中东和非洲电子粘合剂市场 - 增长、趋势、COVID-19 影响和预测(2022 - 2027 年)

市场按树脂类型(环氧树脂、丙烯酸树脂、聚氨酯和其他树脂类型)、应用(保形涂料、表面安装、封装、线粘和其他应用)和地理(沙特阿拉伯、南非、阿拉伯联合酋长国、卡塔尔以及中东和非洲其他地区)。

市场快照

Middle-East and Africa Electronics Adhesive Market - Market Summary
Study Period: 2016 - 2026
Base Year: 2021
CAGR: >8 %

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市场概况

在预测期内,中东和非洲电子粘合剂市场预计将以超过 8% 的复合年增长率增长。推动市场发展的主要因素之一是该地区发展中国家不断增长的需求。然而,原材料价格的波动阻碍了所研究市场的增长。 

  • 预计电动汽车不断增长的需求和渗透将为所研究的市场提供重要的增长机会。
  • 沙特阿拉伯占市场的最高份额,并可能在预测期内继续主导市场。
  • 在应用领域中,表面贴装有望在预测期内主导研究的市场。

Scope of the report

The Middle-East & Africa Electronics Adhesives market report include: 

Resin Type
Epoxy
Acrylics
Polyurethane
Other Resin Types
Application
Conformal Coatings
Surface Mounting
Encapsulation
Wire Tacking
Other Applications
Geography
Saudi Arabia
South Africa
United Arab Emirates
Qatar
Rest of Middle-East and Africa

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主要市场趋势

表面贴装应用主导市场

  • 表面贴装,也称为芯片键合,在中东和非洲电子胶粘剂市场中占有最高份额。
  • 在此应用中使用的主要粘合剂类型主要包括单组分系统,由丙烯酸树脂、环氧树脂或聚氨酯丙烯酸酯制成,并且可以导电或导热。
  • 使用的这些粘合剂具有优异的物理和化学质量,有助于它们具有较长的保质期、高湿强度、快速固化、强度和柔韧性。
  • 这种表面贴装粘合剂用于将 SMT 组件固定在需要进行双面处理的基板上,然后才能进入回流焊或波峰焊工艺。此外,它们还用于为暴露在高冲击环境中的较大组件增加额外的保持力。
  • 因此,由于上述原因,表面贴装应用很可能在预测期内主导研究的市场。
Middle-East and Africa Electronics Adhesives Market - Revenue Share

沙特阿拉伯将主导市场

  • 沙特阿拉伯目前在中东和非洲电子粘合剂市场的份额最高。
  • 随着国家越来越重视提高车辆的安全性,同时确保娱乐性,印刷电路板的需求和使用量不断增加。这反过来又加速了对电子粘合剂的需求。
  • 然而,不稳定的政治状况可能会对未来几年的市场增长产生负面影响。
  • 由于上述因素,沙特阿拉伯很可能在预测期内主导市场。
Middle-East and Africa Electronics Adhesives Market - Regional Trends

竞争格局

中东和非洲电子胶粘剂市场适度整合,市场份额被少数参与者瓜分。市场上的一些主要参与者包括 Henkel AG & Co. KGaA、Dow、HB Fuller Company、3M 和 Arkema 等。

Table of Contents

  1. 1. INTRODUCTION

    1. 1.1 Study Assumptions

    2. 1.2 Scope of the Study

  2. 2. RESEARCH METHODOLOGY

  3. 3. EXECUTIVE SUMMARY

  4. 4. MARKET DYNAMICS

    1. 4.1 Drivers

      1. 4.1.1 Growing Demand from the developing countries of the Region

      2. 4.1.2 Other Drivers

    2. 4.2 Restraints

      1. 4.2.1 Volatility in Raw Material Prices

      2. 4.2.2 Globalization and Growing Operating Costs

      3. 4.2.3 Other Restraints

    3. 4.3 Industry Value-chain Analysis

    4. 4.4 Porter's Five Forces Analysis

      1. 4.4.1 Bargaining Power of Suppliers

      2. 4.4.2 Bargaining Power of Consumers

      3. 4.4.3 Threat of New Entrants

      4. 4.4.4 Threat of Substitute Products and Services

      5. 4.4.5 Degree of Competition

  5. 5. MARKET SEGMENTATION

    1. 5.1 Resin Type

      1. 5.1.1 Epoxy

      2. 5.1.2 Acrylics

      3. 5.1.3 Polyurethane

      4. 5.1.4 Other Resin Types

    2. 5.2 Application

      1. 5.2.1 Conformal Coatings

      2. 5.2.2 Surface Mounting

      3. 5.2.3 Encapsulation

      4. 5.2.4 Wire Tacking

      5. 5.2.5 Other Applications

    3. 5.3 Geography

      1. 5.3.1 Saudi Arabia

      2. 5.3.2 South Africa

      3. 5.3.3 United Arab Emirates

      4. 5.3.4 Qatar

      5. 5.3.5 Rest of Middle-East and Africa

  6. 6. COMPETITIVE LANDSCAPE

    1. 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements

    2. 6.2 Market Share/Ranking Analysis**

    3. 6.3 Strategies Adopted by Leading Players

    4. 6.4 Company Profiles

      1. 6.4.1 3M

      2. 6.4.2 Arkema

      3. 6.4.3 Ashland

      4. 6.4.4 Avery Dennison Corporation

      5. 6.4.5 BASF SE

      6. 6.4.6 Cyberbond L.L.C.

      7. 6.4.7 Dow

      8. 6.4.8 Drytac

      9. 6.4.9 Dymax Corporation

      10. 6.4.10 H.B. Fuller Company

      11. 6.4.11 Henkel AG & Co. KGaA

      12. 6.4.12 Huntsman International LLC

      13. 6.4.13 Parker Hannifin Corp

      14. 6.4.14 Pidilite Industries Ltd.

    5. *List Not Exhaustive
  7. 7. MARKET OPPORTUNITIES AND FUTURE TRENDS

    1. 7.1 Growing Demand and Penetration of Electric Vehicles

**Subject to Availability

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Frequently Asked Questions

The Middle-East and Africa Electronics Adhesives Market market is studied from 2016 - 2026.

The Middle-East and Africa Electronics Adhesives Market is growing at a CAGR of >8% over the next 5 years.

Henkel AG & Co. KGaA , Dow, H.B. Fuller Company , 3M, Arkema are the major companies operating in Middle-East and Africa Electronics Adhesives Market.

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