High-End-Halbleitergehäuse Top-Unternehmen
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Intel Corporation
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Taiwan Semiconductor Manufacturing Company
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Advanced Semiconductor Engineering, Inc
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Samsung Electronics Co. Ltd
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Amkor Technology Inc.
*Haftungsausschluss: Top-Unternehmen in keiner bestimmten Reihenfolge sortiert
High-End-Halbleitergehäuse Marktkonzentration
High-End-Halbleitergehäuse Unternehmensliste
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Advanced Semiconductor Engineering Inc. (ASE Technology Holding Co., Ltd.)
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Amkor Technology, Inc.
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Intel Corporation
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Taiwan Semiconductor Manufacturing Company Limited (TSMC)
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Samsung Electronics Co., Ltd.
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JCET Group Co., Ltd.
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Siliconware Precision Industries Co., Ltd. (SPIL)
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Powertech Technology Inc. (PTI)
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TongFu Microelectronics Co., Ltd.
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Fujitsu Limited
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Texas Instruments Incorporated
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United Microelectronics Corporation (UMC)
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STATS ChipPAC Pte Ltd.
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Hiksemi Microelectronics Co., Ltd.
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Nanium S.A. (Infineon Backend)
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Chip MOS Technologies Inc.
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Taiwan Advanced Packaging Corporation (TAPC)
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Unimicron Technology Corp.
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Shinko Electric Industries Co., Ltd.
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Kyocera Corporation (AVX)
