Dynamic Random Access Memory (DRAM) News

Related Semiconductors Industry News

• October 2023 - Codasip announced a new highly configurable family of RISC-V baseline processors for unlimited innovation. The family, called the 700 family, includes applications and embedded cores. The 700 family complements Codasip's popular embedded cores and provides a different starting point to meet higher performance requirements.
• October 2023 - Qualcomm and Google announced a strategic partnership to make RISC-V chips for wearable devices like smartwatches. Qualcomm commercializes the RISC-V-based wearables solution globally, including in the United States, and it will help products within the Android ecosystem take advantage of custom processors that are low power and high performance.

• April 2024: Panasonic Corporation established a new production technology development base in Suminoe, Osaka, to accelerate productivity improvement and respond to further production expansion. In 2025, the company intends to establish a new R&D base in Kadoma, Osaka, to expedite the upstream development of next-generation batteries and their materials. The company is expected to invest resources into the R&D of batteries at these locations at the group level.
• December 2023: KYOCERA AVX Components Corporation added a new 100mF/3V rating to its TWD High-Temp Max-Cap (HTMC) Series hermetically sealed and axial leaded DLA T4-size wet tantalum capacitors. The TWD HTMC Series delivers extremely high capacitance values, as well as high-reliability and stable long-lifetime performance in oil and gas, defense, industrial, and avionics applications exposed to environmental hazards including mechanical shock, high-frequency vibration, and operating temperatures up to 175°C.

• June 2023 - Delta Electronics announced the expansion in India with USD 12.89 billion, offering a range of charging stations, including AC mini chargers, DC chargers, and fast chargers. The company has installed 8,000 EV chargers in India. The company aims to hold a 40% market share in EV charging.
• December 2023 - CUI Inc., a part of the Bel group, introduced three chassis mount AC-DC power supplies: VGS-500, VGS-350D, and VGS-200E. These compact units, including harsh environments and electric vehicle chargers, are ideal for industrial and IoT applications. With universal input voltage (85-305 VAC or 120-430 VDC) and wide operating temperature (-40°C to +85°C), they surpass competitors. The VGS-200E boasts an impressive MTBF rating of up to 300,000 hours. All models feature easy installation and EN 62368 safety certification, suitable for altitudes up to 5,000 m.

• December 2023 - Panasonic Industrial Automation and Mouser Electronics, the authorized global distributor of the latest electronic components and industrial automation products, entered a distribution agreement. According to the terms of the agreement, Panasonic Industrial Automation will provide customers with a wide range of integrated solutions for automation markets ranging from automotive to semiconductor, packaging to bio-medical.
• December 2023 - Tokyo Electron announced that it developed an Extreme Laser Lift Off (XLO) technology that contributes to innovations in the 3D integration of advanced semiconductor devices adopting permanent wafer bonding. This new technology for two permanently bonded silicon wafers uses a laser to separate the top silicon substrate from the bottom substrate with an integrated circuit layer.

• December 2023: Tokyo Electron announced that it has developed an Extreme Laser Lift Off (XLO) technology that contributes to innovations in 3D integration of advanced semiconductor devices adopting permanent wafer bonding. This new technology for two permanently bonded silicon wafers uses a laser to separate the top silicon substrate from the bottom substrate with an integrated circuit layer.
• December 2023: Semiconductor test equipment provider Advantest Corporation has unveiled two products addressing the evolving needs of the artificial intelligence (AI) and high-performance computing (HPC) markets. The HA1200 die-level handler, part of the V93000 SoC test system, efficiently tests singulated, partially assembled die in 2.5D/3D advanced packaging technologies, minimizing yield loss and contributing to AI/HPC market growth. Additionally, the active thermal control (ATC) 2-kilowatt (kW) option for the M487x handler series enables final testing of AI/HPC IC packages, featuring advanced temperature sensing and force control technologies to ensure safe and stable contact with ICs. These innovations cater to the rising demand for high-performance ICs driven by applications in data centers, automotive, and defense.

• August 2023 - Winbond Electronics Corporation and Mobiveil recently formed a partnership to develop a cutting-edge IP controller designed for a wide range of applications, including Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless Headsets, Smart Speakers, and Connectivity. In this collaboration, Mobiveil has successfully integrated its HYPERRAM Controller with Winbond's innovative HYPERRAM device, which boasts impressive capabilities such as speeds of up to 250MHz and support for densities ranging from 32 Mb to 512 Mb in x8/x16 modes. This collaboration aims to deliver enhanced performance and functionality to meet the evolving needs of various industries.
• May 2023 - The completion of the industry's most advanced 1bnm, the fifth generation of the 10nm process technology, was announced by SK Hynix Inc. Additionally, a joint evaluation of 1bnm and validation in the Intel Data Center Certified memory program for DDR5 products targeted at Intel Xeon Scalable platforms was initiated by the company and Intel. This development follows SK Hynix's achievement of 1anm readiness and successful completion of Intel's system validation of the 1anm DDR5, the fourth generation of the 10nm technology.

• November 2023: The Huawei Asia Pacific Partners Conference 2023 was held in Shenzhen. The Conference championed an open mindset, bringing together Huawei's partners and customers in the ICT industry across the Asia-Pacific region. During the event, Huawei launched a series of new products and solutions for the area, such as intelligent cloud networks and storage products. 
• March 2023: Western Digital WDC and Kioxia Corporation announced their joint collaboration to introduce their latest 3D flash memory technology made through advanced scaling and wafer bonding technologies. This technology is suitable for managing exponential data expansion and data-centric applications, such as IoT devices, smartphones, and data centers. This new product is the eighth-generation BiCS FLASH, which reportedly has the industry's highest bit density owing to its 218-layer 3D flash that leverages 1Tb triple-level-cell as well as quad-level-cell with four planes that have helped the company to improve bit density by more than 50%,

• December 2023 - STMicroelectronics announced that it signed a long-term silicon carbide (SiC) supply agreement with Li Auto. Under this agreement, STMicroelectronics will provide Li Auto with SiC MOSFET devices to support Li Auto’s strategy around high-voltage battery electric vehicles (BEVs) in various market segments.
• November 2023 - Mitsubishi Electric Corporation announced that it will enter into a strategic partnership with Nexperia B.V. to jointly develop silicon carbide (SiC) power semiconductors for the power electronics market. The company is expected to leverage its wide-bandgap semiconductor technologies to develop and supply SiC MOSFET chips that Nexperia will use to develop SiC discrete devices.

• October 2023: Advanced Semiconductor Engineering Inc. (ASE) announced the launch of its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to boost advanced package architecture across its VIPack platform systematically. This innovative approach allows a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory for integration using 2.5D or advanced fanout structures.
• June 2023: Amkor Technology Inc., a significant provider of semiconductor packaging and test services and the automotive OSAT, is innovating advanced packaging to enable the car of the future. The evolution of the enhanced automotive experience has been dramatic over the past few years, a rise evidenced in car-related semiconductor sales. As a frequent automotive OSAT with more than 40 years of automotive experience and a broad geographic footprint supporting global and enabling regional supply chains, Amkor is well-positioned to capture growth from the acceleration of car semiconductor content.

• October 2023: Vitesco Technologies and Infineon Technologies AG announced the reinforcement of their longstanding collaboration. In the forthcoming generation of master and zone controllers for electric-electronic vehicle architectures (E/E architectures), as well as in their new electrification system solutions, Vitesco Technologies will incorporate the AURIX TC4x microcontroller family from Infineon. This strategic partnership, set to commence in 2027, is expected to span multiple years.
• September 2023: Intelligent Hardware Korea (IHWK), an AI solutions provider, recently disclosed its ongoing development of a neuromorphic analog computing platform for neurotechnology devices and field programmable neuromorphic devices. In collaboration with Microchip Technology, IHWK aims to leverage the company's silicon storage technology to create this advanced computing platform. Additionally, Microchip Technology will contribute by offering an evaluation system for its SuperFlash memBrain neuromorphic memory solution.