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Automotive Power Module Packaging Companies

This report lists the top Automotive Power Module Packaging companies based on the 2023 & 2024 market share reports. Mordor Intelligence expert advisors conducted extensive research and identified these brands to be the leaders in the Automotive Power Module Packaging industry.

Home Market Analysis Technology, Media and Telecom Research Semiconductors Research Automotive Power Module Packaging Market Companies

Automotive Power Module Packaging Top Companies

  1. Amkor Technologies

  2. Infineon Technologies

  3. STMicroelectronics

  4. Fuji Electric Co. Ltd.

  5. Toshiba Electronics Device & Storage Corporation

*Disclaimer: Top companies sorted in no particular order

Automotive Power Module Packaging Market Major Players

Automotive Power Module Packaging Market Concentration

Automotive Power Module Packaging Market Concentration

Automotive Power Module Packaging Company List

                  • Amkor Technology

                  • Kulicke and Soffa Industries Inc.

                  • PTI Technology Inc.

                  • Infineon Technologies

                  • STMicroelectronics

                  • Fuji Electric Co. Ltd.

                  • Toshiba Electronic Device & Storage Corporation

                  • Semikron

                  • STATS ChipPAC Ltd. (JCET)

                  • Starpower Semiconductor Ltd.


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              Automotive Power Module Packaging Report Snapshots

              Automotive Power Module Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)