share of Dynamic Random Access Memory (DRAM) Industry
The dynamic random access memory (DRAM) market is semi-consolidated, with the major players in the market, like Samsung Electronics, SK Hynix, and Micron, holding a significant market share. Geographical expansion and product innovation play a vital role in the competitive strategy of market players. Vendors need enhanced fabrication and processing capabilities in line with the increasing data center, mobile, and consumer applications that require improved speed and performance. The prominent vendors in the DRAM market are investing heavily in the next generation of chips, like 24GB, DDR5, and HBM, and have moved into the next phase of making FRAMs for AI and 5G. This is helping them stay ahead of the competition, but it also means they need to be able to pay for their research and development.
- September 2023: Samsung Electronics unveiled the pioneering low-power compression attached memory module (LPCAMM) form factor, marking a significant breakthrough in the DRAM market for personal computers, laptops, and data centers. This cutting-edge development has successfully passed rigorous system verification on Intel's platform, achieving a remarkable speed of 7.5 Gbps.
- June 2023: Micron Technology Inc. revealed its intention to construct a new assembly and test facility in Gujarat, India. The facility will cater to manufacturing DRAM and NAND products in domestic and international markets. The construction of the new facility was to commence in 2023 and will be carried out in phases. The first phase will include 500,000 square feet of cleanroom space and is expected to become operational in late 2024.
Dynamic Random Access Memory (DRAM) Market Leaders
Samsung Electronics Co. Ltd.
Micron Technology Inc.
SK Hynix Inc.
Nanya Technology Corporation
Winbond Electronics Corporation
*Disclaimer: Major Players sorted in no particular order
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