Market Share of Power Module Packaging Industry
The power module packaging market is semi-consolidated, with the presence of major players like Fuji Electric Co. Ltd, Infineon Technologies AG, Mitsubishi Electric Corporation, Semikron Danfoss Holding A/s (Danfoss A/S), and Amkor Technology Inc. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.
- In December 2023, Infineon Technologies AG launched the 4.5 kV XHP 3 IGBT modules in response to the global push for downsizing and integration. The 4.5 kV XHP will fundamentally change the landscape for medium voltage drives (MVD) and transportation applications operating at 2000 to 3300 V AC in 2- and 3-level topologies.
- In August 2023, Fuji Electric Co. Ltd announced the launch of its 3rd-generation small IPM, the P633C Series, which helps reduce the power consumption of the equipment on which it is mounted, such as home appliances and machine tools. This product uses the latest seventh-generation IGBT/FWD chips, achieving a 10% reduction of power loss and a reduction of electromagnetic noise to approximately 1/3 compared with conventional products.
Power Module Packaging Market Leaders
Fuji Electric Co. Ltd
Infineon Technologies AG
Mitsubishi Electric Corporation
Semikron Danfoss Holding A/S (Danfoss A/S)
Amkor Technology Inc.
*Disclaimer: Major Players sorted in no particular order
