Asia-Pacific PU Hot-Melt Adhesives Market - Segmented by Type, Application, and Geography - Growth, Trends, and Forecast (2020 - 2025)

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The Asia-Pacific PU hot-melt adhesives market is expected to register a CAGR of 9.13% during the forecast period, 2018 to 2023. China is estimated to lead the market due to the rapid increase in its Packaging and Electronics Industries. The electronics segment is expected to be the fastest growing segment by application.

Growing Demand from Packaging and Electronics Industry

The demand for PU hot-melt adhesives is consistently increasing in Asia-Pacific due to the rapid growth in the packaging and electronics segment. The demand for packaging has been steadily increasing in the Asia-Pacific region, especially in countries, such as India, China, among other South Asian countries, due to a steady growth in the food-processing sector. Additionally, the rise in work pressure and consumer shift towards modern lifestyle food-needs is increasing the demand for packaged foods, in turn, boosting the demand for PU hot melt adhesives in the packaging sector. The demand for PU hot-melt adhesives is further propelled in Asia-Pacific, as this region is gradually becoming the global electronics-manufacturing hub. In addition, PU hot-melts are also used in telecommunication equipment, such as, electronic components and cell phones, due to their properties like oxidation and temperature resistance. Currently, most electronics manufacturers are outsourcing their production to low-cost countries in Asia, especially China, Taiwan, and other South-East ASEAN countries.

Electronics - The Fastest Growing Application

PU hot-melt adhesives find applications in various electronics, including adhesives for touch panels, structural bonding, and other bonding requirements. They are used in various consumer electronics, such as, smart watches, laptops, structural components and touch panels of smartphones and other applications, demanding fast curing speed for the fast production line. The non-hazardous, fast curing, and flexible solvent-free PU hot-melt adhesives are utilized for bonding insulated panel materials. PU hot-melts offers solutions that are also used in the coating of insulating materials, for securing electrical components against vibration, and for fixing electronic modules on circuit boards. The miniaturization trend in electronics, such as, the system-on-chip (SoC) technology, is boosting the demand  for PU hot-melt adhesives, where it is used in anti-vibration shock mounting of circuit boards (as it is well suited for metal and engineered plastics bonding applications, where shock and impact resistance is required). Most electronic and automated assembly lines benefit from a fast-curing adhesive that don’t require drying time or measuring, and bonds, regardless of temperature swings or contact with water. These adhesives can replace conventional screws and clips that once held together many electronic products, like mobile phones, mp3 players, and hand-held medical devices, making them smaller and more durable than ever.

China to Lead the Market

China is globally recognized for its architectural boom. The demand for low-cost housing and commercial housing is the reason for its growth in the recent years. China’s real estate sector has been growing rapidly with increased investment from the government. China’s transport ministry and National Development and Reform Commission (NDRC) planned to invest 724 Billion USD between 2016-2018 for constructing 303 key transportation projects which include railways, highways, waterways, airports, and urban rail. Under the 13th five year plan (2016-2020), the Chinese government is planning infrastructure development of 30,000 km of railway lines and 30,000 km of expressways. The production of light vehicles in China recorded a growth of 1.6% YOY, reaching a total of 24,806,687 units in 2017. The production of trucks in China recorded a growth of 28.5% YOY, reaching a total of 2,257,562 units in 2017. In 2017, the healthcare expenditure in the country increased, as the fiscal spending increased by 10% year-on-year to reach CNY 1.31 billion. All these factors would rapidly drive the market for PU hot-melt adhesives in China in the forecast period (2018-2023).

Notable Developments in the Market

  • October 2017: H.B. Fuller’s finalized its acquisition of Royal Adhesives & Sealants for USD 1.575 billion. This acquisition is likely to deepen H.B. Fuller’s expertise in a range of sectors, such as medical, electronics, hygiene, transportation, construction, clean energy, and others.

Major Players: Henkel AG, HB Fuller, Arkema, Sika AG, and 3M, among others.

Reasons to Purchase the Report

  • To understand the impact of applications on the market
  • Analyzing various perspectives of the market with the help of Porter’s five forces analysis
  • To understand the dominating type in the market
  • Countries expected to witness the fastest growth during the forecast period
  • Identify the latest developments, market shares, and strategies employed by the major market players
  • 3 months of analyst support, along with the Market Estimate sheet (in excel)

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