Market Share of APAC Die Attach Equipment Industry
The APAC Die attach equipment market is moderately competitive, with a large number of players having a small market share. The companies keep innovating and entering into strategic partnerships to maintain their market share.
- April 2022 - Driving the Electric Revolution Industrialization Centre (DER-IC) North East has received equipment from Inseto, a top technical distributor of tools and materials, to improve its power electronics, machines, and drives (PEMD) capabilities. The first micro-punch machine to be installed in the UK is an AMX P100 sinter press, which is part of the equipment provided and will allow the production of high-reliability, high-power modules.
- June 2022 - The new 7KF Bonder Series has been developed by West Bond. This well-known company designs and manufactures a line of wire bonding and die-to-attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry. This excellent tool is made to handle the difficult bonding applications found in the RF, microwave, semiconductor, hybrid, and medical device fields.
APAC Die Attach Equipment Market Leaders
Palomar Technologies, Inc.
Shinkawa Ltd.
Panasonic Corporation
ASM Pacific Technology Limited
Be Semiconductor Industries N.V.
*Disclaimer: Major Players sorted in no particular order
