Semiconductor Bonding Equipment Market Size

Semiconductor Bonding Equipment Market Analysis

The Semiconductor Bonding Equipment Market size is estimated at USD 542.38 million in 2024, and is expected to reach USD 689.03 million by 2029, growing at a CAGR of 4.90% during the forecast period (2024-2029).

Semiconductor bonding equipment finds application owing to the rising demand for semiconductor chips with higher efficiency, processing power, and smaller footprint, thereby driving the demand for the market during the forecast period.

• As the impact of digitalization has increased, semiconductor markets have boomed. Notably, this has further resulted in government programs to support the 5G deployment. For instance, the European Commission recognized the importance of the 5G network early and established a public-private partnership to develop and research 5G technology. 
• With chip demand set to surge over the coming decade, the global semiconductor industry is expected to become a trillion-dollar industry by 2030. This growth is favored by companies and countries funneling vast sums of money into semiconductor manufacturing, materials, and research to guarantee a constant supply of chips and know-how to support growth across a broad swath of increasingly data-centric industries.
• The semiconductor industry, which makes crucial technological components, has been hitting the headlines due to a rampant demand increase. A recent Wall Street Journal report shows that semiconductors rank as the world's fourth-largest traded product (imports and exports, counted), after crude oil, refined oil, and cars. This is because semiconductors are critical for high-computing applications in various industries, including electronics and manufacturing industries, agriculture, healthcare, infrastructure, entertainment, transportation, telecommunications, military systems, energy management, and space, to name just a few.
• Several methods might be used when a product needs the bonding of two dies or wafers. Not only does the type of bonding method itself have to be selected, but it must also be decided whether the items being bonded will be in wafer or die form. The selected bonding process is the primary driver for the cost of ownership of bonding. For a given process, the three most important factors are the cost of the upstream process needed for bonding, the cycle time of the bonding process, and the yield of the bonding process.
• With the global outbreak of the pandemic and restrictive measures taken to control the spread of COVID-19, the global supply chain of the semiconductor bonding equipment industry was significantly disrupted, impacting the production capabilities of various companies. Although the number of COVID-19-infected patients decreased considerably, salient issues with materials supply and demand for these components still need to be addressed, challenging the market's growth.