Market Size of APAC Die Attach Equipment Industry
| Study Period | 2019 - 2029 |
| Base Year For Estimation | 2023 |
| Forecast Data Period | 2024 - 2029 |
| Historical Data Period | 2019 - 2022 |
| CAGR | 15.30 % |
| Market Concentration | Medium |
Major Players
*Disclaimer: Major Players sorted in no particular order |
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APAC Die Attach Equipment Market Analysis
The Die attach equipment market is expected to register a CAGR of 15.3% over the forecast period. The market is expected to benefit from assembly and packaging opportunities created by the below-mentioned trends.
- A significant focus for the next investment round by market vendors is developing die bonding and packaging solutions for smaller and highly complex 5G compatible smartphones. 5G is a unifying connectivity platform for future innovation, enabling continuous secure cloud access at significantly higher data and video transmission speeds.
- User adoption of 5G capabilities expands mobile broadband activities and accelerates artificial intelligence usage for the Internet of Everything. Likewise, the substrate and wafer-level packaging processes for mobile internet, computing, 5G, and automotive end-user applications drove the semiconductor industry to see a recovery in capital investment for memories and logic.
- The company has shared plans for a medium-to-long-term increase in capital investment towards expanded semiconductor and FPD applications. Whereas, as per Shibaura, active development of high-speed, high-precision bonding equipment for FOWLP / PLP and μLED is being looked out for in semiconductor assembly equipment.
- BESI has shared plans to invest in new assembly technologies such as FOWLP, TCB, TSV, ultra-thin dies, hybrid bonding, large area, wafer level molding, solar, and 3D-lithium-ion battery plating for the new digital society. Its lineup under Die attach equipment includes a single chip, multi-chip, multi-module, flip chip, TCB, FOWLP, hybrid die bonding systems, and die sorting systems.
- However, one source of concern is the continuing uncertain outlook due to the impact of the global spread of COVID-19. Lockdowns and production halts across Asia-pacific due to the COVID-19 outbreak had significantly impacted the production and consumption of semiconductors. With the majority of the IDS and foundries located in the region, the impact of shutdowns has led to reduced spending on capital investments. This is likely to impact the market studied, with a slowed recovery expected across 2021.
