市场快照

Study Period | 2016 - 2026 |
Base Year For Estimation | 2022 |
Forecast Data Period | 2023 - 2028 |
Historical Data Period | 2018 - 2021 |
CAGR | > 8.00 % |
Market Concentration | High |
Major Players![]() *Disclaimer: Major Players sorted in no particular order |
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市场概况
在预测期内,亚太电子粘合剂市场预计将以超过 8% 的复合年增长率增长。推动市场发展的主要因素之一是电子粘合剂制造技术的不断进步。然而,原材料价格的波动正在阻碍所研究市场的增长。
- 转向环保型水性粘合剂预计将为所研究的市场提供重要的增长机会。
- 中国占市场的最高份额,并可能在预测期内继续主导市场。
- 在应用领域中,表面贴装有望在预测期内主导市场。
Scope of the report
The Asia-Pacific electronics adhesives market report include:
Resin Type | |
Epoxy | |
Acrylics | |
Polyurethane | |
Other Resin Types |
Application | |
Conformal Coatings | |
Surface Mounting | |
Encapsulation | |
Wire Tacking | |
Other Applications |
Geography | ||||||||
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主要市场趋势
表面贴装应用占据市场份额
- 表面贴装,也称为芯片键合,在亚太电子胶粘剂行业中占比最高。
- 在此应用中使用的主要粘合剂类型主要包括单组分系统,由丙烯酸树脂、环氧树脂或聚氨酯丙烯酸酯制成,并且可以导电或导热。
- 使用的这些粘合剂具有优异的物理和化学质量,有助于它们具有较长的保质期、高湿强度、快速固化、强度和柔韧性。
- 因此,根据上述原因,表面贴装很可能在预测期内主导研究的市场。

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竞争格局
亚太地区电子胶粘剂市场适度整合,市场份额由少数参与者瓜分。市场上的一些主要参与者包括 Henkel AG & Co. KGaA、Dow、HB Fuller Company、3M 和 BASF SE 等。
主要玩家
Henkel AG & Co. KGaA
Dow
H.B. Fuller Company
3M
BASF SE
*Disclaimer: Major Players sorted in no particular order

Table of Contents
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1. INTRODUCTION
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1.1 Study Assumptions
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1.2 Scope of the Study
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2. RESEARCH METHODOLOGY
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3. EXECUTIVE SUMMARY
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4. MARKET DYNAMICS
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4.1 Drivers
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4.1.1 Growing Technological Advancements in Manufacturing Electronic Adhesives
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4.1.2 Other Drivers
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4.2 Restraints
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4.2.1 Volatility in Raw Material Prices
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4.2.2 Regulations Related to the VOCs
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4.2.3 Other Restraints
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4.3 Industry Value-chain Analysis
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4.4 Porter's Five Forces Analysis
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4.4.1 Bargaining Power of Suppliers
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4.4.2 Bargaining Power of Consumers
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4.4.3 Threat of New Entrants
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4.4.4 Threat of Substitute Products and Services
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4.4.5 Degree of Competition
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5. MARKET SEGMENTATION
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5.1 Resin Type
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5.1.1 Epoxy
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5.1.2 Acrylics
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5.1.3 Polyurethane
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5.1.4 Other Resin Types
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5.2 Application
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5.2.1 Conformal Coatings
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5.2.2 Surface Mounting
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5.2.3 Encapsulation
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5.2.4 Wire Tacking
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5.2.5 Other Applications
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5.3 Geography
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5.3.1 Asia-Pacific
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5.3.1.1 China
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5.3.1.2 India
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5.3.1.3 Japan
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5.3.1.4 South Korea
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5.3.1.5 ASEAN Countries
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5.3.1.6 Rest of Asia-Pacific
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6. COMPETITIVE LANDSCAPE
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6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
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6.2 Market Share/Ranking Analysis**
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6.3 Strategies Adopted by Leading Players
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6.4 Company Profiles
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6.4.1 3M
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6.4.2 Arkema
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6.4.3 Ashland
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6.4.4 AVERY DENNISON CORPORATION
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6.4.5 BASF SE
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6.4.6 Beardow Adams
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6.4.7 CHEMENCE
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6.4.8 Covestro AG
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6.4.9 Dow
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6.4.10 H.B. Fuller Company
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6.4.11 Henkel AG & Co. KGaA
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6.4.12 Huntsman International LLC.
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6.4.13 Sika AG
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6.4.14 Illinois Tool Works Inc.
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- *List Not Exhaustive
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7. MARKET OPPORTUNITIES AND FUTURE TRENDS
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7.1 Shift Towards Environment-friendly Water-based Adhesives
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Frequently Asked Questions
这个市场的研究期是多久?
研究了 2018 年至 2028 年的亚太电子粘合剂市场。
亚太电子胶粘剂市场增速如何?
未来 5 年,亚太电子粘合剂市场的复合年增长率将超过 8%。
谁是亚太电子胶粘剂市场的主要参与者?
Henkel AG & Co. KGaA , Dow, H.B. Fuller Company、3M、BASF SE 是亚太电子粘合剂市场的主要公司。