Semiconductor Wafer Polishing and Grinding Equipment Market Share

Statistics for the 2023 & 2024 Semiconductor Wafer Polishing and Grinding Equipment market share, created by Mordor Intelligence™ Industry Reports. Semiconductor Wafer Polishing and Grinding Equipment share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

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Market Share of Semiconductor Wafer Polishing and Grinding Equipment Industry

The semiconductor wafer polishing and grinding equipment market is moderately consolidated and consists of certain major players. The market has gained a competitive edge over the past two decades. In terms of market share, few major players dominate the market, currently. Various vendors are continually updating their existing equipment for better efficiency.

  • June 2022 - Applied Materials announced that it had acquired Picosun Oy, a privately held semiconductor equipment company based in Finland. The acquisition was expected to broaden the Applied ICAPS (IoT, Communications, Automotive, Power and Sensors) product portfolio and customer engagements.
  • February 2022 - Revasum announced that it had secured a growth capital facility from SQN Venture Partners, LLC. The facility would provide up to USD 8 million in debt financing to accelerate new product development and provide working capital to support rapid growth.

Semiconductor Wafer Polishing and Grinding Equipment Market Leaders

  1. Applied Materials Inc.

  2. Ebara Corporation

  3. Disco Corporation

  4. Tokyo Seimitsu Co. Ltd. (Accretech Create Corp.)

  5. Revasum Inc.

*Disclaimer: Major Players sorted in no particular order

Semiconductor Wafer Polishing and Grinding Equipment Market Concentration

Semiconductor Wafer Polishing and Grinding Equipment Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)