Semiconductor Wafer Polishing and Grinding Equipment Market Size (2024 - 2029)

The market size of the semiconductor wafer polishing and grinding equipment is anticipated to grow due to its crucial role in the fabrication of semiconductor devices. The rising demand in various sectors such as MEMS, IC manufacturing, optics, and compound semiconductors is expected to stimulate the market growth. The need for advanced grinding and polishing machinery is continually increasing because of their usage in various electronic devices. Additionally, the trend towards miniaturization in electronics, which requires thinner, low-power consuming wafers, is likely to drive advancements in this market. Despite the challenges posed by the Covid-19 pandemic and the advent of etching techniques, the digitalization trend is expected to positively impact the market size in the future.

Market Size of Semiconductor Wafer Polishing and Grinding Equipment Industry

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Semiconductor Wafer Polishing and Grinding Equipment Market Summary
Study Period 2019 - 2029
Base Year For Estimation 2023
CAGR 4.10 %
Fastest Growing Market Asia Pacific
Largest Market North America
Market Concentration Medium

Major Players

Semiconductor Wafer Polishing and Grinding Equipment Market Major Players

*Disclaimer: Major Players sorted in no particular order

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Semiconductor Wafer Polishing and Grinding Equipment Market Analysis

The semiconductor wafer polishing and grinding equipment market is expected to register a CAGR of 4.1% during the forecast period. Wafer grinding and polishing processes form a vital step in the fabrication of semiconductor devices.

  • The increasing demand in MEMS, IC manufacturing, optics, and compound semiconductors will boost the planarization in semiconductor devices. In the current market scenario, as almost all electronic devices, including laptops, smartphones, computers, etc., make use of Silicon ICs and other wafer-dependent packages, the demand for advanced grinding and polishing machinery is always on the rise.
  • According to SEMI, silicon wafer shipments across the world in the second quarter of 2022 saw a 5% growth reaching 3,704 million square inches from 3,534 million square inches reported during the same quarter in the previous year. Such a market scenario is expected to unlock several new opportunities for the market in the near future.
  • Further, the growing need for miniaturization in electronics (due to the demand for thinner wafers that consume low power) is expected to drive some advancements in the semiconductor wafer polishing and grinding equipment market over the forecast period.
  • However, the recent advancements in etching, which offer more advantages compared to polishing techniques, are affecting the demand for polishing machinery. Moreover, the removal of partial defects through polishing with traditional CMP (chemical-mechanical-polishing) technology preserves the surface profile, making it extremely difficult for manufacturers and service providers involved in wafer reclaim activities.
  • Covid-19 significantly disrupted the supply chain and production of semiconductors worldwide, especially in China, during the initial phase of 2020. However, the rising trends of digitalization due to the pandemic have increased the demand for semiconductor components, which is expected to have a positive impact on the market going forward.

Semiconductor Wafer Polishing and Grinding Equipment Industry Segmentation

Grinding and polishing are significant components of the semiconductor wafer fabrication process. They are often dependent on end-user customization and packaging requirements. Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damage-free surface. However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device to overcome the drawbacks of performing these operations separately, and any grinding method causes particular damage to the wafer.

The Semiconductor Wafer Polishing and Grinding Equipment Market is Segmented by Geography (North America, Europe, Asia Pacific, Rest of the World). The market sizes and forecasts are provided in terms of value (USD million) for the above segments.

Geography
North America
Europe
Asia Pacific
Rest of the World

Semiconductor Wafer Polishing and Grinding Equipment Market Size Summary

The semiconductor wafer polishing and grinding equipment market is poised for growth, with a projected CAGR of 4.1% in the forecast period. This growth is largely driven by the increasing demand in MEMS, IC manufacturing, optics, and compound semiconductors, which are crucial for the fabrication of electronic devices such as laptops, smartphones, and computers. The market is also expected to benefit from the growing need for miniaturization in electronics, necessitating the production of thinner, low power-consuming wafers. However, the market faces challenges from advancements in etching techniques, which offer more advantages compared to polishing techniques. Market trends indicate a positive impact from the growing consumption of consumer electronics. Technological advancements in these devices, including the development of smart home devices and wearables, are driving the need for small integrated circuits, thereby fueling the demand for wafer polishing and grinding equipment. Additionally, the increasing number of Internet of Things (IoT) devices is expected to spur investment in this equipment. The market is also influenced by the emergence of electronic innovations that are more powerful yet lighter in weight, necessitating smaller, tightly packed semiconductors.

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Semiconductor Wafer Polishing and Grinding Equipment Market Size - Table of Contents

  1. 1. MARKET DYNAMICS

    1. 1.1 Market Overview

    2. 1.2 Industry Attractiveness - Porter's Five Forces Analysis

      1. 1.2.1 Threat of New Entrants

      2. 1.2.2 Bargaining Power of Buyers

      3. 1.2.3 Bargaining Power of Suppliers

      4. 1.2.4 Threat of Substitute Products

      5. 1.2.5 Intensity of Competitive Rivalry

    3. 1.3 Industry Value Chain Analysis

    4. 1.4 Assessment of COVID-19 impact on the industry

    5. 1.5 Market Drivers

      1. 1.5.1 Growing Consumption of Consumer Electronics

      2. 1.5.2 Increasing Need for Miniaturization of Semiconductors

    6. 1.6 Market Challenges

      1. 1.6.1 Complexity Regarding Manufacturing

  2. 2. MARKET SEGMENTATION

    1. 2.1 Geography

      1. 2.1.1 North America

      2. 2.1.2 Europe

      3. 2.1.3 Asia Pacific

      4. 2.1.4 Rest of the World

Semiconductor Wafer Polishing and Grinding Equipment Market Size FAQs

The Semiconductor Wafer Polishing and Grinding Equipment Market is projected to register a CAGR of 4.10% during the forecast period (2024-2029)

Applied Materials Inc., Ebara Corporation, Disco Corporation, Tokyo Seimitsu Co. Ltd. (Accretech Create Corp.) and Revasum Inc. are the major companies operating in the Semiconductor Wafer Polishing and Grinding Equipment Market.

Semiconductor Wafer Polishing and Grinding Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)