Wafer Cleaning Equipment Market Size

Wafer Cleaning Equipment Market Analysis

The Wafer Cleaning Equipment Market size is estimated at USD 9.10 billion in 2024, and is expected to reach USD 13.57 billion by 2029, growing at a CAGR of 8.33% during the forecast period (2024-2029).

Due to the massive demand for electronic components owing to amplified usage, the increasing measures to make electronic packaging highly resourceful have made wafer-cleaning equipment used in myriad applications.

• The growth in adopting smart and compatible devices and feasible networks is significantly aiding the development of the global wafer-cleaning equipment market. For instance, in June 2022, DISH informed that Project Genesis would be expanded to over 20% of the US population (in 120 cities across the USA) only 42 days after the initial launch. As such, it just met the FCC's interim deadline. The network is very developed, completely cloud-native, and reliant on Open RAN architecture.
• Furthermore, the increasing penetration of printed electronics and rising concern for upgrading and improving the semiconductor product quality and production standards in the semiconductor devices industry are some prominent factors behind the development of the Wafer Cleaning Equipment Market.
• In June 2022, NEO Battery Materials Ltd. signed a strategic Memorandum of Understanding (MoU) with Automobile & PCB Inc., a Korean company manufacturing printed circuit boards. Through this collaboration, both players will leverage NEO's technical expertise and the reputable and recognized network of A&P's related companies, YSP and Yongsan, to strengthen NEO's business network globally. Such activities for product development may further drive the growth of printed electronics, creating demand for studied market growth.
• An increase in demand for silicon-based sensors is anticipated to deliver lucrative possibilities for market expansion. Further, some vendors are already working toward increasing the production of SiC wafers. For instance, in August 2023, Infineon Technologies AG announced its plans to expand its manufacturing facility in Malaysia to establish 200 mm SiC fab. Such developments indicate the growing demand for wafer transition.
• Furthermore, Cree (Wolfspeed) is also elevating its production capacity for its Wolfspeed brand of power and radio frequency semiconductors, an ongoing strategy that grew when the company sold its lighting business to focus on SiC and GaN products. To meet the high demand in EVs, industrial markets, and mobile telecommunications, Cree is building a USD 1.2 billion 200mm SiC wafer fab in New York, where production began in 2022.
• The major challenge for the production of these materials is to control the environment, especially in the process of wafer cleaning, especially dust and biohazard waste are generated, which have a direct impact on the climate if they are not appropriately treated. Therefore different government regulations are made to consider how they must be handled to avoid such problems. Moreover, the need for a skilled workforce and strict and changing quality standards hinder the market growth.