Hong Kong Data Center Cooling Market Size & Share Analysis - Growth Trends & Forecasts (2025 - 2030)

Hong Kong Data Center Cooling Market is Segmented by Data Center Type (Hyperscalers (owned and Leased), Enterprise and Edge, Colocation), Tier Type (Tier 1 and 2, Tier 3, Tier 4), Cooling Technology (Air Based Cooling, Liquid Based Cooling), Component (Service, Equipment). The Market Forecasts are Provided in Terms of Value (USD).

Hong Kong Data Center Cooling Market Size and Share

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Hong Kong Data Center Cooling Market Analysis by Mordor Intelligence

The Hong Kong data center cooling market size stands at USD 158.28 million in 2025 and is forecast to reach USD 398.3 million by 2030, reflecting a 20.2% CAGR over the period. This sustained expansion positions the Hong Kong data center cooling market as one of the fastest-growing country-level cooling arenas worldwide, supported by submarine-cable connectivity that anchors hyperscale deployments, an aggressive artificial-intelligence build-out, and regulatory incentives linked to carbon-neutrality goals. Hyperscale operators account for the bulk of new capacity additions, and their preference for rack densities above 30 kW accelerates the shift toward liquid technologies that outperform conventional computer-room air handlers (CRAH) and chiller loops. Cooling project timelines now intersect tightly with power allocation from CLP Power and HK Electric, forcing operators to prioritize solutions that keep power usage effectiveness (PUE) at or below 1.4. Competitive differentiation has therefore moved from basic availability to cooling efficiency, reliability in typhoon-exposed coastal zones, and the ability to integrate with district-cooling or heat-reuse schemes. Looking ahead, the Hong Kong data center cooling market is expected to balance a legacy air-cooling installed base with direct-to-chip cold plates, rear-door heat exchangers, and two-phase immersion environments that address forthcoming AI training clusters.

Key Report Analysis

  • By data center type, hyperscalers led with 45.6% of the Hong Kong data center cooling market share in 2024, while the same segment is projected to compound at 20.7% through 2030.
  • By tier classification, Tier 3 facilities retained 63.2% revenue share in 2024, whereas Tier 4 builds are set to advance at a 21.2% CAGR to 2030.
  • By cooling technology, air-based solutions commanded 66.1% share of the Hong Kong data center cooling market size in 2024, with liquid systems advancing at a 21.3% CAGR over the forecast period.
  • By component, equipment accounted for 78.4% of the Hong Kong data center cooling market size in 2024, whereas services represent the fastest-growing piece at a 20.4% CAGR. 

Segment Analysis

By Data Center Type: Hyperscalers Drive Liquid Cooling Innovation

Hyperscalers accounted for a 45.6% Hong Kong data center cooling market share in 2024, and their planned expansions position the segment to post a 20.7% CAGR through 2030. These large builds incorporate dedicated chilled-water loops for AI zones, rear-door heat-exchanger rows for general compute, and immersion pods for training clusters. The Hong Kong data center cooling market must therefore supply modular pumping skids, quick-disconnect manifolds, and rack-level coolant distribution units that allow phased deployment without production outages. 

Enterprise and edge facilities trail in absolute spend yet experiment with hybrid solutions that couple aisle-containment airflows with localized liquid loops for GPU racks. This mixed adoption demonstrates how hyperscale standards cascade down the ecosystem: once supply chains for cold plates, leak-sealed hoses, and fluid sensors mature, total-cost-of-ownership curves converge, prompting second-tier operators to adopt similar architectures. Consequently, consultancy firms report a surge in design-build inquiries that reference hyperscale specification sheets as de-facto industry baselines.

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Note: Segment shares of all individual segments available upon report purchase

By Tier Type: Tier 4 Facilities Embrace Advanced Cooling

Tier 3 sites owned 63.2% of the Hong Kong data center cooling market size in 2024, anchored by legacy builds that prioritize predictable PUE outcomes over redundancy. Tier 4 pipelines, however, are projected to climb at 21.2% CAGR, reflecting demand for 99.995% uptime that necessitates N+N cooling redundancy with dual chilled-water headers, isolated containment zones, and emergency heat-rejection modules. 

The stringent approval cycle—often 24 months for fire-safety, structural, and power-interface reviews—rewards designs that reuse validated component lists, further channeling procurement toward multinational vendors with documented reliability records. Tier 1 and Tier 2 footprints remain cost-focused, selecting high-COP air-handling units over immersion setups, yet even these facilities now reserve floor space for future liquid skids, indicating the pervasive influence of higher-tier resilience metrics.

By Cooling Technology: Liquid Solutions Gain Momentum

Air-based cooling maintained 66.1% revenue within the Hong Kong data center cooling market in 2024, but liquid solutions headline the growth story with a 21.3% forward CAGR. Direct-to-chip plates transport heat loads exceeding 350 W per processor while returning coolant at 45 °C, a parameter that unlocks heat-reuse loops for domestic-hot-water or district-cooling tie-ins. Immersion baths, meanwhile, remove up to 200 kW per rack, reshaping white-space ceiling heights, fire-suppression layouts, and raised-floor grid densities. 

Legacy chillers and CRAH rows are not disappearing overnight. Instead, operators layer liquid circuits onto existing plant rooms, creating hybrid arrays where air handles baseline IT loads and liquid loops intercept AI blades. Such dual-path architectures help mitigate downtime risks during technology migration, a factor driving procurement managers to favor vendor-agnostic manifolds and quick-swap cold plates.

Hong Kong Data Center Cooling Market:
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By Component: Services Segment Accelerates Growth

Equipment purchases represented 78.4% of the Hong Kong data center cooling market size in 2024, spanning chillers, pumps, dry-coolers, containment panels, and control systems. Nevertheless, the services slice is projected to grow at 20.4% CAGR as complexity rises. Design-assist engagements now cover CFD simulations for multi-storey airflow, fluid-compatibility testing for dielectric media, and digital-twin modeling for predictive maintenance. 

Maintenance contracts expand to fluid sampling, particulate filtration, and leak-alarm calibration that differ markedly from filter-change routines in air systems. Vendor training academies supply immersion-specific certifications to mitigate the labour shortage. Additionally, performance-based service level agreements link fees to achieved PUE or water-usage effectiveness targets, effectively converting service providers into risk-sharing partners.

Hong Kong Data Center Cooling Market
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Geography Analysis

Hong Kong’s Tseung Kwan O district concentrates more than one-third of active server halls, clustering around dual cable stations and district-cooling conduits that feed adjacent industrial plots. The supply pipeline is set to rise from 317 MW in 2023 to about 700 MW by 2028, doubling the cooling load requirement. This escalation cements the Hong Kong data center cooling market as a cornerstone infrastructure layer for the Greater Bay digital-economy blueprint. 

Coastal exposure introduces typhoon-induced salt-spray corrosion that shortens condenser-coil lifecycles. Operators respond with epoxy-coated tube sheets, seawater-compatible titanium plates, and hurricane-rated louver systems. Simultaneously, seawater-intake pilots in Kai Tak and Tseung Kwan O illustrate how large delta-T loops can leverage ambient water at 23 °C, reducing tower plume drift and trimming make-up water consumption. 

Vertical data-center designs, necessitated by land scarcity, pose intricate coolant-distribution challenges. Engineers deploy risers with pressure-independent balancing valves and branch isolation headers every two floors to control column height pressure drops. The Hong Kong data center cooling market, therefore, now incorporates seismic snubbers, quick-close dampers, and redundancy logic that addresses both vertical stacking and seismic considerations.

Competitive Landscape

The Hong Kong data center cooling market is moderately fragmented. Schneider Electric, Vertiv, Carrier, and Johnson Controls anchor the air-cooling incumbency, while LiquidStack and ZutaCore spearhead immersion and direct-to-chip niches. LiquidStack’s Hong Kong pod achieved PUE 1.01 in 2024, setting a regional benchmark. Schneider countered by acquiring Motivair, embedding coolant distribution units into its Galaxy power-train line, and offering turnkey liquid blocks that interlock with EcoStruxure monitoring. 

Strategic alliances between cooling OEMs and GPU vendors define the next phase of competition. Carrier’s investment in ZutaCore aligns its QuantumLeap chiller program with cold-plate loops optimized for 800 W processors, giving hyperscale prospects an integrated roadmap. Vertiv collaborates with NVIDIA on reference architectures that position CoolLoop skids directly beneath SXM-based AI racks, lowering rack-to-cooling latency and improving thermal excursion response times. 

Edge-cooling remains a white-space segment. Start-ups promote micro-modular immersion tanks for 5G roadside shelters, while established vendors trial refrigerant-based pumped loops that eschew water entirely. Competitive intensity therefore pivots on breadth of technology portfolio, channel support for retrofit services, and access to sustainable coolant chemistries.

Hong Kong Data Center Cooling Industry Leaders

  1. Schneider Electric SE

  2. Vertiv Holdings Co

  3. Huawei Technologies Co Ltd

  4. LiquidStack Holding BV

  5. Stulz GmbH

  6. *Disclaimer: Major Players sorted in no particular order
Hong Kong Data Center Cooling Market Concentration
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Recent Industry Developments

  • June 2025: Chemours and Navin Fluorine agreed to manufacture Opteon two-phase immersion fluid, targeting 40% energy reductions in AI halls.
  • May 2025: BDx secured financing for its next Hong Kong module, underlining sustained investor confidence.
  • March 2025: Johnson Electric held an AI cooling forum in Hong Kong to showcase DCP liquid pumps rated for PUE greater than 1.2.
  • March 2025: Trane released magnetic-bearing chillers up to 850 tons that suit high-ambient Hong Kong summers.

Table of Contents for Hong Kong Data Center Cooling Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Strong hyperscale pipeline backed by HK�s submarine-cable connectivity
    • 4.2.2 Soaring rack densities from AI clusters (greater than 30 kW/rack) accelerate liquid cooling adoption
    • 4.2.3 Mandatory green lease clauses from top colocation landlords
    • 4.2.4 Governments 2050 carbon-neutral roadmap incentivises greater than or equal to 1.4 PUE facilities
    • 4.2.5 Under-sea-water heat-exchange pilots in Tseung Kwan O and Kai Tak DCS
    • 4.2.6 Re-use-heat projects for district cooling in Kai Tak and Northern Metropolis
  • 4.3 Market Restraints
    • 4.3.1 Scarcity and high cost of power feeders from CLP and HK Electric
    • 4.3.2 18-24 month land-use approvals for Tier IV buildings
    • 4.3.3 Typhoon-driven salt-spray corrosion of rooftop chillers
    • 4.3.4 Limited qualified labour for immersion-ready white-space retrofits
  • 4.4 Supply-Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Industry Ecosystem Analysis
  • 4.8 Porter's Five Forces
    • 4.8.1 Bargaining Power of Suppliers
    • 4.8.2 Bargaining Power of Buyers
    • 4.8.3 Threat of New Entrants
    • 4.8.4 Threat of Substitutes
    • 4.8.5 Degree of Competition
  • 4.9 Assesment of Macroeconomic Factors on the Market

5. MARKET SIZE and GROWTH FORECASTS (VALUE)

  • 5.1 By Data Center Type
    • 5.1.1 Hyperscalers (owned and Leased)
    • 5.1.2 Enterprise and Edge
    • 5.1.3 Colocation
  • 5.2 By Tier Type
    • 5.2.1 Tier 1 and 2
    • 5.2.2 Tier 3
    • 5.2.3 Tier 4
  • 5.3 By Cooling Technology
    • 5.3.1 Air-based Cooling
    • 5.3.1.1 Chiller and Economizer (DX Systems)
    • 5.3.1.2 CRAH
    • 5.3.1.3 Cooling Tower (covers direct, indirect and two-stage cooling)
    • 5.3.1.4 Others
    • 5.3.2 Liquid-based Cooling
    • 5.3.2.1 Immersion Cooling
    • 5.3.2.2 Direct-to-Chip Cooling
    • 5.3.2.3 Rear-Door Heat Exchanger
  • 5.4 By Component
    • 5.4.1 By Service
    • 5.4.1.1 Consulting and Training
    • 5.4.1.2 Installation and Deployment
    • 5.4.1.3 Maintenance and Support
    • 5.4.2 By Equipment

6. COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Schneider Electric SE
    • 6.4.2 Vertiv Holdings Co
    • 6.4.3 Huawei Technologies Co Ltd
    • 6.4.4 LiquidStack Holding BV
    • 6.4.5 Stulz GmbH
    • 6.4.6 Airedale International Air-Conditioning Ltd
    • 6.4.7 Johnson Controls International plc
    • 6.4.8 Munters Group AB
    • 6.4.9 Rittal GmbH and Co KG
    • 6.4.10 Fujitsu General Ltd
    • 6.4.11 Legrand SA
    • 6.4.12 Newtech Group (HK)
    • 6.4.13 OneAsia Network Ltd
    • 6.4.14 Delta Electronics Inc
    • 6.4.15 Trane Technologies plc
    • 6.4.16 Daikin Industries Ltd
    • 6.4.17 Green Revolution Cooling Inc
    • 6.4.18 CoolIT Systems Inc
    • 6.4.19 Asperitas BV
    • 6.4.20 Submer Technologies SL
    • 6.4.21 Global Switch Holdings Ltd
    • 6.4.22 Eaton Corp plc
    • 6.4.23 Star Cooling Towers Ltd
    • 6.4.24 3M (Fluorinated Fluids)

7. MARKET OPPORTUNITIES and FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment
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Hong Kong Data Center Cooling Market Report Scope

Data center cooling is a system that helps maintain optimal operating temperatures in data center environments. It is critical, as data center facilities house many computer servers and network equipment that generate heat during operation. Efficient cooling systems are used to dissipate this heat and prevent equipment from overheating, ensuring continued reliable operation of the data center. Methods such as air conditioning, liquid cooling, and hot/cold aisle containment are commonly used to control temperature and humidity in data centers.

The Hong Kong data center cooling market is segmented by technology (air-based cooling [chiller and economizer, CRAH, cooling towers, and other air-based cooling technologies] and liquid-based cooling [immersion cooling, direct-to-chip cooling, and rear-door heat exchanger]), type of data center (hyperscale, enterprise, and colocation), and end-user industry (it and telecom, retail and consumer goods, healthcare, media and entertainment, federal and institutional agencies, and other end-user industries). The report offers market sizes and forecasts in terms of value (USD) for the above segments.

By Data Center Type Hyperscalers (owned and Leased)
Enterprise and Edge
Colocation
By Tier Type Tier 1 and 2
Tier 3
Tier 4
By Cooling Technology Air-based Cooling Chiller and Economizer (DX Systems)
CRAH
Cooling Tower (covers direct, indirect and two-stage cooling)
Others
Liquid-based Cooling Immersion Cooling
Direct-to-Chip Cooling
Rear-Door Heat Exchanger
By Component By Service Consulting and Training
Installation and Deployment
Maintenance and Support
By Equipment
By Data Center Type
Hyperscalers (owned and Leased)
Enterprise and Edge
Colocation
By Tier Type
Tier 1 and 2
Tier 3
Tier 4
By Cooling Technology
Air-based Cooling Chiller and Economizer (DX Systems)
CRAH
Cooling Tower (covers direct, indirect and two-stage cooling)
Others
Liquid-based Cooling Immersion Cooling
Direct-to-Chip Cooling
Rear-Door Heat Exchanger
By Component
By Service Consulting and Training
Installation and Deployment
Maintenance and Support
By Equipment
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Key Questions Answered in the Report

What is the current value of the Hong Kong data center cooling market?

The market is valued at USD 158.28 million in 2025 and is forecast to reach USD 398.3 million by 2030.

Which cooling technology is growing fastest?

Liquid cooling, encompassing direct-to-chip and immersion solutions, is projected to grow at a 21.3% CAGR to 2030 as AI rack densities exceed 30 kW.

Why are PUE targets important in Hong Kong?

Government carbon-neutral policies tie utility incentives and approval timelines to PUE thresholds of 1.4 or lower, making efficient cooling a compliance and cost priority.

Which data center tier segment shows the highest growth potential?

Tier 4 facilities are expected to post a 21.2% CAGR through 2030 due to demand for 99.995% uptime and redundant cooling paths.

Hong Kong Data Center Cooling Market Report Snapshots