Semiconductor Packaging News

Related Semiconductors Industry News

• November 2023 - JCET Group announced that its holding company, JCET Automotive Electronics (Shanghai) Co., Ltd., will receive a capital increase of RMB 4.4 billion (USD 0.61 billion), bringing its registered capital to RMB 4.8 billion (USD 0.67 billion). The investment aims to accelerate the construction of an advanced packaging factory for automotive chip products in Shanghai's Lingang Special Zone.
• September 2023 - Intel Corporation announced the launch of a glass substrate for next-generation advanced packaging. This product enables further scaling of transistors in a package to enable data-centric applications and advances Moore's Law, which states that the number of transistors in an integrated circuit (IC) doubles approximately every two years. 

• October 2023: Samsung introduced its next-generation memory solutions on Memory Tech Day, with the aim of playing a significant role in offering advanced artificial intelligence models for hyperscale applications. The company has unveiled a range of cutting-edge memory solutions, such as the latest Shinebolt HBM3e memory, the LPDDR5X CAMM2 solutions based on LPDDR package modules, and the detachable AutoSSD that can be conveniently used through storage virtualization. This innovative chip has the potential to revolutionize the future PC and laptop DRAM market.
• August 2023: SK Hynix Inc. has sparked competition in the semiconductor technology race with its latest next-generation high-bandwidth memory (HBM). SK Hynix has successfully created the 5th generation DRAM product, known as HBM3E, specifically designed for high-performance artificial intelligence (AI) applications. HBM is a valuable and high-performance chip that improves data processing speed by vertically linking multiple DRAMs, surpassing the capabilities of conventional DRAMs.

• May 2023: CEVA Inc. announced the acquisition of the RealSpace 3D Spatial Audio business, technology, and patents from VisiSonicsCorporation. Based in Maryland, close to CEVA's sensor fusion R&D development center, the VisiSonicsspatial audio R&D team and software expand the Company's application software portfolio for embedded systems, bolstering CEVA's strong market position in wearables, where spatial audio is fast becoming a must-have component.
• March 2023: Synopsys launched a groundbreaking suite of AI-powered electronic design automation tools that spans the entire chip design process, from architecture to manufacturing. Known as the Synopsys.ai suite, it offers the potential to reduce development time significantly, cut costs, enhance performance, and improve yields. These tools are precious for chip designs targeting advanced nodes like 5 nm, 3 nm, two nm-class, and beyond.

• September 2022 - Showa Denko K.K. (SDK) announced its merger with Showa Denko Materials Co., Ltd. (SDMC) on January 1, 2023, to form "Resonac." Resonac Holdings Corporation will replace SDK as a holding company, while Resonac Corporation will replace SDMC as an operational corporation. Through ongoing restructuring efforts, the Showa Denko Group intends to establish a significant chemical firm with cutting-edge functional materials.
• August 2022 - Indium Corporation introduced products from its GalliTHERM line of gallium-based liquid metals solutions. The company's over 60 years of expertise in producing liquid metals based on gallium are incorporated into this cutting-edge product range.

• May 2022: Siemens Mobility and Mitsubishi Electric Europe B.V. signed an agreement to collaborate in the SiC intelligent power module (IPM) technology to enable efficient and sustainable mobility and electrical energy savings in the transportation sector.
• April 2022: Infineon Technologies launched a 600V, 15A intelligent power module (IPM) for home appliances, focusing on drives for room air conditioners. The company's CIPOS Tiny IM323-L6G module is based on TRENCHSTOP IGBT RC-D2 transistors with an SOI gate driver technology and built-in diode to boost efficiency and reliability while reducing the cost and system size.
• April 2022: Applied Science and Technology Research Institute (ASTRI), Hong Kong, ASM Pacific Technology Limited (ASMPT), and Alpha Power Solutions Co., Ltd. (APS) jointly developed the industry's first 'Made in Hong Kong' Silicon Carbide (SiC) Intelligent Power Module (IPM) for electric vehicles (E.V.s). These IPMs offer several advantages over their silicon counterparts, including voltage resistance, high switching speed, and superior thermal performance, among the crucial requirements for next-generation E.V.s.

• December 2022 - Canon Inc. launched an i-line lithography stepper for 3D advanced packaging, such as those used with chiplets mounted on an interposer. The FPA-5520iV LF2, based on 365nm wavelength light, is optimized for back-end processing and delivers 0.8-micron resolution across a 52 mm by 68 mm single-exposure field. A four-shot mode extends the area to 100 mm by 100 mm.
• November 2022 - EVG (EV Group), a provider of lithography equipment and wafer bonding for the MEMS, nanotechnology, and semiconductor markets, strengthened its optical lithography solutions portfolio with the launch of the next-generation 200-mm version of its EVG 150 automated resist processing system.

• November 2022: Micron, a memory chip manufacturer, stated that mass production of its new high-capacity, low-power 1-beta dynamic random access memory (DRAM) chips began at its Hiroshima, Japan factory.
• July 2022: Electronics firm Sahasra Semiconductors announced that the company planned to invest Rs. 750 crores (USD 91.51 million) in setting up the unit in Rajasthan, India. The company aimed to invest 150 crores (USD 6.10 million) in 2022 for setting up the ATMP facility in the manufacturing cluster of Elcina in Bhiwadi, Rajasthan, and after touching a revenue of more than 250 crores (USD 30.50 million), the company will again invest 600 crores (USD 73.21 million).

September 2022 - Samsung launched Galaxy Tab Active4 Pro Tablet for industrial use. The tablet is embedded with Snapdragon 778G processor from Qualcomm, with a processor speed of 2.4 GHz, and Octa Core with Adreno 642L GPU for high performance. There are two memory variables with 64GB and 128G and a large battery capacity of 7600 mAh. One of the exclusive features of this device is it lets field workers it with their gloves on or even when their hands are wet. The device has passed the military-grade certification and is sleek and lightweight.

January 2023 - Xiaodu introduced an Optical Eye Protection Learning Tablet in China. This Z20 Pro Zhixue Edition has a second-generation display with characteristics similar to paper's. Thus staring at them for extended periods won't be painful for the user's eyes. The tablet is equipped with the AI platform Baidu Brain 7.0, which supports AI computing power and algorithms with educational scenarios to help children learn efficiently. There is also an octa-core CPU and fast charging support of 20W with 9000 mAh battery life.

• May 2022: IBM and SAP announced the extension of their collaboration as IBM embarks on a corporate transformation initiative to optimize its business operations using RISE and SAP S/4HANA Cloud. To execute work for over 1,000 legal entities in more than 120 countries and multiple IBM companies supporting hardware, software, consulting, and finance, IBM said it is transferring to SAP S/4HANA, SAP's most recent ERP system, as part of the extended relationship. The replacement for SAP R/3 and SAP ERP, SAP S/4HANA, is SAP's ERP system for large businesses. It is intended to work optimally with SAP's in-memory database, SAP HANA.
• November 2022: Redis, a provider of real-time in-memory databases, and Amazon Web Services have announced a multi-year strategic alliance. Redis is a networked, open-source NoSQL system that stores data on disk for durability before moving it to DRAM as necessary. It can function as a streaming engine, message broker, database, or cache. The business claims that when Redis is used as a database, apps may instantly search across tens of millions of rows of customer data to locate information specific to one particular customer. A managed database-as-a-service product on AWS is called the real-time Redis Enterprise Cloud.
• December 2022: The National Stock Exchange, the largest stock exchange in India, chose the Raima Database Manager (RDM) Workgroup 12.0 in-memory system as a foundational component for the next iterations of its trading platform front-end, the National Exchange for Automated Trading (NEAT).

• December 2022 - JTEKT demonstrated a new double-disc horizontal grinder, DXSG320, that can simultaneously grind both sides of silicon wafers to +/- 1 micron from as-sliced condition. The performance of the new grinder represents a significant improvement in accuracy and productivity over the single-spindle vertical grinders common in the chip industry today.
• March 2022 - DISCO Corporation announced the opening of its Haneda R&D Center in Higashikojiya, Ota-ku, Tokyo, with the aim of strengthening R&D and supporting high demand in the semiconductor and electronic components markets in the future.