亚太电子粘合剂市场 - 增长、趋势、COVID-19 影响和预测 (2023 - 2028)

市场按树脂类型（环氧树脂、丙烯酸树脂、聚氨酯和其他树脂类型）、应用（保形涂料、表面安装、封装、焊线和其他应用）和地理（中国、印度、日本、韩国、东盟国家和亚太其他地区）。

Home right-chevron-icon Market Analysis right-chevron-icon Chemicals & Materials Research right-chevron-icon Adhesives and Sealants Research right-chevron-icon Adhesives Research right-chevron-icon Electronics Adhesives Research right-chevron-icon Asia-Pacific Electronics Adhesives Market right-chevron-icon 亚太电子胶粘剂市场

市场快照

Asia-Pacific Electronics Adhesives Market - Market Summary
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Study Period 2016 - 2026
Base Year For Estimation 2022
Forecast Data Period 2023 - 2028
Historical Data Period 2018 - 2021
CAGR > 8.00 %
Market Concentration High

Major Players

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*Disclaimer: Major Players sorted in no particular order
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市场概况

在预测期内，亚太电子粘合剂市场预计将以超过 8% 的复合年增长率增长。推动市场发展的主要因素之一是电子粘合剂制造技术的不断进步。然而，原材料价格的波动正在阻碍所研究市场的增长。 

  • 转向环保型水性粘合剂预计将为所研究的市场提供重要的增长机会。
  • 中国占市场的最高份额，并可能在预测期内继续主导市场。
  • 在应用领域中，表面贴装有望在预测期内主导市场。

Scope of the report

The Asia-Pacific electronics adhesives market report include: 

Resin Type
Epoxy
Acrylics
Polyurethane
Other Resin Types
Application
Conformal Coatings
Surface Mounting
Encapsulation
Wire Tacking
Other Applications
Geography
Asia-Pacific
China
India
Japan
South Korea
ASEAN Countries
Rest of Asia-Pacific

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主要市场趋势

表面贴装应用占据市场份额

  • 表面贴装，也称为芯片键合，在亚太电子胶粘剂行业中占比最高。
  •  在此应用中使用的主要粘合剂类型主要包括单组分系统，由丙烯酸树脂、环氧树脂或聚氨酯丙烯酸酯制成，并且可以导电或导热。 
  • 使用的这些粘合剂具有优异的物理和化学质量，有助于它们具有较长的保质期、高湿强度、快速固化、强度和柔韧性。
  • 因此，根据上述原因，表面贴装很可能在预测期内主导研究的市场。
Asia-Pacific Electronics Adhesives Market - Revenue Trend

竞争格局

亚太地区电子胶粘剂市场适度整合，市场份额由少数参与者瓜分。市场上的一些主要参与者包括 Henkel AG & Co. KGaA、Dow、HB Fuller Company、3M 和 BASF SE 等。

主要玩家

  1. Henkel AG & Co. KGaA

  2. Dow

  3. H.B. Fuller Company

  4. 3M

  5. BASF SE

*Disclaimer: Major Players sorted in no particular order

Asia-Pacific Electronics Adhesives Market - Market Concentration.png

Table of Contents

  1. 1. INTRODUCTION

    1. 1.1 Study Assumptions

    2. 1.2 Scope of the Study

  2. 2. RESEARCH METHODOLOGY

  3. 3. EXECUTIVE SUMMARY

  4. 4. MARKET DYNAMICS

    1. 4.1 Drivers

      1. 4.1.1 Growing Technological Advancements in Manufacturing Electronic Adhesives

      2. 4.1.2 Other Drivers

    2. 4.2 Restraints

      1. 4.2.1 Volatility in Raw Material Prices

      2. 4.2.2 Regulations Related to the VOCs

      3. 4.2.3 Other Restraints

    3. 4.3 Industry Value-chain Analysis

    4. 4.4 Porter's Five Forces Analysis

      1. 4.4.1 Bargaining Power of Suppliers

      2. 4.4.2 Bargaining Power of Consumers

      3. 4.4.3 Threat of New Entrants

      4. 4.4.4 Threat of Substitute Products and Services

      5. 4.4.5 Degree of Competition

  5. 5. MARKET SEGMENTATION

    1. 5.1 Resin Type

      1. 5.1.1 Epoxy

      2. 5.1.2 Acrylics

      3. 5.1.3 Polyurethane

      4. 5.1.4 Other Resin Types

    2. 5.2 Application

      1. 5.2.1 Conformal Coatings

      2. 5.2.2 Surface Mounting

      3. 5.2.3 Encapsulation

      4. 5.2.4 Wire Tacking

      5. 5.2.5 Other Applications

    3. 5.3 Geography

      1. 5.3.1 Asia-Pacific

        1. 5.3.1.1 China

        2. 5.3.1.2 India

        3. 5.3.1.3 Japan

        4. 5.3.1.4 South Korea

        5. 5.3.1.5 ASEAN Countries

        6. 5.3.1.6 Rest of Asia-Pacific

  6. 6. COMPETITIVE LANDSCAPE

    1. 6.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements

    2. 6.2 Market Share/Ranking Analysis**

    3. 6.3 Strategies Adopted by Leading Players

    4. 6.4 Company Profiles

      1. 6.4.1 3M

      2. 6.4.2 Arkema

      3. 6.4.3 Ashland

      4. 6.4.4 AVERY DENNISON CORPORATION

      5. 6.4.5 BASF SE

      6. 6.4.6 Beardow Adams

      7. 6.4.7 CHEMENCE

      8. 6.4.8 Covestro AG

      9. 6.4.9 Dow

      10. 6.4.10 H.B. Fuller Company

      11. 6.4.11 Henkel AG & Co. KGaA

      12. 6.4.12 Huntsman International LLC.

      13. 6.4.13 Sika AG

      14. 6.4.14 Illinois Tool Works Inc.

    5. *List Not Exhaustive

  7. 7. MARKET OPPORTUNITIES AND FUTURE TRENDS

    1. 7.1 Shift Towards Environment-friendly Water-based Adhesives

**Subject to Availability
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Frequently Asked Questions

研究了 2018 年至 2028 年的亚太电子粘合剂市场。

未来 5 年，亚太电子粘合剂市场的复合年增长率将超过 8%。

Henkel AG & Co. KGaA , Dow, H.B. Fuller Company、3M、BASF SE 是亚太电子粘合剂市场的主要公司。

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