Market Share of Radiation Hardened Electronics Industry
The radiation-hardened electronics market showcases fragmentation with major players like Honeywell International Inc., BAE Systems PLC, Texas Instruments, Data Device Corporation, and Frontgrade Technologies. These entities employ strategies such as partnerships and acquisitions to fortify their product portfolios and establish enduring competitive edges.
In August 2023, Frontgrade Technologies finalized its acquisition of Aethercomm, a company specializing in high-power radio frequency (RF) solid-state power amplifiers, transmit/receive modules, and high-power RF switches. This acquisition positions Frontgrade Technologies to offer a comprehensive, integrated, and turnkey solution tailored for aerospace and defense clientele.
Another notable collaboration occurred in February 2023 between Texas Instruments and Teledyne e2v, focusing on a novel radiation-tolerant DDR4 modular platform. This initiative aims to assist satellite OEMs in optimizing their system development process by reducing time and engineering efforts. The hardware comprises a field-proven 4GB/8GB capacity DDR4T0xG72 DDR4 memory module from Teledyne e2v, complemented by a TI TPS7H3301-SP DDR termination low drop-out (LDO) voltage regulator, ensuring a stable supply for the DDR4 module.
Radiation-Hardened Electronics Market Leaders
Honeywell International Inc.
BAE Systems PLC
Texas Instruments
Data Device Corporation
Frontgrade Technologies
*Disclaimer: Major Players sorted in no particular order
