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The electronic packaging market is segmented by Material( Plastic, Metal, Glass, Other Materials) , by End-user Industry (Consumer Electronics, Aerospace and Defense, Automotive, Healthcare, Other End-user Industries), and Geography.
Fastest Growing Market:
The electronic packaging market was valued at USD 1020.13 million in 2019, and is expected to reach USD 2825.42 million by 2025, at a CAGR of 18.51% over the forecast period (2020-2025). Consumer electronics segment is the largest sector of the market studied, due to the rising demand for products, such as TVs, set-top boxes, MP3 players, digital cameras, and the processes are generally more suited for mass production.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems, such as a mainframe computer. This is being used by the consumer electronics, aerospace and defense, automotive, and healthcare industry. The electronic packaging market includes communication integrated services (ICs), memory power management devices and analog, digital and mixed-signal ICs, as these are driving a host of applications in clinical diagnostics and therapy and medical imaging.
|By End-user Industry|
|Aerospace and Defense|
|Other End-user Industries|
|Middle East & Africa|
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The electronic packaging market is fragmented. Microsystems are used almost in every industry vertical, with some of the significant sections being consumer electronics, healthcare equipment, aerospace and defense, communications, etc. Semiconductor devices, such as ICs have become an integral part of a machine, as electronics is getting integrated into machines, which is in turn driving the growth of electronic packaging significantly.
Overall, the competitive rivalry among the existing competitors is high. Moving forward, acquisitions and collaboration of large companies with startups are expected, which are focused toward innovation.
1.1 Study Deliverables
1.2 Study Assumptions
1.3 Scope of the Study
2. RESEARCH METHODOLOGY
3. EXECUTIVE SUMMARY
4. MARKET DYNAMICS
4.1 Market Overview
4.2 Market Drivers
4.2.1 Rising Concern over Product and Consumer Safety
4.2.2 Technological Advancements Drive the Product Quality
4.3 Market Restraints
4.3.1 High Costs for Electronic Packaging and Lack of Skilled Professionals to Challenge the Market Growth
4.4 Industry Attractiveness - Porter's Five Forces Analysis
4.4.1 Threat of New Entrants
4.4.2 Bargaining Power of Buyers/Consumers
4.4.3 Bargaining Power of Suppliers
4.4.4 Threat of Substitute Products
4.4.5 Intensity of Competitive Rivalry
4.5 Technology Snapshot
5. MARKET SEGMENTATION
5.1 By Material
5.1.4 Other Materials
5.2 By End-user Industry
5.2.1 Consumer Electronics
5.2.2 Aerospace and Defense
5.2.5 Other End-user Industries
5.3.1 North America
220.127.116.11 United States
18.104.22.168 United Kingdom
22.214.171.124 Rest of Europe
126.96.36.199 Rest of Asia-Pacific
5.3.4 Latin America
5.3.5 Middle East & Africa
6. COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 AMETEK Inc.
6.1.2 Dordan Manufacturing Company
6.1.3 E. I. du Pont de Nemours and Company
6.1.4 GY Packaging, Plastiform Inc.
6.1.5 Kiva Container Corporation
6.1.6 Primex Design & Fabrication
6.1.7 Quality Foam Packaging Inc.
6.1.8 Sealed Air Corporation
6.1.9 The Box Co-Op
6.1.10 UFP Technologies, Inc.
7. INVESTMENT ANALYSIS
8. MARKET OPPORTUNITIES AND FUTURE TRENDS
* List Not Exhaustive