Automotive Power Module Packaging Top Companies
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Amkor Technologies
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Infineon Technologies
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STMicroelectronics
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Fuji Electric Co. Ltd.
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Toshiba Electronics Device & Storage Corporation
*Disclaimer: Top companies sorted in no particular order
Automotive Power Module Packaging Market Concentration
Automotive Power Module Packaging Company List
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Amkor Technology, Inc.
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Kulicke & Soffa Industries, Inc.
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Powertech Technology Inc. (PTI)
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Infineon Technologies AG
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STMicroelectronics N.V.
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Fuji Electric Co., Ltd.
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Toshiba Electronic Devices & Storage Corporation
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SEMIKRON Danfoss GmbH & Co. KG
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JCET Group Co., Ltd.
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StarPower Semiconductor Ltd.
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Mitsubishi Electric Corporation
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ROHM Co., Ltd.
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onsemi Corporation
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Nexperia B.V.
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Wolfspeed, Inc.
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Microchip Technology Inc.
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Littelfuse, Inc. (IXYS)
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Vitesco Technologies Group AG
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Vincotech GmbH
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CISSOID SA
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Hitachi Astemo, Ltd.
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Danfoss Silicon Power GmbH
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BYD Semiconductor Co., Ltd.
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Dynex Semiconductor Ltd.
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Shenzhen BASiC Semiconductor Ltd.
