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• September 2023: MediaTek and TSMC announced the successful development of its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected in 2024. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their chip design and manufacturing strengths to create flagship SoCs with high-performance and low-power features jointly, empowering global end devices.
• April 2023: Broadcom Inc. announced the production of Jericho3-AI, enabling the industry’s highest-performance fabric for artificial intelligence (AI) networks. Jericho3-AI revolutionizes AI networking with best-in-class capabilities such as perfect load balancing, congestion-free operation, ultra-high radix, and Zero-Impact Failover, culminating in significantly shorter job completion times for any AI workload.

• May 2023 - Honeywell and Arcadis announced a partnership to offer tools and services to help optimize energy use and carbon emissions in commercial buildings globally. Honeywell offers smart-building technologies that utilize machine learning and artificial intelligence (ML/AI)-enabled software to enhance control systems with sensor-driven analytics, occupancy tracking, and predictive maintenance. 
• March 2023 - AVUITY, a significant provider of innovative workplace technology and space utilization solutions, announced the release of its most recent line of sensors, which are expected to revolutionize the industry due to their exceptional accuracy and efficiency. The latest VuAI sensors incorporate cutting-edge technology and advanced algorithms to provide unrivaled real-time data collection and analysis precision. These cutting-edge sensors can detect occupancy and utilization as well as minute variations in temperature, light, noise, and humidity.

• April 2023: Yageo Corp has announced to invest EUR 205 million (USD 224.9 million) in North Macedonia over the course of the next decade. This esteemed company, renowned for its provision of passive components, including chip resistors, inductors, tantalum capacitors, and multi-layer ceramic capacitors, has expressed its intention to establish manufacturing facilities in the Technological Industrial Development Zones (TIDZs) situated in the capital city of Skopje, as well as the eastern city of Stip.
• February 2023: Vishay Intertechnology introduced a new line of surface-mount polymer tantalum-molded chip capacitors called vPolyTan. The automotive-grade polymer tantalum capacitors are designed to function better in extreme temperature and humidity environments. The T51 series is AEC-Q200 approved and boasts lower equivalent series resistance (ESR), lower voltage derating, and a benign failure mode. The capacitors provide ultra-low ESR from 120 m to 40 m at 25 °C when used with a highly conductive polymer cathode structure.

• August 2022 - ON Semi announced the inauguration of its silicon carbide (SiC) facility in Hudson, New Hampshire. The site is expected to increase its production capacity by five times year-over-year and almost quadruple its employees in Hudson by the end of 2022.
• June 2022 - Analog Devices Inc. announced the availability of an 800MHz to 12.8GHz synthesizer for high-performance ultra-wideband data converter and synchronization applications. By providing an ultra-clean clock source to drive the signal sampling process, the new ADF4377 synthesizer achieves excellent signal-to-noise performance.
• June 2022 - ams OSRAM has launched a new combined ambient light (ALS) and proximity sensor, providing accurate illuminance measurements and color and reliable proximity detection even when operating behind the most delinquent smartphones' high-speed, high-definition OLED screens.
• June 2022 - Vitesco has signed an agreement with Infineon Technologies to supply silicon carbide power semiconductors. The new partnership with Infineon also includes the targeted development of SiC devices specifically for Vitesco's e-mobility applications.
• May 2022 - ON Semi announced that NIO Inc., a global automotive manufacturer, chose its latest VE-Trac Direct SiC power modules for its next-generation electric vehicles. The silicon carbide (SiC)-based power modules enable more extended range, higher efficiency, and faster acceleration for EVs.
• April 2022 - Wolfspeed announced that Lucid Motors deployed its Silicon Carbide power device solutions in its high-performance and pure-electric car, the Lucid Air. They also entered a multi-year agreement to produce and supply SiC devices.

• April 2023: Kyocera Corporation announced the development of a novel capacitor (MLCC) with an EIA 0201 dimension (0.6 mm x 0.3 mm) and the industry's maximum capacitance of 10 microfarads. Kyocera's KGM03 series is claimed to be one of the most extensively utilized MLCCs in smartphones and wearable devices, measuring only 0.6 mm x 0.3 mm. The designers would be able to meet system requirements with fewer components and less space if an MLCC this compact had a higher capacitance.
• February 2023: Samsung Electro-Mechanics (SEMCO) announced that it was planning to increase manufacturing capacity for high-performance automotive multilayer ceramic capacitors (MLCCs), a new engine, in 2023 in order to close the market share gap with key competitors. SEMCO is projected to concentrate its investment in production bases such as Tianjin, China, as demand for critical IT goods such as smartphones decreased due to the recent economic slump. With its extensive experience in developing modern IT MLCCs, it intends to concentrate on producing extremely reliable automotive goods.

• August 2023: SABIC announced the unveiling of new data demonstrating a substantial decrease in internal dissipation losses in its high-heat ELCRES HTV150A dielectric films, which can be used in high-temperature capacitors. In comparison to other high-heat materials such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), it is suggested that ELCRES HTV150A films could reduce dissipation losses by up to 40% when exposed to temperatures of 150°C and frequencies of up to 100kHz.
• June 2023: Röhm signed the sale and purchase agreement to acquire functional forms, the business unit of SABIC that specializes in polycarbonate-based films and sheets. This acquisition of Functional Forms from SABIC enhances Röhm's dominant position in transparent sheets and strengthens its presence in films and transportation. The Functional Forms business unit is known for producing premium polycarbonate films and sheets, which are primarily marketed under the globally recognized LEXAN brand. Such films are primarily used for various operations especially in the manufacturing of plastic capacitors.

• August 2023: Texas Instruments (TI) has announced the introduction of new current sensing solutions, which have been specifically designed to enhance accuracy and integration while also streamlining the overall design process. As part of this release, TI is offering two innovative products: a Hall-effect current sensor, renowned for its remarkably low drift within TI's product range, and new current shunt monitors that incorporate a shunt resistor. 
• March 2023: Vishay Intertechnology, Inc. announced that the Vishay Draloric RCS0805 e3 anti-surge thick film resistor in the 0805 case size has been enhanced with a higher power rating of 0.5 W. This improvement now enables the RCS0805 e3 to replace four standard parallel resistors, offering designers the opportunity to save board space in various industries such as automotive, industrial, telecommunications, and medical applications. 

• September 2023 - GlobalFoundries and Microchip Technology collaborated and announced the release to production of the SST ESF3 third-generation embedded SuperFlash technology NVM solution in the GF 28SLPe foundry process, where customers are finding this combination of high performance, excellent reliability, IP availability and cost-effectiveness to be ideal for advanced MCUs, complex smart cards and IoT chips for consumer and industrial products
• July 2023 - Applied Materials, Inc has announced introduced materials, technologies, and systems that help chipmakers integrate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for heterogeneous integration (HI).

• February 2023 - Deia Inc. announced that Qorvo had licensed Adeia's hybrid bonding technology. This licensing has been provided considering that hybrid bonding technology introduces new opportunities to optimize the architecture of the RF front-end semiconductor devices and modules to enhance the solutions' functionality, performance, and size.
• February 2023 - United Microelectronics Corporation and Cadence Design Systems, Inc. declared that the Cadence 3D-IC reference flow, utilizing the Integrity 3D-IC Platform, has been validated for UMC's chip stacking technologies, facilitating a quicker time to market.

• August 2023 - Winbond Electronics Corporation and Mobiveil recently formed a partnership to develop a cutting-edge IP controller designed for a wide range of applications, including Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless Headsets, Smart Speakers, and Connectivity. In this collaboration, Mobiveil has successfully integrated its HYPERRAM Controller with Winbond's innovative HYPERRAM device, which boasts impressive capabilities such as speeds of up to 250MHz and support for densities ranging from 32 Mb to 512 Mb in x8/x16 modes. This collaboration aims to deliver enhanced performance and functionality to meet the evolving needs of various industries.
• May 2023 - The completion of the industry's most advanced 1bnm, the fifth generation of the 10nm process technology, was announced by SK Hynix Inc. Additionally, a joint evaluation of 1bnm and validation in the Intel Data Center Certified memory program for DDR5 products targeted at Intel Xeon Scalable platforms was initiated by the company and Intel. This development follows SK Hynix's achievement of 1anm readiness and successful completion of Intel's system validation of the 1anm DDR5, the fourth generation of the 10nm technology.