Esim Hardware Market Size and Share

Esim Hardware Market Size
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Esim Hardware Market Analysis by Mordor Intelligence

The Esim Hardware Market size in terms of shipment volume was valued at 0.61 billion units in 2025 and is estimated to grow from 0.73 billion units in 2026 to reach 1.73 billion units by 2031, at a CAGR of 19.01% during the forecast period (2026-2031).

The Esim hardware market is being supported by 5G standalone private networks, which need embedded credentials that can be provisioned remotely. Device makers are also moving toward designs without physical SIM trays, increasing demand for certified eUICC and integrated SIM hardware. Commercial use of the GSMA SGP.32 standard is widening the addressable base for remotely managed IoT connections. European requirements for 4G and 5G emergency calling in new vehicle types are creating demand for updated telematics equipment alongside demand from new vehicles. These forces bring consumer devices, enterprise connectivity, and regulatory compliance into the same eSIM hardware market outlook.

Key Report Takeaways

  • By network type, 4G/LTE held 57.45% of eSIM hardware market volume in 2025, while 5G is projected to expand at a 20.99% CAGR through 2031.
  • By form factor, MFF2 retained 69.85% of eSIM hardware market volume in 2025, while wafer-level CSP is expected to expand at a 19.36% CAGR through 2031.
  • By device type, smartphones accounted for 45.78% of volume in 2025, while wearables are projected to expand at a 20.67% CAGR through 2031.
  • By application, consumer electronics held 46.02% of volume in 2025, while automotive and transportation is forecast to expand at a 19.48% CAGR through 2031.
  • By geography, North America held 38.69% of eSIM hardware market volume in 2025, while Asia-Pacific is projected to expand at a 19.88% CAGR through 2031.

Note: Market size and forecast figures in this report are generated using Mordor Intelligence’s proprietary estimation framework, updated with the latest available data and insights as of January 2026.

Segment Analysis

By Network Type: 4G/LTE Retains the Installed Base While 5G Expands Demand

4G/LTE held 57.45% of the eSIM hardware market share in 2025, reflecting its established position in smartphones and M2M modules. Devices produced from 2021 through 2025 mainly used 4G/LTE as their primary connectivity option, supported by broad carrier coverage in North America, Europe, and urban Asia-Pacific. Smartphones, automotive telematics units, and industrial gateways continue to use certified 4G/LTE hardware in large volumes. NB-IoT/LTE-M serves lower-power uses such as smart metering, agricultural monitoring, and asset tracking, where continuous connectivity matters more than high data throughput. MFF2 eUICC chips are common in these applications because they are designed for long service life and demanding temperature conditions.

The GSMA published SGP.32 V1.3 in May 2026 with provisions for network-constrained and user-interface-constrained IoT devices. The update confirms that the newer provisioning model applies to low-data-rate devices as well as broadband cellular equipment. 5G is projected to expand at a 20.99% CAGR from 2026 to 2031 as private 5G and compatible consumer devices add demand, and the GSA reported 974 organizations deploying 5G private mobile networks globally in June 2026. Dual-mode chipsets supporting both 4G/LTE and 5G are likely to remain important during the transition because they preserve network flexibility.

Esim Hardware Market Share by Network Type, 2025
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Esim Hardware Market Share by Network Type, 2025

By Form Factor: MFF2 Leads Volume While Smaller Packages Gain Use

MFF2 retained 69.85% of the eSIM hardware market volume in 2025 because its standardized pinout supports established automotive and industrial designs. The form factor is widely used in telematics control units, industrial gateways, and smart energy meters because it prevents the physical removal of a SIM from fixed or difficult-to-access equipment. ETSI TS 102 671 Release 18 supports multi-supplier qualification across temperatures from -40°C to +105°C. MFF2 measures 5×6 mm and can fit existing printed circuit board layouts without changes, helping manufacturers manage long production cycles. It remains suitable where reliability matters more than extreme miniaturization.[3]Giesecke+Devrient GmbH, “Compact, Efficient and Sustainable, eSIM New Form Factors,” Giesecke+Devrient, gi-de.com

ETSI Release 18 introduced MFF3 and MFF4 packages in 3×3 mm and 2×2 mm sizes, providing standardized sizes between MFF2 and wafer-level packaging. Wafer-level CSP is forecast to expand at a 19.36% CAGR from 2026 to 2031 as smartphone and wearable makers seek lower profiles and less board area. Infineon introduced the OPTIGA Connect Consumer OC1230 in the first half of 2026 as a 28 nm eSIM turnkey solution for wearables and ultra-thin smartphones, featuring lower power consumption and connected-product security features. Plug-in eSIM remains relevant for retrofits, while system-in-package and integrated iUICC designs are gaining use in compact devices.

By Device Type: Smartphones Lead Volume While Wearables Expand Faster

Smartphones accounted for 45.78% of the eSIM hardware market volume in 2025, making them the largest device category. Flagship launches in North America and Europe supported this position, while Chinese regulatory changes added a new activation path from October 2025. Domestic Chinese profile requirements also make local suppliers more relevant to handset supply. Tablets and laptops are a separate category where adoption is slower but increasingly useful for enterprise mobility, because information technology teams can provision cellular connections remotely in the field. M2M and IoT modules provide another major route to market for certified embedded credentials.

Module suppliers integrate eUICC chips into products for automotive, logistics, and smart-grid uses, which are among the first commercial settings for SGP.32 provisioning. Wearables are projected to expand at a 20.67% CAGR from 2026 to 2031, the fastest rate among device categories. Cellular smartwatches and fitness devices need very small embedded chips because physical SIM trays are impractical, and health functions make always-on connectivity more relevant. The eSIM hardware market size for wearables is supported by 28 nm wafer-level CSP products before the technology moves into higher-volume smartphone designs. 

Esim Hardware Market Share by Device Type, 2025
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Esim Hardware Market Share by Device Type, 2025

By Application: Consumer Electronics Holds Volume While Automotive Scales Fastest

Consumer electronics held 46.02% of the eSIM hardware market share in 2025, supported by shipments of smartphones, tablets, and wearables. Each new device generation that removes a physical SIM tray increases hardware procurement for embedded connectivity. Consumer profile downloads increased 43% in 2025, confirming that more embedded devices were being activated. Industrial and manufacturing, logistics and asset tracking, energy and utilities, and healthcare devices form the broader IoT application base. These uses can carry higher unit values because their eUICC hardware often needs wider temperature tolerance, longer lifecycle support, and reliable remote management across dispersed equipment. 

Automotive and transportation is projected to expand at a 19.48% CAGR from 2026 to 2031. The January 2026 requirement for packet-switched eCall in new vehicle types is an immediate support factor. Connected vehicle platforms use embedded credentials for over-the-air software updates and vehicle-to-everything services, while Thales and Telefónica introduced an SGP.32-based solution for global IoT deployments in July 2026. Logistics and asset tracking is also gaining relevance as trackers need multi-country network access without physical SIM management, supporting a broader eSIM hardware market across fixed, mobile, and vehicle-based equipment. 

Geography Analysis

North America held 38.69% of the eSIM hardware market volume in 2025, giving the region the leading position. Earlier eSIM-only smartphone adoption helped operators build activation infrastructure ahead of many other regions. The Trusted Connectivity Alliance identified North America as the region with the strongest consumer adoption in 2025. The United States accounted for a large part of activated eSIM connections, while Canadian private mobile networks added an enterprise demand source. Canada’s private mobile network deployments increased 5% in Q1 2026, and Mexico’s automotive and industrial IoT manufacturing base also supports demand as production moves closer to North American end markets.

South America saw consumer eSIM adoption double in 2025, although its absolute base remained smaller than North America’s. The increase indicates that regional operators are expanding the activation infrastructure needed for future device shipments. Europe remains the second-largest regional contributor because of smartphone activity, vehicle connectivity requirements, eCall rules for packet-switched emergency calls, and wider cybersecurity requirements for digital products. New eCall technical standards will apply from January 1, 2027, while the United Kingdom is developing SGP.32-native programs through EE, Vodafone, Three, and O2.[4]European Commission, “Commission Delegated Regulation (EU) 2025/1871 Amending eCall Technical Standards for 4G/5G Networks,” EUR-Lex, eur-lex.europa.eu.

Asia-Pacific is projected to expand at a 19.88% CAGR from 2026 to 2031, making it the fastest-growing geography in the eSIM hardware market. China’s domestic activation policy broadened the basis for consumer eSIM adoption from October 2025. India gained another support factor when Tata Communications and BSNL introduced pan-India eSIM infrastructure in October 2025 for smartphone and smart-meter uses. Japan and South Korea use embedded credentials in connected vehicles, wearable payment devices, and smart manufacturing, while Australia is extending use through enterprise and government IoT programs. Saudi Arabia and the UAE are investing in smart-city and industrial IoT systems, while Africa recorded doubled consumer adoption in 2025, led by South Africa and Nigeria, although demand is expected to remain below developed-market levels through 2031.

Esim Hardware Market Growth Rate by Region
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Competitive Landscape

The eSIM hardware market has a moderately consolidated structure because a limited group of semiconductor and security suppliers controls much of the certified eUICC supply. STMicroelectronics, Infineon Technologies, and NXP Semiconductors lead silicon-level design, while Giesecke+Devrient and Thales have important roles in eSIM operating systems and subscription management platforms. Certification requirements, secure manufacturing controls, GSMA compliance, ETSI form-factor qualification, and site security accreditation raise the investment needed for new suppliers. The concentration of technical qualifications supports established suppliers even as new IoT use cases create additional opportunities. The eSIM hardware market remains competitive across silicon, operating systems, and integrated solutions.

STMicroelectronics announced the ST54M in June 2026, a single-die product that combines a post-quantum cryptography accelerator, NFC, a secure element, and eSIM functions for future smartphone and personal-electronics security needs. Infineon introduced its OC1230 in the first half of 2026 for wearables and thin smartphone platforms, with lower power use and connected-product security requirements. Giesecke+Devrient introduced a cloud-based SGP.32 platform in February 2026 and deployed the technology in a consumer connectivity device. These moves combine hardware, security functions, and remote provisioning capabilities. They show how leading suppliers are strengthening their positions in the eSIM hardware market.

Competition is also increasing around SGP.32-certified IoT hardware, where IDEMIA Secure Transactions introduced a fully GSMA-certified solution in August 2025 and reported selection by more than 20 global industry players. Valid is targeting mass production readiness for an SGP.32-compliant eSIM OS on Infineon’s TEGRION SLx22 secure element from Q3 2026. Qualcomm and IDEMIA demonstrated a reprogrammable iSIM for compact IoT devices, which could place pressure on standalone chip demand in high-volume uses. Chinese suppliers Unigroup Guoxin and CEC Huada are widening their domestic portfolios following China’s policy change.[5]IDEMIA Secure Transactions, “IDEMIA Launches Industry’s First Fully GSMA-Certified SGP.32 eSIM Solution,” IDEMIA, idemIA.com.

Esim Hardware Industry Leaders

  1. STMicroelectronics N.V.

  2. Infineon Technologies AG

  3. NXP Semiconductors N.V.

  4. Giesecke+Devrient GmbH

  5. Thales Group

  6. *Disclaimer: Major Players sorted in no particular order
Esim Hardware Market Concentration
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Recent Industry Developments

  • July 2026: Thales Group and Telefónica Tech launched a commercial SGP.32-based multi-operator eSIM solution for global IoT deployments, enabling enterprises to manage multiple operator profiles and switch connectivity providers across geographies through a unified platform.
  • June 2026: STMicroelectronics announced the ST54M, a single-die secure mobile chip integrating eSIM functionality, secure element, NFC, and a dedicated post-quantum cryptography hardware accelerator for next-generation connected devices.
  • May 2026: GSMA published SGP.32 v1.3, updating the eSIM IoT specification with enhanced provisions for network- and user-interface-constrained IoT devices, including eUICC architecture, interfaces, and security requirements.
  • February 2026: IDEMIA Secure Transactions, Acceleronix, and Tele2 IoT introduced an In-Factory Profile Provisioning Early Access Program to enable secure eSIM profile provisioning during device manufacturing and support a single-SKU approach for OEMs.

Table of Contents for Esim Hardware Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Impact of Macroeconomic Factors on the Market
  • 4.3 Market Drivers
    • 4.3.1 Accelerating 5G Standalone and Private-Network Rollouts
    • 4.3.2 Apple-Led Migration to eSIM-Only Flagships
    • 4.3.3 Automotive eCall and Cybersecurity Compliance Requirements
    • 4.3.4 Remote Provisioning Reducing Operator Logistics Costs
    • 4.3.5 Government IoT-Security Rules Favoring Soldered Credentials
    • 4.3.6 GSMA SGP.32 Enabling Mass-Scale IoT Deployments
  • 4.4 Market Restraints
    • 4.4.1 Fragmented Legacy and Next-Generation IoT Specifications
    • 4.4.2 Limited eSIM Awareness Outside Premium Devices
    • 4.4.3 Hardware Supply-Chain Exposure to Tamper and Side-Channel Attacks
    • 4.4.4 Dual-Stack Certification and Migration Costs in Industrial Fleets
  • 4.5 Industry Value Chain Analysis
  • 4.6 Regulatory Landscape
  • 4.7 Technological Outlook
  • 4.8 Porter's Five Forces Analysis
    • 4.8.1 Bargaining Power of Semiconductor Suppliers
    • 4.8.2 Bargaining Power of Device OEMs and Module Buyers
    • 4.8.3 Threat of New Entrants
    • 4.8.4 Threat of Substitutes
    • 4.8.5 Competitive Rivalry

5. MARKET SIZE AND GROWTH FORECASTS (VOLUME)

  • 5.1 By Network Type
    • 5.1.1 4G/LTE
    • 5.1.2 5G
    • 5.1.3 NB-IoT/LTE-M
  • 5.2 By Form Factor
    • 5.2.1 MFF2
    • 5.2.2 Wafer-Level CSP
    • 5.2.3 Plug-In eSIM
    • 5.2.4 System-in-Package and Integrated iUICC
  • 5.3 By Device Type
    • 5.3.1 Smartphones
    • 5.3.2 Tablets and Laptops
    • 5.3.3 Wearables
    • 5.3.4 M2M and IoT Modules
  • 5.4 By Application
    • 5.4.1 Consumer Electronics
    • 5.4.2 Automotive and Transportation
    • 5.4.3 Industrial and Manufacturing
    • 5.4.4 Logistics and Asset Tracking
    • 5.4.5 Other Applications (Energy and Utilities and Healthcare and Medical Devices)
  • 5.5 By Geography
    • 5.5.1 North America
    • 5.5.1.1 United States
    • 5.5.1.2 Canada
    • 5.5.1.3 Mexico
    • 5.5.2 South America
    • 5.5.2.1 Brazil
    • 5.5.2.2 Argentina
    • 5.5.2.3 Rest of South America
    • 5.5.3 Europe
    • 5.5.3.1 Germany
    • 5.5.3.2 United Kingdom
    • 5.5.3.3 France
    • 5.5.3.4 Italy
    • 5.5.3.5 Spain
    • 5.5.3.6 Russia
    • 5.5.3.7 Rest of Europe
    • 5.5.4 Asia-Pacific
    • 5.5.4.1 China
    • 5.5.4.2 Japan
    • 5.5.4.3 South Korea
    • 5.5.4.4 India
    • 5.5.4.5 Australia
    • 5.5.4.6 Rest of Asia-Pacific
    • 5.5.5 Middle East
    • 5.5.5.1 Saudi Arabia
    • 5.5.5.2 United Arab Emirates
    • 5.5.5.3 Rest of Middle East
    • 5.5.6 Africa
    • 5.5.6.1 South Africa
    • 5.5.6.2 Nigeria
    • 5.5.6.3 Rest of Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
    • 6.4.1 Giesecke+Devrient GmbH
    • 6.4.2 STMicroelectronics N.V.
    • 6.4.3 Infineon Technologies AG
    • 6.4.4 Thales Group
    • 6.4.5 IDEMIA France SAS
    • 6.4.6 NXP Semiconductors N.V.
    • 6.4.7 Valid S.A.
    • 6.4.8 Arm Limited, Kigen
    • 6.4.9 Workz Group
    • 6.4.10 Qualcomm Technologies, Inc.
    • 6.4.11 Samsung Electronics Co., Ltd.
    • 6.4.12 Apple Inc.
    • 6.4.13 Sierra Wireless, Inc.
    • 6.4.14 Telit Cinterion
    • 6.4.15 u-blox Holding AG
    • 6.4.16 Nordic Semiconductor ASA
    • 6.4.17 GCT Semiconductor Holding, Inc.
    • 6.4.18 Unigroup Guoxin Microelectronics Co., Ltd.
    • 6.4.19 CEC Huada Electronic Design Co., Ltd.
    • 6.4.20 Watchdata Technologies Ltd.

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment

Global Esim Hardware Market Report Scope

The eSIM Hardware Market Report is Segmented by Network Type (4G/LTE, 5G, and NB-IoT/LTE-M), Form Factor (MFF2, Wafer-Level CSP, Plug-In eSIM, and System-in-Package and Integrated iUICC), Device Type (Smartphones, Tablets and Laptops, Wearables, and M2M/IoT Modules), Application (Consumer Electronics, Automotive, Industrial, Logistics, and Other Applications (Energy and Utilities and Healthcare and Medical Devices)), and Geography (North America, South America, Europe, Asia-Pacific, Middle East, Africa). The Market Forecasts are Provided in Terms of Volume (Units).

By Network Type
4G/LTE
5G
NB-IoT/LTE-M
By Form Factor
MFF2
Wafer-Level CSP
Plug-In eSIM
System-in-Package and Integrated iUICC
By Device Type
Smartphones
Tablets and Laptops
Wearables
M2M and IoT Modules
By Application
Consumer Electronics
Automotive and Transportation
Industrial and Manufacturing
Logistics and Asset Tracking
Other Applications (Energy and Utilities and Healthcare and Medical Devices)
By Geography
North AmericaUnited States
Canada
Mexico
South AmericaBrazil
Argentina
Rest of South America
EuropeGermany
United Kingdom
France
Italy
Spain
Russia
Rest of Europe
Asia-PacificChina
Japan
South Korea
India
Australia
Rest of Asia-Pacific
Middle EastSaudi Arabia
United Arab Emirates
Rest of Middle East
AfricaSouth Africa
Nigeria
Rest of Africa
By Network Type4G/LTE
5G
NB-IoT/LTE-M
By Form FactorMFF2
Wafer-Level CSP
Plug-In eSIM
System-in-Package and Integrated iUICC
By Device TypeSmartphones
Tablets and Laptops
Wearables
M2M and IoT Modules
By ApplicationConsumer Electronics
Automotive and Transportation
Industrial and Manufacturing
Logistics and Asset Tracking
Other Applications (Energy and Utilities and Healthcare and Medical Devices)
By GeographyNorth AmericaUnited States
Canada
Mexico
South AmericaBrazil
Argentina
Rest of South America
EuropeGermany
United Kingdom
France
Italy
Spain
Russia
Rest of Europe
Asia-PacificChina
Japan
South Korea
India
Australia
Rest of Asia-Pacific
Middle EastSaudi Arabia
United Arab Emirates
Rest of Middle East
AfricaSouth Africa
Nigeria
Rest of Africa

Key Questions Answered in the Report

What is the eSIM hardware market size?

The eSIM hardware market is projected at 0.73 billion units in 2026 and is forecast to reach 1.73 billion units by 2031, at a 19.01% CAGR.

Which network type holds the largest eSIM hardware volume?

4G/LTE held 57.45% of global volume in 2025, supported by the installed base of smartphones, telematics units, and M2M modules.

Which eSIM form factor is used most widely?

MFF2 retained 69.85% of volume in 2025 because it suits established automotive, industrial, and smart-meter designs.

Which device category is expanding fastest for embedded SIM hardware?

Wearables are projected to expand at a 20.67% CAGR through 2031 as cellular smartwatches and fitness devices need compact embedded credentials.

Why are connected vehicles increasing demand for eSIM hardware?

New European vehicle types have required 4G or 5G packet-switched eCall support since January 2026, driving upgrades to telematics modules.

Which region is expected to expand fastest through 2031?

Asia-Pacific is projected to expand at a 19.88% CAGR, supported by policy and infrastructure developments in China and India.

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