Sputtering Equipment Cathode Market Size

Sputtering Equipment Cathode Market Analysis

The Sputtering Equipment Cathode Market size is estimated at USD 1.22 billion in 2024, and is expected to reach USD 1.62 billion by 2029, growing at a CAGR of 5.91% during the forecast period (2024-2029).

The increasing applications of sputtering in the coating of components in the rapidly growing semiconductor industry is expected to be one of the primary factors that will drive the demand for these types of equipment over the forecast period.

• The emergence of Artificial Intelligence across various end-user industries, such as aerospace and electronics, is expected to increase the demand for semiconductors, which will drive the market's growth. Moreover, the increasing use of semiconductors for implementing virtual reality in gaming is further expected to drive market growth.
• As companies move toward leveraging next-generation manufacturing methods, the processes such as magnetron sputtering technology are increasingly adopted by semiconductor manufacturing companies for enhanced efficiency and quality of semiconductors.
• Magnetron sputtering technology offers advantages such as high deposition rates, high purity films, extremely high adhesion of films, excellent coverage of steps and small features, ability to coat heat-sensitive substrates, ease of automation, high uniformity on large-area substrates, ease of sputtering any metal, alloy, or compound, and many more. These advantages lead to increased use of magnetron sputtering technology in the sputtering of semiconductors.
• The advancement in technology and increased investment in the research and development of new and alternate techniques in the manufacturing of semiconductors provide advantages such as enhanced performance, increased production rate, and many more, reducing the use of physical vapor deposition (PVD) methods. This impacts the market studied.
• The outbreak of the COVID-19 pandemic across the world significantly disrupted the supply chain and production of products in the market during the initial phase of 2020. Due to labor shortages, many of the package and testing plants in the various region reduced or even suspended operations. This also created a bottleneck for companies that depend on such back-end packages and testing capacity.
• Furthermore, the increased number of initiatives taken by major players, such as continuous investments in R&D to develop new manufacturing processes, is further expected to enhance the volume output of the process.