Chemical Mechanical Planarization Market Size and Share
Market Overview
| Study Period | 2019 - 2030 |
|---|---|
| Market Size (2025) | USD 6.93 Billion |
| Market Size (2030) | USD 9.42 Billion |
| Growth Rate (2025 - 2030) | 7.42% CAGR |
| Fastest Growing Market | Asia Pacific |
| Largest Market | Asia Pacific |
| Market Concentration | Medium |
Major Players
*Disclaimer: Major Players sorted in no particular order Image © Mordor Intelligence. Reuse requires attribution under CC BY 4.0. |
|
Chemical Mechanical Planarization Market Analysis by Mordor Intelligence
The chemical mechanical planarization market size is valued at USD 6.93 billion in 2025 and is forecast to reach USD 9.42 billion by 2030, expanding at a 7.42% CAGR. Growth is propelled by the transition from FinFET to gate-all-around (GAA) transistors, 3D-integration, and the rising use of silicon carbide (SiC) and gallium nitride (GaN) in power devices. Foundries continue large-scale capacity additions, and government incentives in the United States and European Union encourage local CMP supply chains. Tight tool availability constrains production ramps, while sustainability initiatives accelerate demand for low-abrasive and abrasive-free slurries. Geopolitical export controls reshape equipment flows and spur parallel innovation tracks between Western and Chinese vendors.
Key Report Takeaways
- By product type, equipment held 63.17% of the chemical mechanical planarization market share in 2024, and the equipment segment is projected to expand at a 7.72% CAGR through 2030.
- By application, integrated circuits commanded 65.1% of the chemical mechanical planarization market size in 2024, while advanced packaging is advancing at an 8.17% CAGR to 2030.
- By end-user, foundries led with 41.58% revenue share in 2024; OSAT providers record the highest projected 8.24% CAGR through 2030.
- By geography, the Asia Pacific accounted for 64.7% of revenue in 2024 and is forecast to post an 8.66% CAGR over the outlook period.
Global Chemical Mechanical Planarization Market Trends and Insights
Drivers Impact Analysis
| Driver | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Accelerating GAA and 3D-IC adoption | +1.8% | Taiwan, South Korea | Medium term (2-4 years) |
| Rapid growth in SiC/GaN power devices | +1.2% | Automotive hubs worldwide | Long term (≥ 4 years) |
| Shrinking node-specific CMP step count | +0.9% | Asia Pacific, North America | Short term (≤ 2 years) |
| AI datacenter capital expenditure | +1.5% | North America, Asia Pacific | Medium term (2-4 years) |
| U.S. and EU fab incentives | +0.8% | United States, European Union | Long term (≥ 4 years) |
| Sustainability push for low-abrasive slurries | +0.6% | Global | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
Accelerating GAA and 3D-IC adoption
Gate-all-around transistors alter CMP chemistries by introducing new metal gate stacks that require highly selective removal rates and tighter defectivity thresholds. Leading foundries have scheduled volume production of GAA nodes below 3 nm, driving an equipment refresh cycle for 300 mm single-wafer polishers with advanced endpoint control. Complementary 3D-integration techniques, such as through-silicon vias, demand ultra-flat copper layers across multiple wafer surfaces. CMP platforms, therefore, integrate closed-loop pad conditioning and real-time slurry monitoring to sustain yields at ever-smaller tolerances [1]Source: Applied Materials, “Q3 2024 Earnings Presentation,” ir.appliedmaterials.com .
Rapid growth in SiC/GaN power devices
Silicon carbide and gallium nitride wafers exhibit hardness and chemical inertness that multiply polish times and consumable costs. Dedicated slurries using alkaline chemistries and engineered abrasives now achieve removal rates near 1 µm/h while holding surface roughness below 0.05 nm. Automotive electrification accelerates demand for these materials, prompting tool makers to release pad designs resilient to abrasive wear and cross-contamination shielding between SiC and traditional silicon lines.
AI datacenter capital expenditure
Hyperscale operators build multi-chiplet accelerators that rely on 2.5D and 3D packages. Fine-pitch micro-bumps and copper redistribution layers require defect-free planarization prior to bonding. North American and Taiwanese fabs have therefore expanded post-CMP cleaning modules and high-throughput dielectric polishers to meet back-end-of-line growth tied to AI workloads.
U.S. and EU fab incentives
The U.S. CHIPS and Science Act and the EU Chips Act channel billions into domestic fabs, creating regional demand for both CMP tools and consumables that meet local content rules. New facilities in Arizona and New York include slurry blending and pad finishing lines intended to shorten supply chains and lower logistics risk.
Restraints Impact Analysis
| Restraint | (~) % Impact on CAGR Forecast | Geographic Relevance | Impact Timeline |
|---|---|---|---|
| Escalating slurry input costs | −0.7% | Global | Short term (≤ 2 years) |
| Tight OEM capacity for 300 mm tools | −0.5% | Global | Medium term (2-4 years) |
| Cross-contamination risk in hetero-material CMP | −0.4% | Asia Pacific, North America, EU | Medium term (2-4 years) |
| Export controls on high-end pads and conditioners | −0.3% | China, allied countries | Long term (≥ 4 years) |
| Source: Mordor Intelligence | |||
Escalating slurry input costs
Cerium oxide, hydrogen peroxide, and other high-purity inputs show price spikes when rare-earth supply tightens or chemical plants undergo maintenance. The U.S. Geological Survey notes China remains the main source of rare-earth imports, leaving global slurry vendors exposed to trade disputes [2]Source: U.S. Geological Survey, “Mineral Commodity Summaries 2025,” usgs.gov. Vendors respond by reformulating slurries with lower abrasive loads and recycling spent solutions through filtration loops.
Tight OEM capacity for 300 mm tools
Applied Materials and Lam Research report record order backlogs for single-wafer CMP systems, extending lead times beyond one year [3]Source: Evertiq, “Chip Manufacturing Equipment Sales Set for All-Time Record,” evertiq.com . Limited machining slots delay fab ramps and push customers to book equipment years in advance. Smaller Chinese OEMs enter the mature-node segment, yet performance gaps restrict adoption at leading-edge nodes.
Segment Analysis
By Product Type: Precision equipment underpins node migration
Equipment represented 63.17% of the chemical mechanical planarization market size in 2024. Spending concentrates on single-wafer tools that deliver within-wafer non-uniformity below 1 nm and integrate closed-loop conditioning for pad surface health. The segment is forecast to rise at a 7.72% CAGR to 2030 as fabs install new platforms that support GAA processes and wide-bandgap substrates. Cleaning modules undergo concurrent upgrades to remove nanoscale defects at sub-7 nm nodes.
Consumables account for 36.83% of revenue, led by slurries whose recurring nature ensures stable demand. Silica-based dielectric slurries dominate, while niche ceria formulas address glass and sapphire polishing. Pad suppliers release grooved polymer blends that sustain consistent removal rates and minimize defectivity over extended pad life. Sustainability goals accelerate the shift to low-abrasive chemistries, positioning consumables vendors for premium pricing when performance and environmental metrics converge.
By Application: Advanced packaging captures growth
Integrated circuits retained a 65.1% share in 2024, covering front-end dielectric and metal planarization. However, advanced packaging is the fastest-growing application, expanding at an 8.17% CAGR as chiplet and 3D stack architectures demand wafer-level CMP steps for redistribution layers and interposer surfaces. Through-silicon-via formation introduces deeper features and multi-material stacks, elevating requirements for selectivity and defect suppression.
Compound semiconductors such as SiC and GaN attract specialized CMP processes with longer polish times and higher consumable spend, lifting their revenue contribution despite lower wafer volumes. MEMS and NEMS devices continue to rely on ultra-flat anchor layers that ensure mechanical performance, while emerging photonic chips add demand for scratch-free oxide polishing.
Note: Segment shares of all individual segments available upon report purchase
By End-User: OSAT providers broaden service scope
Foundries delivered 41.58% of 2024 revenue and continue to expand 300 mm capacity for sub-5 nm logic production. Yet OSAT companies exhibit the highest 8.24% CAGR as they integrate wafer-level fan-out and system-in-package offerings that incorporate multiple CMP steps. New plants in Malaysia and Arizona underline the shift toward geographically diversified advanced packaging capacity.
Integrated device manufacturers sustain steady investment to support automotive and industrial chips, especially wide-bandgap power devices. Research institutes form a niche but strategic segment that validates emerging materials and tool capabilities prior to high-volume adoption.
Geography Analysis
Asia Pacific generated 64.7% of 2024 revenue and is projected to record an 8.66% CAGR through 2030. Mainland China’s localization push prompts aggressive wafer-fab construction, while Taiwan retains leadership in cutting-edge logic and advanced packaging. South Korea invests in high-layer count 3D NAND and DRAM, boosting demand for dielectric and metal planarization capacity. Japanese suppliers leverage decades-long expertise in ultrapure chemicals and precision pads, reinforcing the region’s vertically integrated ecosystem.
North America ranks second by revenue. Federal incentives have unlocked new fab commitments, and domestic equipment leaders capture significant orders as customers prioritize secure supply chains. Advanced packaging initiatives in Arizona and New York stimulate regional demand for CMP consumables that comply with local content rules. Export controls limit high-end pad shipments to China, creating a bifurcated market and heightening strategic value for North American CMP vendors.
Europe pursues 20% global semiconductor output by 2030, emphasizing manufacturing sustainability. Regional materials firms expand electronics-grade hydrogen peroxide and specialty slurry capacity, while equipment makers in Germany and the Netherlands align CMP offerings with EU environmental directives. Government funding supports pilot lines for heterogeneous integration, driving incremental CMP tool installations across research hubs and specialty foundries.
Competitive Landscape
Equipment supply remains moderately concentrated, with Applied Materials and Lam Research commanding the majority of single-wafer CMP sales. Applied Materials posted USD 6.78 billion in fiscal Q3 2024 revenue with semiconductor systems contributing USD 4.92 billion, underscoring scale advantages in R&D and customer support. Consumables are more fragmented; DuPont, Entegris, Fujimi, and Cabot Microelectronics differentiate through chemistry innovation and pad engineering. DuPont’s Ikonic™ pads earned Samsung Electronics’ 2024 Best Partner Award, validating performance gains in next-generation planarization [4]Source: StockTitan, “DuPont Earns Best Partner Award for Innovation from Samsung Electronics,” stocktitan.net .
Start-ups pursue abrasive-free slurry chemistries that lower defectivity and waste, drawing venture capital and pilot evaluations. Chinese tool vendors target mature nodes with 300 mm batch polishers, but industry feedback notes reliability gaps at critical uniformity specs. Patent filings cluster around endpoint detection, slurry recycling, and AI-driven process control, indicating an innovation race to reduce cost per wafer while maintaining sub-1 nm planarity.
Strategic moves include new R&D centers, cross-licensing agreements, and localized manufacturing lines that satisfy regional content mandates. Partnerships between tool makers and consumable suppliers accelerate turnkey solution rollouts, especially for challenging SiC and GaN substrates. Sustainability metrics increasingly influence purchasing decisions, prompting vendors to publish lifecycle assessments and introduce water-reduction modules.
Chemical Mechanical Planarization Industry Leaders
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Applied Materials Inc.
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Entegris Inc.
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Ebara Corporation
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Lapmaster Wolters Gmbh
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Dupont De Nemours Inc.
- *Disclaimer: Major Players sorted in no particular order
Recent Industry Developments
- April 2025: DuPont's Ikonic™ 9000 series polishing pads, designed for chemical mechanical planarization (CMP), clinched the 2025 Bronze Edison Award™ in the AI-driven advancements category.
- April 2025: ChEmpower, a semiconductor materials firm specializing in polish pads and chemical solutions for planarization, successfully secured USD 18.7 million in Series A funding. This capital infusion aims to bolster its technology for cutting-edge chip manufacturing and packaging.
- March 2025: DuPont showcased Circuposit™ SAP8000 electroless copper and Microfill™ SFP-II-M chemistries for AI chip packaging at the International Electronic Circuits Exhibition 2025.
- December 2024: DuPont introduced Kalrez® bonded door seals designed to cut particle generation in CMP tools at SEMICON Southeast Asia.
Global Chemical Mechanical Planarization Market Report Scope
The market is defined by the revenue accrued from the sales of chemical mechanical polishing solutions worldwide. The study focuses on various chemical and mechanical polishing equipment and consumables. It also analyzes different trends and dynamics related to protective chemical and mechanical polishing solutions across multiple application areas and geographical regions.
The chemical mechanical planarization market is segmented by type (CMP equipment, CMP consumable [slurry, pad, pad conditioner, other consumable types]), by application (compound semiconductors, integrated circuits, MEMS and NEMS, and other applications), by geography (North America, Europe, Asia-Pacific, Latin America, and the Middle East and Africa). The report offers market forecasts and size in value (USD) for all the above segments.
| CMP Equipment | Single-Wafer CMP Systems | |
| Post-CMP Cleaning Equipment | ||
| Batch CMP Systems | ||
| Others | ||
| CMP Consumables | CMP Slurry | Silica-Based Slurry |
| Aluminum Oxide-Based Slurry | ||
| Cerium Oxide-Based Slurry | ||
| Composite/Engineered Abrasive Slurry | ||
| Other (Zirconia, Diamond, etc.) | ||
| Pads | ||
| Other Consumables (Filters, Post-CMP Clean Chemistries, etc.) | ||
| Integrated Circuit |
| Compound Semiconductor |
| MEMS and NEMS |
| Advanced Packaging |
| Other Applications |
| Foundries |
| Integrated Device Manufacturers (IDMs) |
| Outsourced Semiconductor Assembly and Test (OSAT) |
| R&D Institutes / Universities |
| North America | United States |
| Canada | |
| Mexico | |
| Europe | Germany |
| France | |
| United Kingdom | |
| Italy | |
| Rest of Europe | |
| Asia Pacific | China |
| Japan | |
| South Korea | |
| India | |
| Rest of Asia Pacific | |
| South America | Brazil |
| Argentina | |
| Rest of South America | |
| Middle East | Israel |
| Saudi Arabia | |
| United Arab Emirates | |
| Rest of Middle East | |
| Africa | South Africa |
| Egypt | |
| Rest of Africa |
| By Product Type | CMP Equipment | Single-Wafer CMP Systems | |
| Post-CMP Cleaning Equipment | |||
| Batch CMP Systems | |||
| Others | |||
| CMP Consumables | CMP Slurry | Silica-Based Slurry | |
| Aluminum Oxide-Based Slurry | |||
| Cerium Oxide-Based Slurry | |||
| Composite/Engineered Abrasive Slurry | |||
| Other (Zirconia, Diamond, etc.) | |||
| Pads | |||
| Other Consumables (Filters, Post-CMP Clean Chemistries, etc.) | |||
| By Application | Integrated Circuit | ||
| Compound Semiconductor | |||
| MEMS and NEMS | |||
| Advanced Packaging | |||
| Other Applications | |||
| By End-User | Foundries | ||
| Integrated Device Manufacturers (IDMs) | |||
| Outsourced Semiconductor Assembly and Test (OSAT) | |||
| R&D Institutes / Universities | |||
| By Geography | North America | United States | |
| Canada | |||
| Mexico | |||
| Europe | Germany | ||
| France | |||
| United Kingdom | |||
| Italy | |||
| Rest of Europe | |||
| Asia Pacific | China | ||
| Japan | |||
| South Korea | |||
| India | |||
| Rest of Asia Pacific | |||
| South America | Brazil | ||
| Argentina | |||
| Rest of South America | |||
| Middle East | Israel | ||
| Saudi Arabia | |||
| United Arab Emirates | |||
| Rest of Middle East | |||
| Africa | South Africa | ||
| Egypt | |||
| Rest of Africa | |||
Key Questions Answered in the Report
What is the projected value of the chemical mechanical planarization market in 2030?
Forecasts indicate USD 9.91 billion by 2030, reflecting a 7.42% CAGR.
Which product segment expands fastest through 2030?
Equipment grows at 7.72% CAGR as fabs adopt single-wafer polishers for GAA and 3D-IC nodes.
Who are the key players in Chemical Mechanical Planarization Slurry Market?
Applied Materials Inc., Entegris Inc., Ebara Corporation, Lapmaster Wolters Gmbh and Dupont De Nemours Inc. are the major companies operating in the Chemical Mechanical Planarization Slurry Market.
Why do OSAT providers gain CMP share?
OSAT companies add fan-out and system-in-package lines that use multiple CMP steps, driving an 8.24% CAGR.
How do slurry cost pressures influence suppliers?
Vendors lower abrasive loads, recycle chemistries, and develop alternative formulations to offset rare-earth and hydrogen-peroxide price volatility.
Which region leads CMP demand?
Asia Pacific holds 64.7% of 2024 revenue and is forecast to post the fastest 8.66% CAGR due to ongoing fab expansions.
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