Asia-pacific Electronics Adhesives Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

The market is segmented by Resin Type (Epoxy, Acrylics, Polyurethane, and Other Resin Types), Application (Conformal Coatings, Surface Mounting, Encapsulation, Wire Tacking, and Other Applications), and Geography (China, India, Japan, South Korea, ASEAN Countries, and Rest of Asia-Pacific).

Asia-Pacific Electronics Adhesives Market Size and Share

Asia-Pacific Electronics Adhesives Market - Market Summary
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Asia-Pacific Electronics Adhesives Market Analysis by Mordor Intelligence

The Asia-Pacific Electronics Adhesives Market is expected to register a CAGR of greater than 8% during the forecast period.

  • Shift towards environment-friendly water based adhesives is expected to provide a major growth opportunity for the market studied.
  • China accounted for the highest share of the market and is likely to continue dominating the market during the forecast period.
  • Among the application areas, surface mounting is expected to dominate the market during the forecast period.

Competitive Landscape

The Asia-Pacific electronics adhesives market is moderately consolidated as the market of the market share is divided among a few players. Some of the key players in the market include Henkel AG & Co. KGaA, Dow,H.B. Fuller Company, 3M, and BASF SE among others.

Asia-Pacific Electronics Adhesives Industry Leaders

  1. Henkel AG & Co. KGaA

  2. Dow

  3. H.B. Fuller Company

  4. 3M

  5. BASF SE

  6. *Disclaimer: Major Players sorted in no particular order
Asia-Pacific Electronics Adhesives Market - Market Concentration.png
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Table of Contents for Asia-Pacific Electronics Adhesives Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS

  • 4.1 Drivers
    • 4.1.1 Growing Technological Advancements in Manufacturing Electronic Adhesives
    • 4.1.2 Other Drivers
  • 4.2 Restraints
    • 4.2.1 Volatility in Raw Material Prices
    • 4.2.2 Regulations Related to the VOCs
    • 4.2.3 Other Restraints
  • 4.3 Industry Value-chain Analysis
  • 4.4 Porter's Five Forces Analysis
    • 4.4.1 Bargaining Power of Suppliers
    • 4.4.2 Bargaining Power of Consumers
    • 4.4.3 Threat of New Entrants
    • 4.4.4 Threat of Substitute Products and Services
    • 4.4.5 Degree of Competition

5. MARKET SEGMENTATION

  • 5.1 Resin Type
    • 5.1.1 Epoxy
    • 5.1.2 Acrylics
    • 5.1.3 Polyurethane
    • 5.1.4 Other Resin Types
  • 5.2 Application
    • 5.2.1 Conformal Coatings
    • 5.2.2 Surface Mounting
    • 5.2.3 Encapsulation
    • 5.2.4 Wire Tacking
    • 5.2.5 Other Applications
  • 5.3 Geography
    • 5.3.1 Asia-Pacific
    • 5.3.1.1 China
    • 5.3.1.2 India
    • 5.3.1.3 Japan
    • 5.3.1.4 South Korea
    • 5.3.1.5 ASEAN Countries
    • 5.3.1.6 Rest of Asia-Pacific

6. COMPETITIVE LANDSCAPE

  • 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
  • 6.2 Market Share/Ranking Analysis**
  • 6.3 Strategies Adopted by Leading Players
  • 6.4 Company Profiles
    • 6.4.1 3M
    • 6.4.2 Arkema
    • 6.4.3 Ashland
    • 6.4.4 AVERY DENNISON CORPORATION
    • 6.4.5 BASF SE
    • 6.4.6 Beardow Adams
    • 6.4.7 CHEMENCE
    • 6.4.8 Covestro AG
    • 6.4.9 Dow
    • 6.4.10 H.B. Fuller Company
    • 6.4.11 Henkel AG & Co. KGaA
    • 6.4.12 Huntsman International LLC.
    • 6.4.13 Sika AG
    • 6.4.14 Illinois Tool Works Inc.
  • *List Not Exhaustive

7. MARKET OPPORTUNITIES AND FUTURE TRENDS

  • 7.1 Shift Towards Environment-friendly Water-based Adhesives
**Subject to Availability
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Asia-Pacific Electronics Adhesives Market Report Scope

The Asia-Pacific electronics adhesives market report include: 

Resin Type
Epoxy
Acrylics
Polyurethane
Other Resin Types
Application
Conformal Coatings
Surface Mounting
Encapsulation
Wire Tacking
Other Applications
Geography
Asia-Pacific China
India
Japan
South Korea
ASEAN Countries
Rest of Asia-Pacific
Resin Type Epoxy
Acrylics
Polyurethane
Other Resin Types
Application Conformal Coatings
Surface Mounting
Encapsulation
Wire Tacking
Other Applications
Geography Asia-Pacific China
India
Japan
South Korea
ASEAN Countries
Rest of Asia-Pacific
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Key Questions Answered in the Report

What is the current Asia-Pacific Electronics Adhesives Market size?

The Asia-Pacific Electronics Adhesives Market is projected to register a CAGR of greater than 8% during the forecast period (2025-2030)

Who are the key players in Asia-Pacific Electronics Adhesives Market?

Henkel AG & Co. KGaA, Dow, H.B. Fuller Company, 3M and BASF SE are the major companies operating in the Asia-Pacific Electronics Adhesives Market.

What years does this Asia-Pacific Electronics Adhesives Market cover?

The report covers the Asia-Pacific Electronics Adhesives Market historical market size for years: 2019, 2020, 2021, 2022, 2023 and 2024. The report also forecasts the Asia-Pacific Electronics Adhesives Market size for years: 2025, 2026, 2027, 2028, 2029 and 2030.

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Asia-Pacific Electronics Adhesives Market Report

Statistics for the 2025 Asia-Pacific Electronics Adhesives market share, size and revenue growth rate, created by Mordor Intelligence™ Industry Reports. Asia-Pacific Electronics Adhesives analysis includes a market forecast outlook for 2025 to 2030 and historical overview. Get a sample of this industry analysis as a free report PDF download.

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