Electronic Manufacturing Services For Industrial Device Market Size and Share

Electronic Manufacturing Services For Industrial Device Market Summary
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Electronic Manufacturing Services For Industrial Device Market Analysis by Mordor Intelligence

The Electronic Manufacturing Services for Industrial Device market size stood at USD 99.51 billion in 2026 and is forecast to reach USD 135.76 billion by 2031, reflecting a 6.41% CAGR over 2026-2031. Outsourcing depth is widening as industrial OEMs reallocate capital from captive assembly lines to software-centric R&D, while edge-computing adoption reshapes controller and gateway designs. Near-shore investments in Mexico and Eastern Europe are fragmenting supply chains that were previously centered in coastal China, prompted by the United States CHIPS and Science Act and the European Union Critical Raw Materials Act[1]Source: U.S. Department of Commerce, “CHIPS Act Implementation Progress,” commerce.gov. Accelerated deployment of box-build micro-factories in brownfield plants, coupled with OEM demand for design-for-manufacturability expertise, is moving EMS revenue toward turnkey models. Persistent headwinds include skilled-labor inflation in North America and Europe and semiconductor lead-time volatility that inflates inventory carrying costs.

Key Report Takeaways

  • By service type, printed circuit board assembly commanded 44.92% of Electronic Manufacturing Services for Industrial Device market share in 2025, while electromechanical box-build services are projected to expand at a 6.73% CAGR through 2031.
  • By business model, contract manufacturing held 60.11% share of the Electronic Manufacturing Services for Industrial Device market size in 2025 and hybrid turnkey arrangements are forecast to grow at a 6.97% CAGR during 2026-2031.
  • By manufacturing process, surface-mount technology represented 53.73% of revenue in 2025, yet advanced packaging and hybrid processes are poised to advance at a 7.13% CAGR up to 2031.
  • By geography, Asia Pacific accounted for 55.83% of 2025 revenue and is anticipated to log the fastest regional CAGR at 7.57% through 2031, underpinned by investments in India and Vietnam.

Note: Market size and forecast figures in this report are generated using Mordor Intelligence’s proprietary estimation framework, updated with the latest available data and insights as of January 2026.

Segment Analysis

By Service Type: Box-Build Momentum Reflects Brownfield IIoT Demand

PCB assembly retained a 44.92% revenue share of the Electronic Manufacturing Services for Industrial Device market in 2025. However, electromechanical box-build revenue is forecast to grow at 6.73% CAGR through 2031 as industrial clients retrofit legacy machinery with IIoT gateways, avoiding wholesale line replacements. The Electronic Manufacturing Services for Industrial Device market size tied to prototyping expanded when Venture Corporation logged a 27% rise in new-product-introduction projects during 2025, largely from industrial-robotics customers. 

The pivot toward box-build work is most visible in plants older than 15 years; Zollner noted that 58% of 2025 box-build projects involved equipment that old. Logistics services that synchronize component arrival with production have become differentiators, and test-and-development requests are climbing as regulators demand pre-certification for electronics deployed in hazardous environments. Engineering services that cut field-failure rates below 0.5% are supporting ISO 9001:2015 compliance and commanding premium margins.

Electronic Manufacturing Services For Industrial Device Market: Market Share by Service Type
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By Business Model: Hybrid Turnkey Models Capture Design-for-Manufacturability Value

Contract manufacturing still held 60.11% of 2025 revenue, yet hybrid turnkey models are projected to book a 6.97% CAGR to 2031, outpacing traditional approaches. The Electronic Manufacturing Services for Industrial Device market size attached to turnkey engagements is expanding because OEMs seek co-design input that trims prototyping cycles and shifts tooling risk to EMS partners. Fabrinet stated that turnkey contracts comprised 41% of its industrial revenue in Q2 2025, up from 28% two years prior. 

OEMs accept risk-sharing structures where EMS suppliers co-invest in fixtures against multi-year volume commitments. ODM remains centered in Asia Pacific; Universal Scientific Industrial saw ODM revenue climb 16% in 2025, fueled by automation customers. Cybersecurity compliance under IEC 62443 further lifts turnkey demand, as EMS firms with certified secure-development lifecycles can expedite regulatory approvals.

By Manufacturing Process: Advanced Packaging Gains Traction for Edge-AI Modules

Surface-mount technology captured 53.73% of 2025 revenue, but advanced packaging and hybrid processes are set to rise at 7.13% CAGR, the fastest within the Electronic Manufacturing Services for Industrial Device market. Fine-pitch components below 0.4 mm are driving placement-equipment upgrades, while through-hole assembly persists for high-stress railway and grid-automation boards. 

Adoption of wafer-level fan-out and system-in-package designs is accelerating among EMS providers that serve semiconductor-equipment and medical-device OEMs. Wistron qualified fan-out wafer-level packaging for edge-computing modules in September 2025 to target autonomous robots and collaborative arms. Hybrid processes combining SMT, through-hole, and wire-bonding suit power-electronics boards where high-current traces and digital controls co-exist. Achieving IPC-6012 Class 3 certification for high-reliability PCBs compels smaller EMS firms to upgrade traceability systems.

Electronic Manufacturing Services For Industrial Device Market: Market Share by Manufacturing Process
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Geography Analysis

Asia Pacific generated 55.83% of Electronic Manufacturing Services for Industrial Device market revenue in 2025 and is forecast to post a 7.57% CAGR through 2031, the fastest regional growth. India’s production-linked incentive scheme drew USD 8.3 billion in EMS pledges by December 2025, with Foxconn, Wistron, and Pegatron scaling plants in Tamil Nadu and Karnataka. Vietnam and Thailand continue to capture relocation from Guangdong and Jiangsu, trimming China’s share by 4.2 points between 2023 and 2025. Japan and South Korea focus on high-precision industrial-robotics assemblies that command premium pricing. 

North America represented roughly 22% of 2025 revenue, supported by CHIPS Act grants and OEM preferences for near-shore suppliers that shrink lead times. Mexico is the region’s growth engine, with SMT capacity in Tijuana, Guadalajara, and Monterrey expanding 18% year-over-year in 2025. The United States channels subsidies toward defense and critical-infrastructure electronics; Benchmark and Plexus expanded facilities in New Hampshire and Wisconsin to serve these verticals. Canada’s EMS base concentrates in Ontario and Quebec with aerospace and automation exposure. 

Europe held about 18% of 2025 revenue, with Poland, Czech Republic, and Romania registering double-digit EMS growth as German and French OEMs hedge against Asia-Pacific supply risk. Celestica’s Brno plant illustrates this shift. Germany remains Europe’s largest market, yet labor-cost inflation and energy volatility limit margin upside. South America and the Middle East and Africa together contribute under 5% of revenue, with growth centered in Brazil and the United Arab Emirates. Compliance with RoHS and REACH rules adds 3-5% to ownership costs for EMS suppliers serving European customers.

Electronic Manufacturing Services For Industrial Device Market CAGR (%), Growth Rate by Region
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Competitive Landscape

Competition is moderately concentrated: the top five players held around 38% of 2025 revenue in the Electronic Manufacturing Services for Industrial Device market. Foxconn, Jabil, and Flex are channeling capital into advanced packaging lines for AI-enabled edge modules, while Sanmina and Celestica differentiate via design-for-manufacturability consulting bundled with assembly. Tier-2 Southeast Asian providers underpriced incumbents by 12-15% in 2025, winning share on cost but lacking vertical integration. 

Patent activity around AI-driven optical inspection climbed 34% in 2025, with Jabil and Benchmark filing heavily for machine-vision defect-detection systems. On-site micro-factories positioned within OEM premises are emerging as whitespace; small Indian and Vietnamese firms offer sub-500-unit minimums, appealing to niche automation innovators. Leaders now deploy digital twins of assembly lines, cutting new-product-introduction cycles by up to 30%, and tie analytics to first-pass yield metrics to sustain margin despite wage inflation. 

Scope-3 emissions audits mandated by the International Sustainability Standards Board raise compliance expense, disproportionately burdening small regional EMS operators lacking ESG reporting infrastructure. Acquisition interest from well-capitalized players is rising, with recent deals such as Jabil’s Guadalajara plant purchase and Plexus’ Wisconsin specialty acquisition illustrating the trend.

Electronic Manufacturing Services For Industrial Device Industry Leaders

  1. Foxconn Technology Group

  2. Jabil Inc.

  3. Flex Ltd.

  4. Pegatron Corporation

  5. Sanmina Corporation

  6. *Disclaimer: Major Players sorted in no particular order
Electronic Manufacturing Services for Industrial Device Market Concentration
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Recent Industry Developments

  • January 2026: Foxconn committed USD 1.2 billion to a 250,000 sq ft industrial-electronics facility in Bengaluru, India, slated for Q3 2027 operation.
  • December 2025: Jabil bought a 120,000 sq ft Guadalajara plant to boost near-shore capacity for North American automation customers.
  • November 2025: Flex and Siemens partnered to co-develop AI-enabled edge controllers for automotive and discrete manufacturing, targeting Q2 2026 launch.
  • October 2025: Celestica opened a EUR 45 million (USD 50.9 million)-investment plant in Brno, Czech Republic, equipped with SMT, through-hole, and box-build lines.

Table of Contents for Electronic Manufacturing Services For Industrial Device Industry Report

1. INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2. RESEARCH METHODOLOGY

3. EXECUTIVE SUMMARY

4. MARKET LANDSCAPE

  • 4.1 Market Overview
  • 4.2 Market Drivers
    • 4.2.1 OEM Cost-Reduction Imperatives Sustain Outsourcing Momentum
    • 4.2.2 Growth of Industrial Automation and IIoT Hardware
    • 4.2.3 Rising Demand for AI-Ready Edge Controllers and Gateways
    • 4.2.4 Regulatory Push for Localized Supply Chains in North America and Europe
    • 4.2.5 Near-Shore Capacity Expansion in Mexico and Eastern Europe
    • 4.2.6 On-Site Box-Build Micro-Factories for Brownfield Plants
  • 4.3 Market Restraints
    • 4.3.1 Margin Pressure from Rising Skilled-Labor Costs
    • 4.3.2 Volatile Semiconductor Lead Times Disrupt Production Schedules
    • 4.3.3 Industrial Firmware IP-Protection Concerns
    • 4.3.4 Scope-3 Emissions Audits Increasing Compliance Costs
  • 4.4 Industry Value Chain Analysis
  • 4.5 Regulatory Landscape
  • 4.6 Technological Outlook
  • 4.7 Impact of Macroeconomic Factors on the Market
  • 4.8 Porter's Five Forces Analysis
    • 4.8.1 Threat of New Entrants
    • 4.8.2 Bargaining Power of Suppliers
    • 4.8.3 Bargaining Power of Buyers
    • 4.8.4 Threat of Substitutes
    • 4.8.5 Industry Rivalry

5. MARKET SIZE AND GROWTH FORECASTS (VALUE)

  • 5.1 By Service Type
    • 5.1.1 Electronic Manufacturing Services
    • 5.1.1.1 PCB Assembly
    • 5.1.1.2 Electromechanical Assembly / Box Build
    • 5.1.1.3 Prototyping
    • 5.1.1.4 Other Electronic Manufacturing Services
    • 5.1.2 Engineering Services
    • 5.1.3 Test and Development Implementation
    • 5.1.4 Logistics Services
    • 5.1.5 Other Service Types
  • 5.2 By Business Model
    • 5.2.1 Contract Manufacturing (CM)
    • 5.2.2 Original Design Manufacturing (ODM)
    • 5.2.3 Hybrid / Turnkey / Other Business Models
  • 5.3 By Manufacturing Process
    • 5.3.1 Surface Mount Technology (SMT)
    • 5.3.2 Through-Hole Technology (THT)
    • 5.3.3 Advanced Packaging / Hybrid Processes
  • 5.4 By Region
    • 5.4.1 North America
    • 5.4.1.1 United States
    • 5.4.1.2 Canada
    • 5.4.1.3 Mexico
    • 5.4.2 Europe
    • 5.4.2.1 Germany
    • 5.4.2.2 United Kingdom
    • 5.4.2.3 Rest of Europe
    • 5.4.3 Asia Pacific
    • 5.4.3.1 China
    • 5.4.3.2 Japan
    • 5.4.3.3 South Korea
    • 5.4.3.4 India
    • 5.4.3.5 South-East Asia
    • 5.4.3.6 Rest of Asia Pacific
    • 5.4.4 South America
    • 5.4.5 Middle East and Africa

6. COMPETITIVE LANDSCAPE

  • 6.1 Market Concentration
  • 6.2 Strategic Moves
  • 6.3 Market Share Analysis
  • 6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share for key companies, Products and Services, and Recent Developments)
    • 6.4.1 Foxconn Technology Group
    • 6.4.2 Jabil Inc.
    • 6.4.3 Flex Ltd.
    • 6.4.4 Pegatron Corporation
    • 6.4.5 Sanmina Corporation
    • 6.4.6 Celestica Inc.
    • 6.4.7 Benchmark Electronics Inc.
    • 6.4.8 Plexus Corporation
    • 6.4.9 Zollner Elektronik AG
    • 6.4.10 Venture Corporation Limited
    • 6.4.11 Universal Scientific Industrial Co. Ltd. (USI)
    • 6.4.12 BYD Electronics
    • 6.4.13 Wistron Corporation
    • 6.4.14 Quanta Computer Inc.
    • 6.4.15 Compal Electronics Inc.
    • 6.4.16 New Kinpo Group
    • 6.4.17 Fabrinet Inc.
    • 6.4.18 SIIX Corporation
    • 6.4.19 UMC Electronics Co. Ltd.
    • 6.4.20 Longcheer Holdings Ltd.
    • 6.4.21 Kaifa Technology

7. MARKET OPPORTUNITIES AND FUTURE OUTLOOK

  • 7.1 White-Space and Unmet-Need Assessment
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Global Electronic Manufacturing Services For Industrial Device Market Report Scope

The Electronic Manufacturing Services for Industrial Device Market refers to the provision of specialized manufacturing, engineering, testing, and logistics services for industrial devices. These services include PCB assembly, electromechanical assembly/box build, prototyping, and other related offerings.

The Electronic Manufacturing Services for Industrial Device Market Report is Segmented by Service Type (Electronic Manufacturing Services including PCB Assembly, Electromechanical Assembly/Box Build, Prototyping, Other Services; Engineering Services; Test and Development Implementation; Logistics Services; and Other Service Types), Business Model (Contract Manufacturing, Original Design Manufacturing, and Hybrid/Turnkey/Other Models), Manufacturing Process (Surface Mount Technology, Through-Hole Technology, and Advanced Packaging/Hybrid Processes), and Geography (North America, Europe, Asia Pacific, South America; and Middle East and Africa). The Market Forecasts are Provided in Terms of Value (USD).

By Service Type
Electronic Manufacturing ServicesPCB Assembly
Electromechanical Assembly / Box Build
Prototyping
Other Electronic Manufacturing Services
Engineering Services
Test and Development Implementation
Logistics Services
Other Service Types
By Business Model
Contract Manufacturing (CM)
Original Design Manufacturing (ODM)
Hybrid / Turnkey / Other Business Models
By Manufacturing Process
Surface Mount Technology (SMT)
Through-Hole Technology (THT)
Advanced Packaging / Hybrid Processes
By Region
North AmericaUnited States
Canada
Mexico
EuropeGermany
United Kingdom
Rest of Europe
Asia PacificChina
Japan
South Korea
India
South-East Asia
Rest of Asia Pacific
South America
Middle East and Africa
By Service TypeElectronic Manufacturing ServicesPCB Assembly
Electromechanical Assembly / Box Build
Prototyping
Other Electronic Manufacturing Services
Engineering Services
Test and Development Implementation
Logistics Services
Other Service Types
By Business ModelContract Manufacturing (CM)
Original Design Manufacturing (ODM)
Hybrid / Turnkey / Other Business Models
By Manufacturing ProcessSurface Mount Technology (SMT)
Through-Hole Technology (THT)
Advanced Packaging / Hybrid Processes
By RegionNorth AmericaUnited States
Canada
Mexico
EuropeGermany
United Kingdom
Rest of Europe
Asia PacificChina
Japan
South Korea
India
South-East Asia
Rest of Asia Pacific
South America
Middle East and Africa
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Key Questions Answered in the Report

What is the current value of the Electronic Manufacturing Services for Industrial Device market?

The market was valued at USD 99.51 billion in 2026 and is projected to reach USD 135.76 billion by 2031.

Which region is expanding the fastest?

Asia Pacific is expected to post a 7.57% CAGR through 2031, driven by India and Vietnam absorbing capacity from China.

Why are OEMs shifting to hybrid turnkey models?

Hybrid turnkey models bundle design-for-manufacturability and assembly, reducing OEM tooling outlays and accelerating product launches.

What manufacturing process is gaining share for edge-AI modules?

Advanced packaging and hybrid processes are projected to grow at a 7.13% CAGR, outpacing traditional SMT.

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