Market Share of Fan Out Packaging Industry
The market is moderately fragmented, with the presence of numerous players. Some of the major players operating in the global fan-out packaging market include Taiwan Semiconductor Manufacturing Company Limited, Jiangsu Changjiang Electronics Tech Co., Amkor Technology Inc., Samsung Electro-Mechanics, and Powertech Technology Inc., among others. These players indulge in product innovation, mergers, and acquisitions, among other developments, in order to increase market share.
- November 2021 - Amkor Technology, Inc., a semiconductor packing and test service supplier, stated that it intends to construct an intelligent factory in Bac Ninh, Vietnam. The proposed factory's initial phase will concentrate on offering Advanced System in Package (SiP) assembling and testing services to the world's premier semiconductor and electronics manufacturing businesses.
- February 2021 - Samsung Foundry has filed documents with authorities in Arizona, New York, and Texas seeking to build a leading-edge semiconductor manufacturing facility in the USA. The potential fab near Austin, Texas, is expected to cost over USD 17 billion and create 1,800 jobs. It is expected to go online by the fourth quarter of 2023.
Fan Out Packaging Market Leaders
Taiwan Semiconductor Manufacturing Company Limited
Jiangsu Changjiang Electronics Tech Co.
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
*Disclaimer: Major Players sorted in no particular order
