Hermetic Packaging Market Size and Share

Hermetic Packaging Market (2025 - 2030)
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Hermetic Packaging Market Analysis by Mordor Intelligence

The hermetic packaging market size stood at USD 4.15 billion in 2025 and is projected to reach USD 5.82 billion by 2030, reflecting a 7.02% CAGR throughout the forecast period. Escalating demand for fault-tolerant electronics in aerospace updates, 5G base-station rollouts, and high-density electric-vehicle sensors is shifting volumes from legacy defense procurements toward high-throughput commercial lines. Device designers are tightening helium-leak limits to the 1 × 10⁻⁹ atm-cc-s threshold, which privileges ceramic-to-metal seals over glass-to-metal interfaces in automotive safety actuators. Pressed-ceramic carriers optimized for quantum-computing cryostats and millimeter-wave radar modules are capturing new sockets that traditionally defaulted to metal cans. Meanwhile, defense primes and medical-device OEMs continue to lock in multiyear supply agreements to mitigate raw-glass and kovar-alloy bottlenecks that emerged in 2024.

Key Report Takeaways

  • By configuration, metal cans accounted for 38.43% of the hermetic packaging market share in 2024, whereas pressed-ceramic formats are expected to advance at an 8.43% CAGR through 2030.
  • By type, ceramic-to-metal sealing held 28.43% of the hermetic packaging market share in 2024 and is forecast to expand at an 8.23% CAGR.
  • By application, photodiodes led the hermetic packaging market with 24.77% of the market share in 2024, while MEMS switches represented the fastest-growing niche at a 9.43% CAGR from 2024 to 2030.
  • By end-user, the automotive sector accounted for 32.43% of the hermetic packaging market share in 2024; however, the aerospace and defense sector is expected to post the highest CAGR of 9.23% across the outlook window.
  • By geography, North America contributed 40.1% of the revenue in 2024, although the Asia-Pacific region is projected to register a 9.01% CAGR, thanks to the acceleration of 5G and EV supply-chain localization.

Segment Analysis

By Configuration: Pressed-Ceramic Packages Capture Quantum and RF Growth

Pressed-ceramic formats are projected to clock an 8.43% CAGR from 2025 to 2030 as quantum processors and millimeter-wave front-ends migrate toward low-outgassing substrates that stabilize electrical parameters below 100 millikelvin. Pressed ceramics accounted for 21% of the hermetic packaging market size in 2024, narrowing the historic gap with metal cans.

IBM’s 1,121-qubit Condor processor demonstrates that a single pressed-ceramic carrier can host high-density superconducting routing while meeting a 1 × 10⁻¹⁰ atm-cc-s leak limit. Satellite OEMs favor the same technology for compact chip-on-board assemblies that shave mass by 35% compared with TO-style cans. Automotive radar modules operating at 77 GHz integrate ceramic heat spreaders to dissipate heat, thereby raising demand among tier-one suppliers in Germany and Japan. Although multilayer-ceramic packages still dominate Ka-band payloads, their multi-co-fired fabrication stretches lead times beyond 12 weeks, prompting designers to pivot toward single-fire pressed options. As defense primes localize supply chains, U.S. and South Korean fabs are installing new sintering furnaces that raise pressed-ceramic throughput to 25 million units annually.

Hermetic Packaging Market: Market Share by Configuration
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By Type: Ceramic-to-Metal Sealing Strengthens Harsh-Environment Foothold

Ceramic-to-metal seals captured 28.43% of the revenue in 2024 and are projected to grow at an 8.23% CAGR, outpacing glass-to-metal alternatives as OEMs seek to achieve coefficient of thermal expansion parity under -40 °C to +150 °C cycles. Ceramic-to-metal devices represented 18% of the hermetic packaging market size for airbag ignitors in 2024, and their share is poised to rise as European safety regulators increase deployment-reliability thresholds.

Modern kovar-sheathed feedthroughs withstand mechanical shock at 40,000 g, a specification that is challenging to meet with glass interfaces, which can microcrack during automotive cold soak. Medical-device makers still specify borosilicate glass for titanium housings, but are increasingly trialing thin-film alumina inserts to lower X-ray attenuation in MRI-compatible implants. Reed-glass and transponder-glass segments remain small, serving magnetic switches and livestock RFID tags where unit economics outweigh the need for extreme reliability. Passivation glass overcoats on analog die curb mobile-ion drift, yet they supplement rather than replace ceramic lids in petrochemical plant controllers. The competitive field, therefore, concentrates on high-yield ceramic-to-metal brazing lines capable of 180 ppm part-per-million leak performance under helium bombing.

By Application: MEMS Switches Accelerate on 5G Beam-Forming Demands

MEMS RF switches are on track for a 9.43% CAGR, the quickest among application clusters, as 5G massive-MIMO antennas adopt electrostatically actuated relays that deliver sub-0.2 dB insertion loss. MEMS devices accounted for 12% of the hermetic packaging market share in 2024, and design wins at Chinese and U.S. base-station makers suggest a double-digit share by 2030.

Photodiodes still account for 24.77% of 2024 revenue, thanks to the hyperscale move toward 800 GbE optical links, where indium-gallium-arsenide detectors must remain stable in 85 °C data center aisles. VCSEL and DFB laser diodes require hermetic lids to prevent facet oxidation, thereby preserving a 250-mW output over a 25,000-hour service life. High-G shock sensors on oil-drill heads rely on robust sealing to maintain calibration in environments containing hydrogen sulfide. Airbag ignitors continue to ship in the hundreds of millions, but volume growth is moderating as mature markets plateau light-vehicle production. Overall demand patterns imply widening diversity rather than single-segment dominance, a trend that rewards suppliers with broad design libraries.

Hermetic Packaging Market: Market Share by Application
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By End-User Industry: NewSpace Drives a Shift Toward Defense-Grade Volumes

The automotive sector maintained a 32.43% revenue share in 2024, while the aerospace and defense sector is expected to register the fastest growth of 9.23% CAGR, as thousands of low-orbit satellites require radiation-hardened modules that can operate beyond 15 years without onsite servicing. The hermetic packaging market size for satellite electronics approached USD 810 million in 2025, underpinned by the Starlink fleet surpassing 5,000 active spacecraft.

Electric-vehicle makers remain vital, but their average sensor count plateaus once Level-3 autonomy stabilizes. Medical-implant consumption rises steadily with demographic aging in OECD nations, while petrochemical and energy producers add down-hole pressure and temperature probes that must withstand temperatures of up to 175 °C for 10,000 hours. Industrial automation segments adopt hermetically sealed encoders to avert coolant ingress on CNC machinery. These overlapping demand waves diversify revenue sources, cushioning suppliers from cyclical shocks in any single domain.

Geography Analysis

North America retained 40.1% of global revenue in 2024, anchored by defense primes, cardiac-device OEMs, and legacy aerospace corridors from California to Florida. The United States Department of Defense earmarked USD 33.9 billion for space-system procurements in fiscal 2025, funneling orders to hermetic providers qualified under MIL-STD-883 and AS9100. Boston Scientific, Abbott, and Medtronic shipped more than 2 million implantable devices from their regional plants, thereby preserving domestic demand even as some consumables are shifted offshore. Canadian satellite suppliers contribute high-density feedthrough assemblies for the Lightspeed constellation, while Mexican maquiladoras manufacture airbag ignitors that supply platforms in Detroit. A culture of design for reliability keeps unit margins above global averages, ensuring North American fabs operate at favorable capacity utilization.

Asia-Pacific is poised for a 9.01% CAGR between 2025 and 2030, outstripping every other region as China, Japan, and South Korea accelerate semiconductor self-reliance. China Mobile’s record 1.9 million 5G towers translate to tens of millions of hermetic RF filters shipped annually, and BYD’s 3.6 million EVs embed battery-management feedthroughs in every pack. Kyocera’s fiscal 2024 reporting highlighted 12% year-over-year growth in semiconductor components, driven by ceramic substrate exports to European automotive radar lines. Samsung Electro-Mechanics is retrofitting cleanrooms in Gumi to co-package hermetic lids on premium smartphone image sensors, while India and Vietnam court back-end assembly investments that de-risk single-country exposure.

Europe generated approximately 15% of the 2024 global revenue, with Germany’s Bosch, Continental, and ZF purchasing over 150 million hermetic automotive sensors for safety systems. Airbus delivered 735 aircraft, each stuffed with flight-control computers that must withstand 30-year pressurization cycles. SCHOTT AG logged EUR 400 million (USD 450 million) in hermetic packaging sales, leveraging in-house glass powder furnaces to protect against supply shocks. France’s missile and satellite programs maintain a robust vendor qualification pipeline, and the United Kingdom’s Surrey Satellite Technology specifies ceramic flat packs for Earth observation payloads. Although the Middle East and Africa, as well as South America, together accounted for less than 10% of 2024 revenue, oil-and-gas automation upgrades and South African mining robotics show incremental uptake for hermetic sensors, hinting at future upside tied to infrastructure investment cycles.

Hermetic Packaging Market CAGR (%), Growth Rate by Region
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Competitive Landscape

The hermetic packaging market is moderately consolidated, with the top five suppliers controlling roughly 45% of global revenue; however, no single vendor exceeds a 15% share. SCHOTT, Kyocera, NGK, AMETEK, and Materion dominate the market for Kovar-brazed ceramic housings, leveraging vertically integrated glass-powder synthesis and alloy-stamping lines to buffer material volatility. Smaller entrants, such as Complete Hermetics and Willow Technologies, carve out niches in cryogenic quantum-bit carriers and titanium neural-implant feedthroughs, competing on agility and rapid prototyping speed.

Technology differentiation centers on sub-nanoleak performance; tier-one players advertise routine screening down to 1 × 10⁻¹⁰ atm-cc-s through helium bombing, residual-gas analysis, and automated micro-CT inspection. Additive-manufactured titanium shells with integrated cooling microchannels reduce design cycles for high-power radar amplifiers, while low-temperature co-fired ceramic packages achieve dielectric-loss tangents below 0.001 at 77 GHz, making them suitable for automotive radar modules.

Strategic moves underscore a tilt toward capacity expansion: SCHOTT’s USD 56 million Mitterteich line upgrade raised medical-implant feedthrough output by 30%; AMETEK injected USD 25 million into Connecticut connector lines; and Teledyne’s USD 180 million Micross acquisition introduced radiation-hardened flat-pack expertise. Suppliers maintain ISO 13485, AS9100, and IATF 16949 credentials to secure multiyear contracts that newcomers struggle to penetrate. Continuous investment in leak-test automation and ceramic-powder purity safeguards competitive moats as cost pressures mount from the use of plastic encapsulation.

Hermetic Packaging Industry Leaders

  1. SCHOTT AG

  2. AMETEK Inc.

  3. Teledyne Technologies Incorporated

  4. Materion Corporation

  5. Micross Components Inc.

  6. *Disclaimer: Major Players sorted in no particular order
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Recent Industry Developments

  • October 2025: AMETEK signed a five-year contract valued at USD 75 million to supply hermetic connectors and feedthroughs for SpaceX Starlink Gen2 satellites, securing priority allocation for high-pin-count assemblies.
  • August 2025: SCHOTT AG introduced its HectoSeal ultra-low-leak glass-ceramic series, rated to 1 × 10⁻¹⁰ atm-cc-s, with pilot production underway at the Mitterteich facility to serve emerging quantum-computing modules.
  • April 2025: Kyocera invested USD 30 million to open a research and development center in Phoenix, Arizona, focused on additive-manufactured ceramic-to-metal hermetic packages for aerospace and quantum-computing applications.
  • February 2025: NGK Insulators completed a new ceramic feedthrough production line at its Nagoya plant, expanding annual capacity for electric-vehicle sensor packages by 20% following a USD 18 million equipment upgrade.

Table of Contents for Hermetic Packaging Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 Increasing Demand for High-Reliability Electronics in Aerospace and Defense
    • 4.2.2 Growing Adoption of Electric Vehicles with Safety-Critical Sensors
    • 4.2.3 Expansion of 5G Infrastructure Driving Hermetic RF Packages
    • 4.2.4 Growth of Medical Implants Requiring Long-Term Encapsulation
    • 4.2.5 Miniaturization of Quantum-Computing Cryogenic Devices
    • 4.2.6 Mandatory Reliability Standards for NewSpace Small-Satellite Constellations
  • 4.3 Market Restraints
    • 4.3.1 High Cost of Hermetic Materials and Processes
    • 4.3.2 Availability of Low-Cost Plastic Encapsulation Alternatives
    • 4.3.3 Skilled Labor Shortage for Precision Seal Manufacturing
    • 4.3.4 Supply Chain Vulnerability for High-Purity Glass Powders
  • 4.4 Industry Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Impact of Macroeconomic Factors on the Market
  • 4.8 Porter’s Five Forces Analysis
    • 4.8.1 Threat of New Entrants
    • 4.8.2 Bargaining Power of Buyers
    • 4.8.3 Bargaining Power of Suppliers
    • 4.8.4 Threat of Substitute Products
    • 4.8.5 Intensity of Competitive Rivalry

5. MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Configuration
    • 5.1.1 Multilayer Ceramic Packages
    • 5.1.2 Pressed Ceramic Packages
    • 5.1.3 Metal Can Packages
  • 5.2 By Type
    • 5.2.1 Passivation Glass
    • 5.2.2 Reed Glass
    • 5.2.3 Transponder Glass
    • 5.2.4 Glass-to-Metal Sealing
    • 5.2.5 Ceramic-to-Metal Sealing
  • 5.3 By Application
    • 5.3.1 Sensors
    • 5.3.2 Photodiodes
    • 5.3.3 Lasers
    • 5.3.4 MEMS Switches
    • 5.3.5 Airbag Ignitors
  • 5.4 By End-User Industry
    • 5.4.1 Aerospace and Defense
    • 5.4.2 Automotive
    • 5.4.3 Healthcare
    • 5.4.4 Petrochemical
    • 5.4.5 Other End-user Industries
  • 5.5 By Geography
    • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
    • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Chile
    • 5.5.2.4 Rest of South America
    • 5.5.3 Europe
    • 5.5.3.1 United Kingdom
    • 5.5.3.2 Germany
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Rest of Europe
    • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 India
    • 5.5.4.4 South Korea
    • 5.5.4.5 Australia and New Zealand
    • 5.5.4.6 Rest of Asia-Pacific
    • 5.5.5 Middle East and Africa
    • 5.5.5.1 Middle East
    • 5.5.5.1.1 United Arab Emirates
    • 5.5.5.1.2 Saudi Arabia
    • 5.5.5.1.3 Turkey
    • 5.5.5.1.4 Rest of Middle East
    • 5.5.5.2 Africa
    • 5.5.5.2.1 South Africa
    • 5.5.5.2.2 Kenya
    • 5.5.5.2.3 Nigeria
    • 5.5.5.2.4 Rest of Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for Key Companies, Products and Services, and Recent Developments)
    • 6.4.1 SCHOTT AG
    • 6.4.2 AMETEK Inc.
    • 6.4.3 Teledyne Technologies Incorporated
    • 6.4.4 Kyocera Corporation
    • 6.4.5 Materion Corporation
    • 6.4.6 Texas Instruments Incorporated
    • 6.4.7 Amkor Technology Inc.
    • 6.4.8 Egide SA
    • 6.4.9 Micross Components Inc.
    • 6.4.10 Willow Technologies Ltd.
    • 6.4.11 SGA Technologies Limited
    • 6.4.12 Complete Hermetics LLC
    • 6.4.13 Special Hermetic Products Inc.
    • 6.4.14 NGK Insulators Ltd.
    • 6.4.15 CeramTec GmbH
    • 6.4.16 Hermetic Solutions Group LLC
    • 6.4.17 Coat-X SA
    • 6.4.18 StratEdge Corporation
    • 6.4.19 Legacy Technologies Inc.
    • 6.4.20 Mackin Technologies Inc.

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment
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Global Hermetic Packaging Market Report Scope

Hermetic packaging refers to the sealing of electronic components to protect them from environmental factors such as moisture, dust, and other contaminants, ensuring their reliability and longevity. This type of packaging is widely used in industries where high-performance and durability are critical.

The Hermetic Packaging Market Report is Segmented by Configuration (Multilayer Ceramic Packages, Pressed Ceramic Packages, Metal Can Packages), Type (Passivation Glass, Reed Glass, Transponder Glass, Glass-to-Metal Sealing, Ceramic-to-Metal Sealing), Application (Sensors, Photodiodes, Lasers, MEMS Switches, Airbag Ignitors), End-User Industry (Aerospace and Defense, Automotive, Healthcare, Petrochemical, Other End-user Industries), and Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa). The Market Forecasts are Provided in Terms of Value (USD).

By Configuration
Multilayer Ceramic Packages
Pressed Ceramic Packages
Metal Can Packages
By Type
Passivation Glass
Reed Glass
Transponder Glass
Glass-to-Metal Sealing
Ceramic-to-Metal Sealing
By Application
Sensors
Photodiodes
Lasers
MEMS Switches
Airbag Ignitors
By End-User Industry
Aerospace and Defense
Automotive
Healthcare
Petrochemical
Other End-user Industries
By Geography
North America United States
Canada
Mexico
South America Brazil
Argentina
Chile
Rest of South America
Europe United Kingdom
Germany
France
Italy
Spain
Rest of Europe
Asia-Pacific China
Japan
India
South Korea
Australia and New Zealand
Rest of Asia-Pacific
Middle East and Africa Middle East United Arab Emirates
Saudi Arabia
Turkey
Rest of Middle East
Africa South Africa
Kenya
Nigeria
Rest of Africa
By Configuration Multilayer Ceramic Packages
Pressed Ceramic Packages
Metal Can Packages
By Type Passivation Glass
Reed Glass
Transponder Glass
Glass-to-Metal Sealing
Ceramic-to-Metal Sealing
By Application Sensors
Photodiodes
Lasers
MEMS Switches
Airbag Ignitors
By End-User Industry Aerospace and Defense
Automotive
Healthcare
Petrochemical
Other End-user Industries
By Geography North America United States
Canada
Mexico
South America Brazil
Argentina
Chile
Rest of South America
Europe United Kingdom
Germany
France
Italy
Spain
Rest of Europe
Asia-Pacific China
Japan
India
South Korea
Australia and New Zealand
Rest of Asia-Pacific
Middle East and Africa Middle East United Arab Emirates
Saudi Arabia
Turkey
Rest of Middle East
Africa South Africa
Kenya
Nigeria
Rest of Africa
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Key Questions Answered in the Report

What CAGR is forecast for the hermetic packaging market through 2030?

The market is projected to register a 7.02% CAGR between 2025 and 2030.

Which configuration type is expanding the fastest?

Pressed-ceramic packages are advancing at an 8.43% CAGR owing to quantum-computing and millimeter-wave radar demand.

Why are ceramic-to-metal seals gaining share over glass-to-metal seals?

Better thermal-expansion matching under -40 °C to +150 °C cycles reduces leak risk in automotive and defense applications.

Which region offers the highest growth potential to 2030?

Asia-Pacific is forecast to post a 9.01% CAGR as China, Japan, and South Korea localize advanced packaging capacity.

How do plastic alternatives affect hermetic packaging adoption?

Low-cost plastic BGAs and conformal coatings undercut pricing, limiting uptake in consumer electronics where ultimate reliability is not mandated.

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