Automotive Semiconductor News

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• December 2023 - Sahasra Electronics, a Noida-based company, revealed its intention to allocate approximately INR 350 crore (USD 42.2 million) over the next three years. The investment will be directed toward establishing a semiconductor packaging facility and expanding manufacturing operations as part of the 'Make in India' initiative. The company plans to acquire electronic assembly machines, resulting in an investment exceeding INR 150 crore (USD 18.1 million) for the plant, while an additional INR 50 crore (USD 6 million) will be dedicated to the interior of the building. Such investments in boosting the semiconductor packaging and assembly services are expected to increase the market’s potential.
• November 2023 - JCET Automotive Electronics (Shanghai) Co. Ltd is scheduled to receive a capital injection of RMB 4.4 billion (USD 0.61 billion), resulting in a total registered capital of RMB 4.8 billion (USD 0.67 billion). This investment will hasten the establishment of an advanced packaging facility for automotive chip products in the Lingang Special Area of Shanghai.

• May 2023: Infineon Technologies AG launched the OptiMOS7 40V MOSFET family, its latest generation of power MOSFETs for automotive applications in various lead-free and robust power packages. The new family combines 300 mm thin-wafer technology with innovative packaging to deliver significant performance benefits in tiny packages. It makes the MOSFETs ideal for all standard and future automotive 40V MOSFET applications, such as electric power steering, braking systems, disconnect switches new zone architectures.
• May 2023: Toshiba Electronics Europe launched a new 150V N-channel power MOSFET based upon their latest generation U-MOS X-H Trench process. The TPH9R00CQ5 is specifically designed for high-performance switching power supplies such as those used in communication base stations and other industrial applications.

• June 2023 - SK Siltron announced the signing of an MoU with Nanya Technology to pursue ESG excellence and carbon neutrality. The two companies plan to jointly create a standardization platform for exchanging carbon footprint data and measuring total greenhouse gas emissions from production. By obtaining complete and accurate CO2 equivalent data, the platform can also help the supply chain identify the main sources of greenhouse gas emissions and find effective solutions to reduce their carbon footprint.
• May 2023 - TankeBlue announced that it had signed a strategic agreement with Infineon Technologies AG to supply SiC wafers and boules. This will also promote the rapid development of the new semiconductor material SiC. The first phase of the agreement will focus on 150 mm thick SiC material, but TanKeBlue will also supply 200 mm thick SiC material to support Infineon's transition to 200 mm thick wafers.

• June 2023 - Nidec Corporation and Renesas Electronics Corporation announced a collaboration to develop semiconductor solutions for a next-generation E-Axle (X-in-1 system) that integrates an EV drive motor and power electronics for electric vehicles (EVs).
• June 2023 - SK Hynix Inc. announced that the company had received the automotive ASPICE Level 2 certification for automotive memory solution development. The accreditation, essential for automotive NAND solution products, is expected to increase the supply and stronger profitability of the company's NAND solution products, such as Universal Flash Memory and Solid State drive.
• October 2022: Micron Technology Inc. intended to invest up to USD 100 billion over the coming 20-plus years to construct a new mega fab in Clay, New York, with the first phase investment of USD 20 billion planned by the end of the following decade. Micron's New York mega fab is part of its strategy to gradually increase American-made leading-edge DRAM production to 40 percent of its global output over the next decade. Micron's DRAM production in the United States benefits its customers tremendously, enabling them to build innovative products.
• June 2022: NXP Semiconductors NV announced new processor families that extend the benefits of the company's innovative S32 automotive platform with high-performance real-time processing and safety. The S32E and S32Z processor families help the automotive industry boost the integration of diverse real-time applications for domain and zonal control, vehicle electrification, and safety processing that are critical for safer and more efficient vehicles.
• June 2022: Renesas Electronics Corporation developed circuit technologies for 22 nm embedded STT-MRAM with faster read and write execution for microcontrollers in IoT applications. The test chip includes a 32-megabit embedded MRAM memory cell array and executes 5.9 nanosecond random read credentials at a maximum junction temperature of 150°C and a write throughput of 5.8-megabyte-per-second.

• May 2023: ANELLO Photonics announced a partnership with NVIDIA Inception to nurture start-ups that radically change industries with advances in technology. In order to produce low noise and low drift optical sensors, the company uses ANELLO's patented photonic gyroscope integrated circuit technology.
• August 2022: DustPhotonics announced a partnership with MaxLinear In order to demonstrate exceptional overall system performance in silicon photonics chipset with integrated lasers directly driven from a DSP without using an external driver chip.
• March 2022: Source Photonics announced the sampling of its Silicon-Photonics 400G DR4 QSFP56-DD products at OFC 2022 from March 6-10. SiliconPhotonic 400G DR4 transceivers have been designed in such a way as to enable seamless interaction with the company's pump laser chip. They exceed the specifications for IEEE 802.3bs 400GBASE-DR4 optical interface and 400G AUI-8 electrical client interface. They support a connection to 100 GB ASEDR1 and 100 GB ASEFR1 from more than 500m and 2km in length. With 8 W typical power consumption, it uses the 7 nm DSP and is packaged in a type 2 FP QSDD form factor with an MPO-12 connector.

• December 2022 - EPC and Vanguard International Semiconductor Corporation (VIS) announced a multi-year production agreement for gallium nitride-based power semiconductors in December 2022. EPC will take advantage of VIS' 8-inch (200 mm) wafer fabrication capabilities, which is expected to significantly increase manufacturing capacity for EPC's high-performance GaN transistors and integrated circuits. Production will begin in early 2023.
• November 2022 - Hua Hong Semiconductor Ltd received regulatory approval for a USD 2.5 billion IPO in Shanghai. The planned initial public offering (IPO) comes as China's chip companies gear up for steeper competition with the United States due to geopolitical tensions. Due to this, Hua Hong intends to use the money to invest in a new fabrication plant - or fab - in the eastern city of Wuxi, with construction set to begin in 2023 and an eventual production capacity of 83,000 wafers per month.

• June 2022 - Taiwan's GlobalWafers Co Ltd announced spending USD 5 billion on a new plant in Texas to make 300-millimeter silicon wafers used in semiconductors. With the global chip shortage and ongoing geopolitical concerns, GlobalWafers is taking this opportunity to address the resiliency of the United States semiconductor supply chain.
• April 2022 - Shin-Etsu Chemical Co. Ltd declared that the pricing of all of its silicone goods would increase by 10%, and one of Shin-core Etsu's business areas would be raised in Japan and across the world. As a result, the significant price rise is still going on. Furthermore, transportation costs are increased in both the acquisition of raw materials and the distribution of finished goods.

• May 2022: A 200 mm (8) epiwafer for vertical-cavity surface-emitting laser (VCSEL) diodes was created by IQE in Wales. The cost of the laser for 3D sensors is expected to be drastically reduced by switching to a 200 mm compound semiconductor epi wafer. New foundry relationships may result from this, particularly those with high-volume silicon-based foundries that use 200 mm machinery. This may make it possible for compound semiconductors to be integrated into silicon, opening up a wider choice of devices and applications.
• May 2022 - JX Nippon Mining & Metals Corporation company concluded a financing agreement with the Japan Bank for International Cooperation to procure the funding needed to strengthen its business in the manufacturing of sputtering targets for semiconductors in the United States of America.

• June 2022: RIBER, a global market player for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, announced an order for a multi-4' GSMBE 49 production system. The new generation of datacom devices requires highly precise control of the epitaxial growth process, which is achieved by the recognized performance of Riber's machines and by the sophistication of the machine's control software. The ordered machine is expected to be delivered in 2023.
• June 2022: Veeco announced that the Taiwan semiconductor research institute, National Applied Research Laboratories, selected Veeco's propel R&D Metal Organic Chemical Vapor Deposition System. The single wafer platform is ideal for high-volume manufacturing, 300 mm capabilities, and research and development applications.

• March 2022 - KioxiaCorporation, a provider of memory solutions, announced it would start construction of an advanced new fabrication facility at its KitakamiPlant in Japan for the possible expansion of manufacturing of its proprietary 3D Flash memory BiCSFLASHTM. Construction of this facility is planned to commence in April 2022 and is expected to be completed in 2023.
• December 2021 - Micron Technology announced plans for its new memory design center in Midtown Atlanta, the United States, expanding the company's reach into the Southeast United States. Micron aims to establish strong partnerships with many institutions in the region including Georgia Tech, Emory University, Spelman College Morehouse College, and the University of Georgia.