3D IC Packaging Market Share

Statistics for the 2023 & 2024 3D IC Packaging market share, created by Mordor Intelligence™ Industry Reports. 3D IC Packaging share report includes a market forecast to 2029 and historical overview. Get a sample of this industry share analysis as a free report PDF download.

Home Market Analysis Technology, Media and Telecom Research Semiconductors Research Semiconductor Packaging Research 3D IC Packaging Industry Market Share

Market Share of 3D IC Packaging Industry

The Global 3D IC Packaging Market is fragmented due to the presence of significant players such as Amkor Technology Inc., ASE Group, and Siliconware Precision Industries Co. Ltd (SPIL), among others. The market players must constantly innovate advanced and comprehensive products to stay relevant.

  • In May 2021: Intel plans to invest USD 3.5 billion to upgrade its Rio Rancho plant and increase its headcount by more than 35% at the sprawling complex, one of its three largest US manufacturing hubs. It is expanding its New Mexico operations to manufacture new generations of chips based on its Foveros 3D packaging technology, which could aid the company's attempts to regain its leadership status in the semiconductor industry.

3D IC Packaging Market Leaders

  1. Taiwan Semiconductor Manufacturing Company

  2. Samsung Electronics Co., Ltd.

  3. Intel Corporation

  4. ASE Technology Holding Co., Ltd.

  5. Amkor Technology

*Disclaimer: Major Players sorted in no particular order

Market concentration 3D.png

3D Integrated Circuit Packaging Market Report Snapshots

3D IC Packaging Market Size & Share Analysis - Growth Trends & Forecasts (2024 - 2029)